Effect of TiO2 Nanoparticles on the Horizontal Hardness Properties of Sn-3.0Ag-0.5Cu-1.0TiO2 Composite Solder

The improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt. % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt. % TiO2 nanoparticles improved the hardness values up to 26.2 % than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples

Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate

This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag-0.5Cu (SAC305) ternary Pb-free solder alloy. Adding Bi to SAC305 decreased the contact angles (θ) of the Sn-2.0Ag-0.5Cu-1.0Bi (SAC-1Bi) quaternary Pb-free solder alloy, which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in argon (Ar) atmosphere. Microstructures, inter-metallic phases and melting temperatures were analyzed by optical microscope, scanning electron microscopy, X-ray diffraction, and differential scanning calorimetry, and effects of the amount of Bi on microstructure were investigated. The experimental results exhibited that when the addition of Bi was 1 wt%, changing in melting temperature of SAC-1Bi solder was insignificant, but the wetting angles (θ) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest θ was obtained as 35.6° for SAC-1Bi alloy at 310 °C. Keywords: Wettability, Contact angle, Pb-free solder allo

National guidelines on the management of venous thromboembolism: Joint guideline of the Turkish Society of Cardiovascular Surgery, National Society of Vascular and Endovascular Surgery, and Phlebology Society

These evidence-based guidelines from the Turkish Society of Cardiovascular Surgery, National Society of Vascular and Endovascular Surgery, and Phlebology Society intend to support clinicians in best decisions regarding the treatment of venous thromboembolism (VTE). The Editor was selected by the three national societies and was tasked with the recruitment of the recognized panel. All financial support was solely derived from the sponsoring societies without the direct involvement of industry or other external stakeholders. The panel prioritized clinical questions and outcomes according to their importance for clinicians in terms of VTE. The panel agreed on 42 recommendations under 15 headings for the diagnosis, initial management, secondary prevention of VTE, and treatment of recurrent VTE events. Important recommendations included the use of ultrasonography, preference for home treatment over hospital treatment for uncomplicated VTE, preference for direct oral anticoagulants (DOACs) over vitamin K antagonists for primary treatment of cancer and non-cancer-related VTE, extended or indefinite anticoagulation with DOACs in selected high-risk patients. Early catheter-directed thrombectomy was recommended in only young symptomatic patients with a diagnosis of fresh iliofemoral deep vein thrombosis