TEEM: Online Thermal- and Energy-Efficiency Management on CPU-GPU MPSoCs

Heterogeneous Multiprocessor System-on-Chip (MPSoC) are progressively becoming predominant in most modern mobile devices. These devices are required to perform processing of applications within thermal, energy and performance constraints. However, most stock power and thermal management mechanisms either neglect some of these constraints or rely on frequency scaling to achieve energy-efficiency and temperature reduction on the device. Although this inefficient technique can reduce temporal thermal gradient, but at the same time hurts the performance of the executing task. In this paper, we propose a thermal and energy management mechanism which achieves reduction in thermal gradient as well as energy-efficiency through resource mapping and thread-partitioning of applications with online optimization in heterogeneous MPSoCs. The efficacy of the proposed approach is experimentally appraised using different applications from Polybench benchmark suite on Odroid-XU4 developmental platform. Results show 28% performance improvement, 28.32% energy saving and reduced thermal variance of over 76% when compared to the existing approaches. Additionally, the method is able to free more than 90% in memory storage on the MPSoC, which would have been previously utilized to store several task-to-thread mapping configurations

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

Lifetime reliability of multi-core systems: modeling and applications.

Huang, Lin.Thesis (M.Phil.)--Chinese University of Hong Kong, 2011.Includes bibliographical references (leaves 218-232).Abstracts in English and Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Preface --- p.1Chapter 1.2 --- Background --- p.5Chapter 1.3 --- Contributions --- p.6Chapter 1.3.1 --- Lifetime Reliability Modeling --- p.6Chapter 1.3.2 --- Simulation Framework --- p.7Chapter 1.3.3 --- Applications --- p.9Chapter 1.4 --- Thesis Outline --- p.10Chapter I --- Modeling --- p.12Chapter 2 --- Lifetime Reliability Modeling --- p.13Chapter 2.1 --- Notation --- p.13Chapter 2.2 --- Assumption --- p.16Chapter 2.3 --- Introduction --- p.16Chapter 2.4 --- Related Work --- p.19Chapter 2.5 --- System Model --- p.21Chapter 2.5.1 --- Reliability of A Surviving Component --- p.22Chapter 2.5.2 --- Reliability of a Hybrid k-out-of-n:G System --- p.26Chapter 2.6 --- Special Cases --- p.31Chapter 2.6.1 --- Case I: Gracefully Degrading System --- p.31Chapter 2.6.2 --- Case II: Standby Redundant System --- p.33Chapter 2.6.3 --- Case III: l-out-of-3:G System with --- p.34Chapter 2.7 --- Numerical Results --- p.37Chapter 2.7.1 --- Experimental Setup --- p.37Chapter 2.7.2 --- Experimental Results and Discussion --- p.40Chapter 2.8 --- Conclusion --- p.43Chapter 2.9 --- Appendix --- p.44Chapter II --- Simulation Framework --- p.47Chapter 3 --- AgeSim: A Simulation Framework --- p.48Chapter 3.1 --- Introduction --- p.48Chapter 3.2 --- Preliminaries and Motivation --- p.51Chapter 3.2.1 --- Prior Work on Lifetime Reliability Analysis of Processor- Based Systems --- p.51Chapter 3.2.2 --- Motivation of This Work --- p.53Chapter 3.3 --- The Proposed Framework --- p.54Chapter 3.4 --- Aging Rate Calculation --- p.57Chapter 3.4.1 --- Lifetime Reliability Calculation --- p.58Chapter 3.4.2 --- Aging Rate Extraction --- p.60Chapter 3.4.3 --- Discussion on Representative Workload --- p.63Chapter 3.4.4 --- Numerical Validation --- p.65Chapter 3.4.5 --- Miscellaneous --- p.66Chapter 3.5 --- Lifetime Reliability Model for MPSoCs with Redundancy --- p.68Chapter 3.6 --- Case Studies --- p.70Chapter 3.6.1 --- Dynamic Voltage and Frequency Scaling --- p.71Chapter 3.6.2 --- Burst Task Arrival --- p.75Chapter 3.6.3 --- Task Allocation on Multi-Core Processors --- p.77Chapter 3.6.4 --- Timeout Policy on Multi-Core Processors with Gracefully Degrading Redundancy --- p.78Chapter 3.7 --- Conclusion --- p.79Chapter 4 --- Evaluating Redundancy Schemes --- p.83Chapter 4.1 --- Introduction --- p.83Chapter 4.2 --- Preliminaries and Motivation --- p.85Chapter 4.2.1 --- Failure Mechanisms --- p.85Chapter 4.2.2 --- Related Work and Motivation --- p.86Chapter 4.3 --- Proposed Analytical Model for the Lifetime Reliability of Proces- sor Cores --- p.88Chapter 4.3.1 --- "Impact of Temperature, Voltage, and Frequency" --- p.88Chapter 4.3.2 --- Impact of Workloads --- p.92Chapter 4.4 --- Lifetime Reliability Analysis for Multi-core Processors with Vari- ous Redundancy Schemes --- p.95Chapter 4.4.1 --- Gracefully Degrading System (GDS) --- p.95Chapter 4.4.2 --- Processor Rotation System (PRS) --- p.97Chapter 4.4.3 --- Standby Redundant System (SRS) --- p.98Chapter 4.4.4 --- Extension to Heterogeneous System --- p.99Chapter 4.5 --- Experimental Methodology --- p.101Chapter 4.5.1 --- Workload Description --- p.102Chapter 4.5.2 --- Temperature Distribution Extraction --- p.102Chapter 4.5.3 --- Reliability Factors --- p.103Chapter 4.6 --- Results and Discussions --- p.103Chapter 4.6.1 --- Wear-out Rate Computation --- p.103Chapter 4.6.2 --- Comparison on Lifetime Reliability --- p.105Chapter 4.6.3 --- Comparison on Performance --- p.110Chapter 4.6.4 --- Comparison on Expected Computation Amount --- p.112Chapter 4.7 --- Conclusion --- p.118Chapter III --- Applications --- p.119Chapter 5 --- Task Allocation and Scheduling for MPSoCs --- p.120Chapter 5.1 --- Introduction --- p.120Chapter 5.2 --- Prior Work and Motivation --- p.122Chapter 5.2.1 --- IC Lifetime Reliability --- p.122Chapter 5.2.2 --- Task Allocation and Scheduling for MPSoC Designs --- p.124Chapter 5.3 --- Proposed Task Allocation and Scheduling Strategy --- p.126Chapter 5.3.1 --- Problem Definition --- p.126Chapter 5.3.2 --- Solution Representation --- p.128Chapter 5.3.3 --- Cost Function --- p.129Chapter 5.3.4 --- Simulated Annealing Process --- p.130Chapter 5.4 --- Lifetime Reliability Computation for MPSoC Embedded Systems --- p.133Chapter 5.5 --- Efficient MPSoC Lifetime Approximation --- p.138Chapter 5.5.1 --- Speedup Technique I - Multiple Periods --- p.139Chapter 5.5.2 --- Speedup Technique II - Steady Temperature --- p.139Chapter 5.5.3 --- Speedup Technique III - Temperature Pre- calculation --- p.140Chapter 5.5.4 --- Speedup Technique IV - Time Slot Quantity Control --- p.144Chapter 5.6 --- Experimental Results --- p.144Chapter 5.6.1 --- Experimental Setup --- p.144Chapter 5.6.2 --- Results and Discussion --- p.146Chapter 5.7 --- Conclusion and Future Work --- p.152Chapter 6 --- Energy-Efficient Task Allocation and Scheduling --- p.154Chapter 6.1 --- Introduction --- p.154Chapter 6.2 --- Preliminaries and Problem Formulation --- p.157Chapter 6.2.1 --- Related Work --- p.157Chapter 6.2.2 --- Problem Formulation --- p.159Chapter 6.3 --- Analytical Models --- p.160Chapter 6.3.1 --- Performance and Energy Models for DVS-Enabled Pro- cessors --- p.160Chapter 6.3.2 --- Lifetime Reliability Model --- p.163Chapter 6.4 --- Proposed Algorithm for Single-Mode Embedded Systems --- p.165Chapter 6.4.1 --- Task Allocation and Scheduling --- p.165Chapter 6.4.2 --- Voltage Assignment for DVS-Enabled Processors --- p.168Chapter 6.5 --- Proposed Algorithm for Multi-Mode Embedded Systems --- p.169Chapter 6.5.1 --- Feasible Solution Set --- p.169Chapter 6.5.2 --- Searching Procedure for a Single Mode --- p.171Chapter 6.5.3 --- Feasible Solution Set Identification --- p.171Chapter 6.5.4 --- Multi-Mode Combination --- p.177Chapter 6.6 --- Experimental Results --- p.178Chapter 6.6.1 --- Experimental Setup --- p.178Chapter 6.6.2 --- Case Study --- p.180Chapter 6.6.3 --- Sensitivity Analysis --- p.181Chapter 6.6.4 --- Extensive Results --- p.183Chapter 6.7 --- Conclusion --- p.185Chapter 7 --- Customer-Aware Task Allocation and Scheduling --- p.186Chapter 7.1 --- Introduction --- p.186Chapter 7.2 --- Prior Work and Problem Formulation --- p.188Chapter 7.2.1 --- Related Work and Motivation --- p.188Chapter 7.2.2 --- Problem Formulation --- p.191Chapter 7.3 --- Proposed Design-Stage Task Allocation and Scheduling --- p.192Chapter 7.3.1 --- Solution Representation and Moves --- p.193Chapter 7.3.2 --- Cost Function --- p.196Chapter 7.3.3 --- Impact of DVFS --- p.198Chapter 7.4 --- Proposed Algorithm for Online Adjustment --- p.200Chapter 7.4.1 --- Reliability Requirement for Online Adjustment --- p.201Chapter 7.4.2 --- Analytical Model --- p.203Chapter 7.4.3 --- Overall Flow --- p.204Chapter 7.5 --- Experimental Results --- p.205Chapter 7.5.1 --- Experimental Setup --- p.205Chapter 7.5.2 --- Results and Discussion --- p.207Chapter 7.6 --- Conclusion --- p.211Chapter 7.7 --- Appendix --- p.211Chapter 8 --- Conclusion and Future Work --- p.214Chapter 8.1 --- Conclusion --- p.214Chapter 8.2 --- Future Work --- p.215Bibliography --- p.23

Multiprocessor System-on-Chips based Wireless Sensor Network Energy Optimization

Wireless Sensor Network (WSN) is an integrated part of the Internet-of-Things (IoT) used to monitor the physical or environmental conditions without human intervention. In WSN one of the major challenges is energy consumption reduction both at the sensor nodes and network levels. High energy consumption not only causes an increased carbon footprint but also limits the lifetime (LT) of the network. Network-on-Chip (NoC) based Multiprocessor System-on-Chips (MPSoCs) are becoming the de-facto computing platform for computationally extensive real-time applications in IoT due to their high performance and exceptional quality-of-service. In this thesis a task scheduling problem is investigated using MPSoCs architecture for tasks with precedence and deadline constraints in order to minimize the processing energy consumption while guaranteeing the timing constraints. Moreover, energy-aware nodes clustering is also performed to reduce the transmission energy consumption of the sensor nodes. Three distinct problems for energy optimization are investigated given as follows: First, a contention-aware energy-efficient static scheduling using NoC based heterogeneous MPSoC is performed for real-time tasks with an individual deadline and precedence constraints. An offline meta-heuristic based contention-aware energy-efficient task scheduling is developed that performs task ordering, mapping, and voltage assignment in an integrated manner. Compared to state-of-the-art scheduling our proposed algorithm significantly improves the energy-efficiency. Second, an energy-aware scheduling is investigated for a set of tasks with precedence constraints deploying Voltage Frequency Island (VFI) based heterogeneous NoC-MPSoCs. A novel population based algorithm called ARSH-FATI is developed that can dynamically switch between explorative and exploitative search modes at run-time. ARSH-FATI performance is superior to the existing task schedulers developed for homogeneous VFI-NoC-MPSoCs. Third, the transmission energy consumption of the sensor nodes in WSN is reduced by developing ARSH-FATI based Cluster Head Selection (ARSH-FATI-CHS) algorithm integrated with a heuristic called Novel Ranked Based Clustering (NRC). In cluster formation parameters such as residual energy, distance parameters, and workload on CHs are considered to improve LT of the network. The results prove that ARSH-FATI-CHS outperforms other state-of-the-art clustering algorithms in terms of LT.University of Derby, Derby, U

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Reliabilibity Aware Thermal Management of Real-time Multi-core Systems

Continued scaling of CMOS technology has led to increasing working temperature of VLSI circuits. High temperature brings a greater probability of permanent errors (failure) in VLSI circuits, which is a critical threat for real-time systems. As the multi-core architecture is gaining in popularity, this research proposes an adaptive workload assignment approach for multi-core real-time systems to balance thermal stress among cores. While previously developed scheduling algorithms use temperature as the criterion, the proposed algorithm uses reliability of each core in the system to dynamically assign tasks to cores. The simulation results show that the proposed algorithm gains as large as 10% benefit in system reliability compared with commonly used static assignment while algorithms using temperature as criterion gain 4%. The reliability difference between cores, which indicates the imbalance of thermal stress on each core, is as large as 25 times smaller when proposed algorithm is applied

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability