729 research outputs found
Comparison of Conventional and Maskless Lithographic Techniques for More than Moore Post-processing of Foundry CMOS Chips
This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask. [2020-0249
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From Lab-on-chip to Lab-in-App: Challenges towards silicon photonic biosensors product developments
This work presents and evaluates different approaches of integrated optical sensors based on photonic integrated circuit (PIC) technologies for refractive index sensing. Bottlenecks in the fabrication flow towards an applicable system are discussed that hinder a cost-effective mass-production for disposable sensor chips. As sensor device, a waveguide coupled micro-ring based approach is chosen which is manufactured in an 8” wafer level process. We will show that the co-integration with a reproducible, scalable and low-cost microfluidic interface is the main challenge which needs to be overcome for future application of silicon technology based PIC sensor chips
Workshops at IMS2023
Lists future events that should be of interest to practitioners and researchers.Peer ReviewedPostprint (published version
Study of the impact of lithography techniques and the current fabrication processes on the design rules of tridimensional fabrication technologies
Working for the photolithography tool manufacturer leader sometimes gives me the impression
of how complex and specific is the sector I am working on. This master thesis topic came with
the goal of getting the overall picture of the state-of-the-art: stepping out and trying to get a
helicopter view usually helps to understand where a process is in the productive chain, or what
other firms and markets are doing to continue improvingUniversidad de sevilla.Máster Universitario en Microelectrónica: Diseño y Aplicaciones de Sistemas Micro/Nanométrico
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
The semiconductor industry is experiencing a significant shift from
traditional methods of shrinking devices and reducing costs. Chip designers
actively seek new technological solutions to enhance cost-effectiveness while
incorporating more features into the silicon footprint. One promising approach
is Heterogeneous Integration (HI), which involves advanced packaging techniques
to integrate independently designed and manufactured components using the most
suitable process technology. However, adopting HI introduces design and
security challenges. To enable HI, research and development of advanced
packaging is crucial. The existing research raises the possible security
threats in the advanced packaging supply chain, as most of the Outsourced
Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal
with the increasing demand for semiconductors and to ensure a secure
semiconductor supply chain, there are sizable efforts from the United States
(US) government to bring semiconductor fabrication facilities onshore. However,
the US-based advanced packaging capabilities must also be ramped up to fully
realize the vision of establishing a secure, efficient, resilient semiconductor
supply chain. Our effort was motivated to identify the possible bottlenecks and
weak links in the advanced packaging supply chain based in the US.Comment: 22 pages, 8 figure
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National Center for Advanced Information Components Manufacturing. Program summary report, Volume II
The National Center for Advanced Information Components Manufacturing focused on manufacturing research and development for flat panel displays, advanced lithography, microelectronics, and optoelectronics. This report provides an overview of the program, program history, summaries of the technical projects, and key program accomplishments
A Review on Key Issues and Challenges in Devices Level MEMS Testing
The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market
A Review on Key Issues and Challenges in Devices Level MEMS Testing
The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market
Nanoelectromechanical Sensors based on Suspended 2D Materials
The unique properties and atomic thickness of two-dimensional (2D) materials
enable smaller and better nanoelectromechanical sensors with novel
functionalities. During the last decade, many studies have successfully shown
the feasibility of using suspended membranes of 2D materials in pressure
sensors, microphones, accelerometers, and mass and gas sensors. In this review,
we explain the different sensing concepts and give an overview of the relevant
material properties, fabrication routes, and device operation principles.
Finally, we discuss sensor readout and integration methods and provide
comparisons against the state of the art to show both the challenges and
promises of 2D material-based nanoelectromechanical sensing.Comment: Review pape
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