Thermal modeling and design optimization of PCB vias and pads

Miniature power semiconductor devices mounted on printed circuit boards (PCBs) are normally cooled by means of PCB vias, copper pads, and/or heatsinks. Various reference PCB thermal designs have been provided by semiconductor manufacturers and researchers. However, the recommendations are not optimal, and there are some discrepancies among them, which may confuse electrical engineers. This paper aims to develop analytical thermal resistance models for PCB vias and pads, and further to obtain the optimal design for thermal resistance minimization. Firstly, the PCB via array is thermally modeled in terms of multiple design parameters. A systematic parametric analysis leads to an optimal trajectory for the via diameter at different PCB specifications. Then an axisymmetric thermal resistance model is developed for PCB thermal pads where the heat conduction, convection and radiation all exist; due to the interdependence between the conductive/radiative heat transfer coefficients and the board temperatures, an algorithm is proposed to fast obtain the board-ambient thermal resistance and to predict the semiconductor junction temperature. Finally, the proposed thermal models and design optimization algorithms are verified by computational fluid dynamics (CFD) simulations and experimental measurements

Design of a circumscribing polygon wide bandgap based integrated modular motor drive topology with thermally decoupled windings and power converters

In this paper, the design of an integrated modular motor drive topology based on the circumscribing polygon of the outer surface of the conventional cylindrical housing is introduced from the mechanical and the thermal point of view. The design of the shared machine and converter cooling system is optimized from the thermal point of view using computational fluid dynamics (CFD) simulations. A wide bandgap, specifically Gallium Nitride (GaN), based half-bridge converter module is designed and implemented for integration. For a case study of a machine of outer radius 75 mm, axial length 80 mm and six stator modules, the resulted surface area for each converter module is 80*87 mm(2). The size of the converter module was reduced so as to exactly match the available surface around the machine. A method for the calculation of the maximum power per module is introduced resulting in 1032W per module for the case study considered in the paper. A method for the DC-link capacitor design is introduced and the influence of the stator phases connections on the DC-link current stress is explained. Experimental measurements are done on one segment of the proposed integration topology

An integrated motor drive with enhanced power density using modular converter structure

In this paper, an integrated motor drive with modular converter structure is analysed with different number of converter modules per phase. The integration concept is realized by designing a housing structure with a flat outer surface and a circular inner surface with a cooling channel in between. The converter modules are mounted on the outer flat surface and the stator components are attached to the inner surface. This integration topology is applied on a fifteen stator coil concentrated winding permanent magnet axial flux machine. The converter modules are implemented as half-bridge inverter using Gallium Nitride (GaN) technology. The cooling structure is optimized using computational fluid dynamics (CFD) simulations. The maximum thermally safe current that can be injected by one inverter module is computed. The maximum winding current is also calculated. Parallel connection of the inverter modules is suggested to maximize the thermal utilization of the windings while keeping the inverter switches junction temperature under the rated value. The CFD based computations are validated with experimental measurements

Effect of the heat dissipation system on hard-switching GaN-based power converters for energy conversion

The design of a cooling system is critical in power converters based on wide-bandgap (WBG) semiconductors. The use of gallium nitride enhancement-mode high-electron-mobility transistors (GaN e-HEMTs) is particularly challenging due to their small size and high power capability. In this paper, we model, study and compare the different heat dissipation systems proposed for high power density GaN-based power converters. Two dissipation systems are analysed in detail: bottom-side dissipation using thermal vias and top-side dissipation using different thermal interface materials. The effectiveness of both dissipation techniques is analysed using MATLAB/Simulink and PLECS. Furthermore, the impact of the dissipation system on the parasitic elements of the converter is studied using advanced design systems (ADS). The experimental results of the GaN-based converters show the effectiveness of the analysed heat dissipation systems and how top-side cooled converters have the lowest parasitic inductance among the studied power converters.This work was supported by the Industrial Doctorates Plan of the Secretaria d’Universitats i Recerca del Departament d’Empresa i Coneixement de la Generalitat de Catalunya, the Centro para el Desarrollo Tecnológico Industrial (IDI-20200864), and the Ministerio de Ciencia, Innovación y Universidades of Spain within the project PID2019-111420RB-I00Peer ReviewedPostprint (published version

Thermal performance enhancement of packaging substrates with integrated vapor chamber

The first part of this research investigates the effects of copper structures, such as copper through-package-vias (TPVs), and copper traces in redistribution layer (RDL), on the thermal performance of glass interposers through numerical and experimental approaches. Numerical parametric study on 2.5D interposers shows that as more copper structures are incorporated in glass interposers, the performance of silicon and glass interposers becomes closer, showing 31% difference in thermal resistance, compared to 53% difference without any copper structures in both interposers. In the second part of this study, a thermal model of glass interposer mounted on the vapor chamber integrated PCB is developed using multi-scale modeling scheme. The comparison of thermal performance between silicon and glass interposers shows that integration of vapor chamber with PCB makes thermal performance of both interposers almost identical, overcoming the limitation posed by low thermal conductivity of glass. The third part of this thesis focuses on design, fabrication, and performance measurement of PCB integrated with vapor chamber. Copper micropillar wick structure is fabricated on PCB with electroplating process, and its wettability is enhanced by silica nanoparticle coating. Design of the wick for the vapor chamber is determined based on the capillary performance and permeability test results. Fabricated device with ultra-thin thickness (~800 µm) shows higher thermal performance than copper plated PCB with the same thickness. Finally, 3D computational fluid dynamics/heat transfer model of the vapor chamber is developed, and modeling result is compared with test result.Ph.D

An integrated modular motor drive with shared cooling for axial flux motor drives

In this article, a circumscribing polygon integrated modular motor drive topology with shared cooling for the power converter and the electrical machine is proposed and benchmarked with the nonintegrated version. The proposed topology is applied on an axial flux permanent magnet synchronous machine. The topology is capable of mechanically mounting the power converter, sufficiently cooling both the power converter and the electrical machine, and combining both of them into the same housing. The mechanical and the thermal design are done to ensure thermal decoupling between the power converter and the motor winding, and to provide a low thermal resistance from the power converter and the electrical machine to the ambient. Due to the limited space available for the power converter module, wide bandgap semiconductor technology is chosen for the implementation of the converter module, thanks to their small package size and low power losses. A highly modular, integrated, and compact drive is achieved compared to the nonintegrated one. A computational fluid dynamics (CFD) model is developed for one module of the proposed integrated drive to evaluate the maximum current that can be injected by one converter module without exceeding the junction temperature limit of the switches and the maximum winding temperature. An experimental setup is built to validate the results of the introduced multiphysics models

Multifunctional vertical interconnections of multilayered flexible substrates for miniaturised POCT devices

Point-of-care testing (POCT) is an emerging technology which can lead to an eruptive change of lifestyle and medication of population against the traditional medical laboratory. Since living organisms are intrinsically flexible and malleable, the flexible substrate is a necessity for successful integration of electronics in biological systems that do not cause discomfort during prolonged use. Isotropic conductive adhesives (ICAs) are attractive to wearable POCT devices because ICAs are environmentally friendly and allow a lower processing temperature than soldering which protects heat-sensitive components. Vertical interconnections and optical interconnections are considered as the technologies to realise the miniaturised high-performance devices for the future applications. This thesis focused on the multifunctional integration to enable both electrical and optical vertical interconnections through one via hole that can be fabricated in flexible substrates. The functional properties of the via and their response to the external loadings which are likely encountered in the POCT devices are the primary concerns of this PhD project. In this thesis, the research of curing effect on via performance was first conducted by studying the relationship between curing conditions and material properties. Based on differential scanning calorimetry (DSC) analysis results, two-parameter autocatalytic model (Sestak-Berggren model) was established as the most suitable curing process description of our typical ICA composed of epoxy-based binders and Ag filler particles. A link between curing conditions and the mechanical properties of ICAs was established based on the DMA experiments. A series of test vehicles containing vias filled with ICAs were cured under varying conditions. The electrical resistance of the ICA filled vias were measured before testing and in real time during thermal cycling tests, damp heat tests and bending tests. A simplified model was derived to represent rivet-shaped vias in the flexible printed circuit boards (FPCBs) based on the assumption of homogenous ICAs. An equation was thus proposed to evaluate the resistance of the model. Vias with different cap sizes were also tested, and the equation was validated. Those samples were divided into three groups for thermal cycling test, damp heat ageing test and bending test. Finite element analysis (FEA) was used to aid better understanding of the electrical conduction mechanisms. Based on theoretical equation and simulation model, the fistula-shape ICA via was fabricated in flexible PCB. Its hollow nature provides the space for integrations of optical or fluidic circuits. Resistance measurements and reliability tests proved that carefully designed and manufactured small bores in vias did not comprise the performance. Test vehicles with optoelectrical vias were made through two different approaches to prove the feasibility of multifunctional vertical interconnections in flexible substrates. A case study was carried out on reflection Photoplethysmography (rPPG) sensors manufacturing, using a specially designed optoelectronic system. ICA-based low-temperature manufacture processes were developed to enable the integration of these flexible but delicate substrates and components. In the manufacturing routes, a modified stencil printing setup, which merges two printing-curing steps (vias forming and components bonding) into one step, was developed to save both time and energy. The assembled probes showed the outstanding performance in functional and physiological tests. The results from this thesis are anticipated to facilitate the understanding of ICA via conduction mechanism and provide an applicable tool to optimise the design and manufacturing of optoelectrical vias