High-sensitive MIS structures with silicon nanocrystals grown via solid-state dewetting of silicon-on-insulator for solar cell and photodetector applications

This work reports an original method for the fabrication of Metal-Isulator-Semiconductor (MIS) structures with silicon nanocrystals (Si NCs) based active layers embedded in the insulating SiO 2 oxide, for high performance solar cell and photodetector applications. The Si NCs are produced via the in situ solid-state dewetting of ultra-pure amorphous silicon-oninsulator (a-SOI) grown by solid source molecular beam epitaxy (SSMBE). The size and density of Si NCs are precisely tuned by varying the deposited thickness of silicon. The morphological characterization carried out by using atomic force microscopy (AFM) and scanning electron microscopy (SEM) shows that the Si NCs have homogeneous size with welldefined spherical shape and densities up to ~10 12 /cm 2 (inversely proportional to the square of nominal a-Si thickness). The structural investigations by high resolution transmission electron microscopy (HR-TEM) show that the ultra-small Si NCs (with mean diameter ~7 nm) are monocrystalline and free of structural defects. The electrical measurements performed by current versus voltage (I-V) and photocurrent spectroscopies on the Si-NCs based MIS structures prove the efficiency of Si NCs to enhance the electrical conduction in MIS structures and to increase (x10 times) the photocurrent (i.e. at bias voltage V =-1 V) via the photogeneration of additional electron-hole pairs in the MIS structures. These results evidence that the Si NCs obtained by the combination of MBE growth and solid-state dewetting are perfectly suitable for the development of novel high performance optoelectronic devices compatible with the CMOS technology

Deep level assessment of n-type Si/SiO2 metal-oxide-semiconductor capacitors with embedded Ge quantum dots

This paper reports on a Deep-Level Transient Spectroscopy (DLTS) study of n-type silicon Metal-Oxide-Semiconductor capacitors with Ge Quantum Dots (QDs) embedded in a SiO2 gate dielectric. For a zero-dot reference and in capacitors fabricated with a 1,2 or 3 nm amorphous Ge layer similar spectra have been obtained. They are characterized by a peak at or above room temperature for a bias pulse in depletion and by an electron trap around 200 K, which is shown to be associated with dangling bond acceptor states at the Si/SiO2 interface. The maximum density of states increases with average Ge QD size, while the average activation energy, corresponding with the peak maximum position shifts to lower values. Although no direct evidence of electron tunneling to the Ge QDs has been found so far, there is a marked impact of their presence on the Capacitance-Voltage characteristics, resulting in an increase in the accumulation capacitance with QD size, a shift of the flatband voltage toward more positive gate bias and a counterclockwise hysteresis, associated with the charging and discharging of QD levels and related Ge traps in the SiO2

High-sensitive MIS structures with silicon nanocrystals grown via solid-state dewetting of silicon-on-insulator for solar cell and photodetector applications

International audienceThis work reports an original method for the fabrication of Metal-Isulator-Semiconductor (MIS) structures with silicon nanocrystals (Si NCs) based active layers embedded in the insulating SiO 2 oxide, for high performance solar cell and photodetector applications. The Si NCs are produced via the in situ solid-state dewetting of ultra-pure amorphous silicon-oninsulator (a-SOI) grown by solid source molecular beam epitaxy (SSMBE). The size and density of Si NCs are precisely tuned by varying the deposited thickness of silicon. The morphological characterization carried out by using atomic force microscopy (AFM) and scanning electron microscopy (SEM) shows that the Si NCs have homogeneous size with welldefined spherical shape and densities up to ~10 12 /cm 2 (inversely proportional to the square of nominal a-Si thickness). The structural investigations by high resolution transmission electron microscopy (HR-TEM) show that the ultra-small Si NCs (with mean diameter ~7 nm) are monocrystalline and free of structural defects. The electrical measurements performed by current versus voltage (I-V) and photocurrent spectroscopies on the Si-NCs based MIS structures prove the efficiency of Si NCs to enhance the electrical conduction in MIS structures and to increase (x10 times) the photocurrent (i.e. at bias voltage V =-1 V) via the photogeneration of additional electron-hole pairs in the MIS structures. These results evidence that the Si NCs obtained by the combination of MBE growth and solid-state dewetting are perfectly suitable for the development of novel high performance optoelectronic devices compatible with the CMOS technology

The kinetics of dewetting ultra-thin Si layers from silicon dioxide

International audienceIn this study, we investigate the kinetically driven dewetting of ultra-thin silicon films on silicon oxide substrate under ultra-high vacuum, at temperatures where oxide desorption and silicon lost could be ruled out. We show that in ultra-clean experimental conditions, the three different regimes of dewetting, namely (i) nucleation of holes, (ii) film retraction and (iii) coalescence of holes, can be quantitatively measured as a function of temperature, time and thickness. For a nominal flat clean sample these three regimes co-exist during the film retraction until complete dewetting. To discriminate their roles in the kinetics of dewetting, we have compared the dewetting evolution of flat unpatterned crystalline silicon layers (homogeneous dewetting), patterned crystalline silicon layers (heterogeneous dewetting) and amorphous silicon layers (crystallization-induced dewetting). The first regime (nucleation) is described by a breaking time which follows an exponential evolution with temperature with an activation energy EH ∼ 3.2 eV. The second regime (retraction) is controlled by surface diffusion of matter from the edges of the holes. It involves a very fast redistribution of matter onto the flat Si layer, which prevents the formation of a rim on the edges of the holes during both heterogeneous and homogeneous dewetting. The time evolution of the linear dewetting front measured during heterogeneous dewetting follows a characteristic power law x ∼ t0.45 consistent with a surface diffusion-limited mechanism. It also evolves as x ∼ h−1 as expected from mass conservation in the absence of thickened rim. When the surface energy is isotropic (during dewetting of amorphous Si) the dynamics of dewetting is considerably modified: firstly, there is no measurable breaking time; secondly, the speed of dewetting is two orders of magnitude larger than for crystalline Si; and thirdly, the activation energy of dewetting is much smaller due to the different driving force, which is based on the crystallization and redistribution of matter around the crystalline nuclei. The third regime (coalescence) corresponds to the merging of the dewetted fronts and of the islands positioned along the edges of the holes. The dynamics of this regime is much slower since it requires overcoming an additional nucleation barrier, while the surface energy reduction is quite low (low decrease of the covered surface area)

Fabrication of MIS photodetector with Ge nanocrystals grown by MBE

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Engineered core-shell Si1−xGex/Ge nanowires fabricated by focused ion beam and oxido-reduction

International audienceWe demonstrate that perfectly reproducible and homogeneous core-shell Si1−xGex/Ge nanowires can be produced by a two step nanofabrication process. The process makes use of a combination of Liquid Metal Alloy Ion Source–Focused Ion Beam (LMAIS-FIB) nanomilling and condensation. In a first step, we fabricate arrays of SiGe wires by LMAIS-FIB milling of fully relaxed Si1−xGex pseudo-substrates. The use of Ge2+ ions during this step avoids any metallic contamination of the nanowires. In a second step, we both reduce the diameter of the wires and form the core-shell configuration by oxido-reduction of the wires. Large arrays of core-shell nanowires with extended aspect ratio (length over diameter), small diameters and ultra-thin shell thickness are fabricated. Multilayer core-shell configurations with tunable arrangements could also be produced by repeated condensation cycles

Low-temperature solid phase epitaxy for integrating advanced source/drain metal-oxide-semiconductor structures

International audienceWe show that chemical vapor deposition using trisilane decomposition opens capabilities for the deposition of amorphous silicon on Si substrate at low temperature. Based on this behavior we developed a process including amorphous silicon deposition and crystallization. Transmission electron microscopy observations prove that solid phase epitaxy (SPE) occurs and produces monocrystalline layers, free of extended defects and compatible with complementary metal-oxide-semiconductor technology. We also show that during SPE films remain amorphous on oxidized areas while they transform into single crystal on Si. This process opens promising perspectives for the fabrication of advanced MOS structures

TEM and XRD characterizations of epitaxial silicon layer fabricated on double layer porous silicon

International audienceSingle crystal Silicon (Si) layers have been deposited by molecular beam epitaxy on double-layer porous silicon (PSi). We show that a top thin layer with a low porosity is used as a seed layer for epitaxial growth. While, the underlying higher porosity layer is used as an easily detectable etch stop layer. The morphology and structure of epitaxial Si layer grown on the double-layer PSi are investigated by high resolution X-ray diffraction and transmission electron microscopy. The results show that, an epitaxial Si layer with a low defect density can be grown. Epitaxial growth of thin crystalline layers on double-layer PSi can provide opportunities for silicon-on-insulator applications and Si-based solar cells provided that the epitaxial layer has a sufficient crystallographic quality

FTIR and AFM studies of the Ge on Porous Silicon/Si substrate hetero-structure obtained by molecular beam epitaxy

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Mn-doped Ge self-assembled quantum dots via dewetting of thin films

In this study, we demonstrate an original elaboration route for producing a Mn-doped Ge self-assembled quantum dots on SiO2 thin layer for MOS structure. These magnetic quantum dots are elaborated using dewetting phenomenon at solid state by Ultra-High Vacuum (UHV) annealing at high temperature of an amorphous Ge:Mn (Mn: 40%) nanolayer deposed at very low temperature by high-precision Solid Source Molecular Beam Epitaxy on SiO2 thin film. The size of quantum dots is controlled with nanometer scale precision by varying the nominal thickness of amorphous film initially deposed. The magnetic properties of the quantum-dots layer have been investigated by superconducting quantum interference device (SQUID) magnetometry. Atomic force microscopy (AFM), x-ray energy dispersive spectroscopy (XEDS) and transmission electron microscopy (TEM) were used to examine the nanostructure of these materials. Obtained results indicate that GeMn QDs are crystalline, monodisperse and exhibit a ferromagnetic behavior with a Curie temperature (TC) above room temperature. They could be integrated into spintronic technology. © 2016 Elsevier B.V.1