Software Reuse across Robotic Platforms: Limiting the effects of diversity

Robots have diverse capabilities and complex interactions with their environment. Software development for robotic platforms is time consuming due to the complex nature of the tasks to be performed. Such an environment demands sound software engineering practices to produce high quality software. However software engineering in the robotics domain fails to facilitate any significant level of software reuse or portability. This paper identifies the major issues limiting software reuse in the robotics domain. Lack of standardisation, diversity of robotic platforms, and the subtle effects of environmental interaction all contribute to this problem. It is then shown that software components, fuzzy logic, and related techniques can be used together to address this problem. While complete software reuse is not possible, it is demonstrated that significant levels of software reuse can be obtained. Without an acceptable level of reuse or portability, software engineering in the robotics domain will not be able to meet the demands of a rapidly developing field. The work presented in this paper demonstrates a method for supporting software reuse across robotic platforms and hence facilitating improved software engineering practices

Design and application of reconfigurable circuits and systems

Open Acces

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Comprehensive Evaluation of Supply Voltage Underscaling in FPGA on-Chip Memories

In this work, we evaluate aggressive undervolting, i.e., voltage scaling below the nominal level to reduce the energy consumption of Field Programmable Gate Arrays (FPGAs). Usually, voltage guardbands are added by chip vendors to ensure the worst-case process and environmental scenarios. Through experimenting on several FPGA architectures, we measure this voltage guardband to be on average 39% of the nominal level, which in turn, delivers more than an order of magnitude power savings. However, further undervolting below the voltage guardband may cause reliability issues as the result of the circuit delay increase, i.e., start to appear faults. We extensively characterize the behavior of these faults in terms of the rate, location, type, as well as sensitivity to environmental temperature, with a concentration of on-chip memories, or Block RAMs (BRAMs). Finally, we evaluate a typical FPGA-based Neural Network (NN) accelerator under low-voltage BRAM operations. In consequence, the substantial NN energy savings come with the cost of NN accuracy loss. To attain power savings without NN accuracy loss, we propose a novel technique that relies on the deterministic behavior of undervolting faults and can limit the accuracy loss to 0.1% without any timing-slack overhead.Peer ReviewedPostprint (author's final draft

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Time Protection: the Missing OS Abstraction

Timing channels enable data leakage that threatens the security of computer systems, from cloud platforms to smartphones and browsers executing untrusted third-party code. Preventing unauthorised information flow is a core duty of the operating system, however, present OSes are unable to prevent timing channels. We argue that OSes must provide time protection in addition to the established memory protection. We examine the requirements of time protection, present a design and its implementation in the seL4 microkernel, and evaluate its efficacy as well as performance overhead on Arm and x86 processors