51 research outputs found

    Exploration and Design of Power-Efficient Networked Many-Core Systems

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    Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

    An efficient 2D router architecture for extending the performance of inhomogeneous 3D NoC-based multi-core architectures

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    To meet the performance and scalability demands of the fast-paced technological growth towards exascale and Big-Data processing with the performance bottleneck of conventional metal based interconnects, alternative interconnect fabrics such as inhomogeneous three dimensional integrated Network-on-Chip (3D NoC) has emanated as a cost-effective solution for emerging multi-core design. However, these interconnects trade-off optimized performance for cost by restricting the number of area and power hungry 3D routers. Consequently, in this paper, we propose a low-latency adaptive router with a low-complexity single-cycle bypassing mechanism to alleviate the performance degradation due to the slow 2D routers in inhomogeneous 3D NoCs. By combining the low-complexity bypassing technique with adaptive routing, the proposed router is able to balance the traffic in the network to reduce the average packet latency under various traffic loads. Simulation shows that, the proposed router can reduce the average packet delay by an average of 45% in 3D NoCs

    Design Space Exploration for MPSoC Architectures

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    Multiprocessor system-on-chip (MPSoC) designs utilize the available technology and communication architectures to meet the requirements of the upcoming applications. In MPSoC, the communication platform is both the key enabler, as well as the key differentiator for realizing efficient MPSoCs. It provides product differentiation to meet a diverse, multi-dimensional set of design constraints, including performance, power, energy, reconfigurability, scalability, cost, reliability and time-to-market. The communication resources of a single interconnection platform cannot be fully utilized by all kind of applications, such as the availability of higher communication bandwidth for computation but not data intensive applications is often unfeasible in the practical implementation. This thesis aims to perform the architecture-level design space exploration towards efficient and scalable resource utilization for MPSoC communication architecture. In order to meet the performance requirements within the design constraints, careful selection of MPSoC communication platform, resource aware partitioning and mapping of the application play important role. To enhance the utilization of communication resources, variety of techniques such as resource sharing, multicast to avoid re-transmission of identical data, and adaptive routing can be used. For implementation, these techniques should be customized according to the platform architecture. To address the resource utilization of MPSoC communication platforms, variety of architectures with different design parameters and performance levels, namely Segmented bus (SegBus), Network-on-Chip (NoC) and Three-Dimensional NoC (3D-NoC), are selected. Average packet latency and power consumption are the evaluation parameters for the proposed techniques. In conventional computing architectures, fault on a component makes the connected fault-free components inoperative. Resource sharing approach can utilize the fault-free components to retain the system performance by reducing the impact of faults. Design space exploration also guides to narrow down the selection of MPSoC architecture, which can meet the performance requirements with design constraints.Siirretty Doriast

    Network-on-Chip

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    Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

    A survey on scheduling and mapping techniques in 3D Network-on-chip

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    Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

    Floorplan-Aware High Performance NoC Design

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    Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables. En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip. Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red. En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci

    Energy and performance-aware application mapping for inhomogeneous 3D networks-on-chip

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    Three dimensional Networks-on-Chip (3D NoCs) have evolved as an ideal solution to the communication demands and complexity of future high density many core architectures. However, the design practicality of 3D NoCs faces several challenges such as thermal issues, high power consumption and area overhead of 3D routers as well as high complexity and cost of vertical link implementation. To mitigate the performance and manufacturing cost of 3D NoCs, inhomogeneous architectures have emerged to combine 2D and 3D routers in 3D NoCs producing lower area and energy consumption while maintaining the performance of homogeneous 3D NoCs. Due to the limited number of vertical links, application mapping on inhomogeneous 3D NoCs can be complex. However, application mapping has a great impact on the performance and energy consumption of NoCs. This paper presents an energy and performance aware application mapping algorithm for inhomogeneous 3D NoCs. The algorithm has been evaluated with various realistic traffic patterns and compared with existing mapping algorithms. Experimental results show NoCs mapped with the proposed algorithm have lower energy consumption and significant reduction in packet delays compared to the existing algorithms and comparable average packet latency with Branch-and-Bound

    Cost Effective Routing Implementations for On-chip Networks

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    Arquitecturas de múltiples núcleos como multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) actuales se basan en la eficacia de las redes dentro del chip (NoC) para la comunicación entre los diversos núcleos. Un diseño eficiente de red dentro del chip debe ser escalable y al mismo tiempo obtener valores ajustados de área, latencia y consumo de energía. Para diseños de red dentro del chip de propósito general se suele usar topologías de malla 2D ya que se ajustan a la distribución del chip. Sin embargo, la aparición de nuevos retos debe ser abordada por los diseñadores. Una mayor probabilidad de defectos de fabricación, la necesidad de un uso optimizado de los recursos para aumentar el paralelismo a nivel de aplicación o la necesidad de técnicas eficaces de ahorro de energía, puede ocasionar patrones de irregularidad en las topologías. Además, el soporte para comunicación colectiva es una característica buscada para abordar con eficacia las necesidades de comunicación de los protocolos de coherencia de caché. En estas condiciones, un encaminamiento eficiente de los mensajes se convierte en un reto a superar. El objetivo de esta tesis es establecer las bases de una nueva arquitectura para encaminamiento distribuido basado en lógica que es capaz de adaptarse a cualquier topología irregular derivada de una estructura de malla 2D, proporcionando así una cobertura total para cualquier caso resultado de soportar los retos mencionados anteriormente. Para conseguirlo, en primer lugar, se parte desde una base, para luego analizar una evolución de varios mecanismos, y finalmente llegar a una implementación, que abarca varios módulos para alcanzar el objetivo mencionado anteriormente. De hecho, esta última implementación tiene por nombre eLBDR (effective Logic-Based Distributed Routing). Este trabajo cubre desde el primer mecanismo, LBDR, hasta el resto de mecanismos que han surgido progresivamente.Rodrigo Mocholí, S. (2010). Cost Effective Routing Implementations for On-chip Networks [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/8962Palanci
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