Valorization of Moroccan olive stones by using it in particleboard panels

The main objective of this work was to find new applications to valorize olive stones (endocarp and seed). In order to improve knowledge on olive stones, the phenolic compounds concentration of three varieties of Moroccan olive trees: Moroccan Picholine, Menara and Haouzian were studied. Olive stones of three varieties were characterized by Fourier Transform Mid Infrared Spectroscopy (FT-MIR). Total phenolic compounds are quantified after solid-liquid extraction by an assay of Folin-Ciocalteu. Moroccan Picholine stones (11.32 mg GAE/g DM) have a higher content of total phenolic compounds than Haouzia stones (4.55 mg GAE/g DM) and Menara stones (3.56 mg GAE/g DM). Thermogravimetric analysis indicates that up to 195 degrees C; there is no degradation of the stones. The biocide performance on agar-agar was tested with decay fungi. Biodegradation studies show that the most interesting results are obtained with Moroccan Picholine stones. The presence of Moroccan Picholine in a particleboard panels improves the total resistance of the particleboard panels against both Coriolus versicolor and Coniophora puteana rot fungi

Valorization of moroccan olive stones by using it in particleboard panels

The main objective of this work was to find new applications to valorize olive stones (endocarp and seed). In order to improve knowledge on olive stones, the phenolic compounds concentration of three varieties of Moroccan olive trees: Moroccan Picholine, Menara and Haouzian were studied. Olive stones of three varieties were characterized by Fourier Transform Mid Infrared Spectroscopy (FT-MIR). Total phenolic compounds are quantifi ed aft er solid-liquid extraction by an assay of Folin-Ciocalteu. Moroccan Picholine stones (11.32 mg GAE/g DM) have a higher content of total phenolic compounds than Haouzia stones (4.55 mg GAE/g DM) and Menara stones (3.56 mg GAE/g DM). Thermogravimetric analysis indicates that up to 195°C; there is no degradation of the stones. The biocide performance on agar-agar was tested with decay fungi. Biodegradation studies show that the most interesting results are obtained with Moroccan Picholine stones. The presence of Moroccan Picholine in a particleboard panels improves the total resistance of the particleboard panels against both Coriolus versicolor and Coniophora puteana rot fungi

Preparation and Evaluation of Rice Bran-Modified Urea Formaldehyde as Environmental Friendly Wood Adhesive

In this study, defatted rice bran (RB) is used to prepare an environmentally friendly adhesive through chemical modifications. The RB is mixed with distilled water with ratios of 1:5 and 1:4 to prepare Type A and Type B adhesives, respectively having pH of 6, 8 and 10. Type A adhesive is prepared by treating RB with 1% potassium permanganate and 4% poly(vinyl alcohol), whereas Type B is formulated by adding 17.3% formaldehyde and 5.7% urea to RB. Viscosity, gel time, solid content, shear strength, Fourier transform infrared (FTIR) spectroscopy is carried out, and glass transition temperature (T-g), and activation energy (E-a) are determined to evaluate the performance of the adhesives. E-a data reveal that adhesives prepared at mild alkaline (pH 8) form long-chain polymers. Gel time is higher in the fabricated adhesives than that of the commercial urea formaldehyde (UF). FTIR data suggest that functional groups of the raw RB are chemically modified, which enhances the bondability of the adhesives. Shear strength data indicates that bonding strength increases with increasing pH. Similar results are also observed for physical and mechanical properties of fabricated particleboards with the adhesives. The results demonstrate that RB-based adhesives can be used as a potential alternative to currently used UF-based resin

Improving Hot-Water Resistance of Melamine-Urea-Formaldehyde by Addition of PolyFox PF-151N Polymer

International audienceMelamine urea formaldehyde (MUF) thermosetting wood adhesives have poor performance at elevated temperatures and humid conditions. PolyFox PF-151N polymer was mixed at different loadings (0.05, 0.1, 0.5, and 1%) with MUF to improve properties, especially water resistance and bond strength. The physical properties of the optimized MUF/PolyFox PF-151N resins were measured. In order to evaluate the quality of optimized MUF/PolyFox PF-151N resins, particleboards were produced and physical and mechanical properties were investigated. The results show that it is possible to add PolyFox PF-151N up to 0.1% to the MUF resin without altering the mechanical properties of the commercial MUF. The mechanical properties of the particleboard panels bonded with the optimal MUF/PolyFox PF-151N (99.9/0.1 by weight) resin were considerably increased as compared to the panels glued with neat MUF resin. The use of PolyFox significantly reduced 2-h and 24-h thickness swelling compared to the control panels

Cornstarch and tannin in phenol-formaldehyde resins for plywood production

cited By 59International audienceThe aim of this work is to demonstrate the performances of cornstarch-quebracho tannin-based resins designed as adhesive in the plywood production. In this way, the cornstarch and quebracho tannin was introduced in the classic adhesive formulation in order to supply a part of phenol-formaldehyde (PF). The physical properties (rheological characterization, thermogravimetric analysis and solid phase 13C NMR analysis) of the formulated resins were measured. In order to evaluate the mechanical performances of optimal cornstarch-quebracho tannin-based resins, plywood panels were produced and mechanical properties were investigated. These mechanical properties included tensile strength, wood failure and 3-point bending strength. The performance of these panels is comparable to those of plywood panels commercial PF made. The results showed that plywood panels bonded with cornstarch-quebracho tannin-PF resins (15:5:80, w/w/w) exhibited better mechanical properties than plywood panels commercial PF made. The introduction of small proportions of cornstarch and quebracho tannin in PF resins contributes to the improvement of the boiling water performance of these adhesives. The formaldehyde emission levels obtained from panels bonded with cornstarch-quebracho tannin-PF were lower to those obtained from panels bonded with control PF. Solid state CPMAS NMR spectra indicates that no reaction at all between PF resins and cornstarch and quebracho tannin. Even when reaction does evidently not occur, the addition of cornstarch and quebracho tannin improves markedly the water resistance of PF resins. © 2009 Elsevier B.V

Corn flour-mimosa tannin-based adhesives without formaldehyde for interior particleboard production

International audienceA formaldehyde-free adhesive consisting of a corn flour/NaOH adhesive mixture and a mimosa tannin/hexamine intermediate component was developed and evaluated for application to wood panels such as particleboards. The main ingredients of this adhesive include corn flour, NaOH, mimosa tannin and hexamine. This study investigated the physical properties (rheological and thermal analysis) of corn flour/NaOH and mimosa tannin/hexamine adhesives as well as mechanical properties of particleboards produced with these adhesives. Thermomechanical (TMA) experiments indicate the best performance of the adhesives to be around the relative mass proportions of 50:50 between corn flour/NaOH and mimosa tannin/hexamine. Former NMR measurements on corn starch and mimosa tannin proved that the two components behave as a polymer blend rather than co-reacting. The laboratory results show that particleboards bonded with the adhesive at this optimal ratio show good mechanical properties. Moreover, the formaldehyde emission levels obtained from boards bonded with the optimal adhesive were considerably lower to those obtained from boards made with control urea formaldehyde. © 2013 Springer-Verlag Berlin Heidelberg

Cornstarch-mimosa tannin-urea formaldehyde resins as adhesives in the particleboard production

cited By 16International audienceThe objective of this work was to demonstrate the utilisation of cornstarch-mimosa tannin-based resins designed for application as an adhesive in particleboard production. Bond qualities of cornstarch-mimosa tannin-urea formaldehyde (UF) resins and commercial UF resin were assessed by using an automatic bonding evaluation system, prior to production of particleboards panels. In order to evaluate the quality of cornstarch-mimosa tannin-UF resins, particleboards were produced and physical and mechanical properties were investigated. These physical properties included rheological, thermogravimetric analysis and solid phase 13C NMR analysis of resins. Internal bond, surface soundness, thickness swelling, porosity, modulus of rupture and modulus of elasticity mechanical properties of particleboards bonded with cornstarch-mimosa tannin-UF resins were also determined. The results showed that it is possible to add cornstarch and mimosa tannin, respectively, up to 10 and 4% to the UF resin without to alter the physical and mechanical properties of the boards. The performance of these panels is comparable to those of boards made using commercial UF resin. Petrochemical UF resins could be partially substituted in industrial applications by addition of cornstarch and mimosa tannin extracts. © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

Evaluation of mechanical and physical properties of industrial particleboard bonded with a corn flour-urea formaldehyde adhesive

International audienceThe aim of this study was to determine the effect of corn flour content of urea formaldehyde (UF) resin on the panel properties of particleboard. Corn flour was added to UF resin to decrease the free formaldehyde content of particleboard panels. Some physical (thickness swelling and rheological characterization), mechanical (modulus of elasticity, modulus of rupture, internal bond strength and withdrawal of screws) properties and formaldehyde emission of particleboards were evaluated. The results showed that the introduction of small proportions of corn flour (7%, by weight) in UF resins contributes to the improvement of mechanical and physical properties of the boards and reduced their formaldehyde emissions. Hazardous petrochemical UF could be partially substituted in industrial applications by addition of corn flour. To our knowledge, this is the first study on this kind of wood adhesives. © 2012 Published by Elsevier Ltd