Side-channel based intrusion detection for industrial control systems

Industrial Control Systems are under increased scrutiny. Their security is historically sub-par, and although measures are being taken by the manufacturers to remedy this, the large installed base of legacy systems cannot easily be updated with state-of-the-art security measures. We propose a system that uses electromagnetic side-channel measurements to detect behavioural changes of the software running on industrial control systems. To demonstrate the feasibility of this method, we show it is possible to profile and distinguish between even small changes in programs on Siemens S7-317 PLCs, using methods from cryptographic side-channel analysis.Comment: 12 pages, 7 figures. For associated code, see https://polvanaubel.com/research/em-ics/code

AMTV headway sensor and safety design

A headway sensing system for an automated mixed traffic vehicle (AMTV) employing an array of optical proximity sensor elements is described, and its performance is presented in terms of object detection profiles. The problem of sensing in turns is explored experimentally and requirements for future turn sensors are discussed. A recommended headway sensor configuration, employing multiple source elements in the focal plane of one lens operating together with a similar detector unit, is described. Alternative concepts including laser radar, ultrasonic sensing, imaging techniques, and radar are compared to the present proximity sensor approach. Design concepts for an AMTV body which will minimize the probability of injury to pedestrians or passengers in the event of a collision are presented

Advanced digital modulation: Communication techniques and monolithic GaAs technology

Communications theory and practice are merged with state-of-the-art technology in IC fabrication, especially monolithic GaAs technology, to examine the general feasibility of a number of advanced technology digital transmission systems. Satellite-channel models with (1) superior throughput, perhaps 2 Gbps; (2) attractive weight and cost; and (3) high RF power and spectrum efficiency are discussed. Transmission techniques possessing reasonably simple architectures capable of monolithic fabrication at high speeds were surveyed. This included a review of amplitude/phase shift keying (APSK) techniques and the continuous-phase-modulation (CPM) methods, of which MSK represents the simplest case

Skyrmion Gas Manipulation for Probabilistic Computing

The topologically protected magnetic spin configurations known as skyrmions offer promising applications due to their stability, mobility and localization. In this work, we emphasize how to leverage the thermally driven dynamics of an ensemble of such particles to perform computing tasks. We propose a device employing a skyrmion gas to reshuffle a random signal into an uncorrelated copy of itself. This is demonstrated by modelling the ensemble dynamics in a collective coordinate approach where skyrmion-skyrmion and skyrmion-boundary interactions are accounted for phenomenologically. Our numerical results are used to develop a proof-of-concept for an energy efficient ($\sim\mu\mathrm{W}$) device with a low area imprint ($\sim\mu\mathrm{m}^2$). Whereas its immediate application to stochastic computing circuit designs will be made apparent, we argue that its basic functionality, reminiscent of an integrate-and-fire neuron, qualifies it as a novel bio-inspired building block.Comment: 41 pages, 20 figure

Modeling of CMOS devices and circuits on flexible ultrathin chips

The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)

A micropower centroiding vision processor

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