Foundations of physical vapor deposition with plasma assistance

Physical vapor deposition (PVD) refers to the removal of atoms from a solid or a liquid by physical means, followed by deposition of those atoms on a nearby surface to form a thin film or coating. Various approaches and techniques are applied to release the atoms including thermal evaporation, electron beam evaporation, ion-driven sputtering, laser ablation, and cathodic arc-based emission. Some of the approaches are based on a plasma discharge, while in other cases the atoms composing the vapor are ionized either due to the release of the film-forming species or they are ionized intentionally afterward. Here, a brief overview of the various PVD techniques is given, while the emphasis is on sputtering, which is dominated by magnetron sputtering, the most widely used technique for deposition of both metallic and compound thin films. The advantages and drawbacks of the various techniques are discussed and compared

Thermal conductivity of amorphous carbon thin films

Thermal conductivities $\Lambda$ of amorphous carbon thin films are measured in the temperatures range 80--400 K using the $3\omega$ method. Sample films range from soft a-C:H prepared by remote-plasma deposition ($\Lambda = 0.20$ W m$^{-1}$ K$^{-1}$ at room temperature) to amorphous diamond with a large fraction of $sp^3$ bonded carbon deposited from a filtered-arc source ($\Lambda = 2.2$ W m$^{-1}$ K$^{-1}$). Effective-medium theory provides a phenomenological description of the variation of conductivity with mass density. The thermal conductivities are in good agreement with the minimum thermal conductivity calculated from the measured atomic density and longitudinal speed of sound.Comment: 4 pages, 4 figure