Infrared testing of electronic components

Infrared testing of electronic component

Scalable Interactive Volume Rendering Using Off-the-shelf Components

This paper describes an application of a second generation implementation of the Sepia architecture (Sepia-2) to interactive volu-metric visualization of large rectilinear scalar fields. By employingpipelined associative blending operators in a sort-last configuration a demonstration system with 8 rendering computers sustains 24 to 28 frames per second while interactively rendering large data volumes (1024x256x256 voxels, and 512x512x512 voxels). We believe interactive performance at these frame rates and data sizes is unprecedented. We also believe these results can be extended to other types of structured and unstructured grids and a variety of GL rendering techniques including surface rendering and shadow map-ping. We show how to extend our single-stage crossbar demonstration system to multi-stage networks in order to support much larger data sizes and higher image resolutions. This requires solving a dynamic mapping problem for a class of blending operators that includes Porter-Duff compositing operators

Infrared testing of electronic components Final report, 5 Apr. 1965 - 5 Jun. 1966

Infrared radiation nondestructive test technique for electrical/electronic equipmen

Spartan Daily, October 5, 1981

Volume 77, Issue 23https://scholarworks.sjsu.edu/spartandaily/6799/thumbnail.jp

New thermal insulation fiberboards from cake generated during biorefinery of sunflower whole plant in a twin-screw extruder

The objective of this study was to manufacture new thermal insulation fiberboards by thermo-pressing. The starting material was a slightly deoiled cake (17.6% oil content), generated during the biorefinery of sunflower (Helianthus annuus L.) whole plant in a co-rotating (Clextral BC 45, France) twin-screw extruder. All fiberboards produced were cohesive mixtures of proteins and lignocellulosic fibers, acting respectively as binder and reinforcing fillers in what could be considered as a natural composite. The molding experiments were conducted using a 400 ton capacity heated hydraulic press (Pinette Emidecau Industries, France). The influence of molding conditions on board density, mechanical properties and heat insulation properties was examined. Molding conditions included mold temperature (140-200°C), pressure applied (150-250 kgf/cm²) and molding time (40-76 s), and these greatly affected board density and thus the mechanical and heat insulation properties. Board density increased with increasingly extreme molding conditions, rising from 500 to 858 kg/m³. The mechanical properties increased at the same time (from 52 to 660 kPa for flexural strength at break, from 5.9 to 49.4 MPa for elastic modulus, from 0.5 to 7.7 kJ/m² for Charpy impact strength, and from 19.2 to 47.1° for Shore D surface hardness). Conversely, heat insulation properties improved with decreasing board density, and the lowest thermal conductivity (88.5 mW/m K at 25°C) was obtained with the least dense fiberboard. The latter was produced with a 140°C mold temperature, a 150 kgf/cm² pressure applied and a 40 s molding time. A medium mold temperature (160°C) was needed to obtain a good compromise between mechanical properties (272 kPa for flexural strength at break, 26.3 MPa for elastic modulus, 3.2 kJ/m² for Charpy impact strength, and 37.3° for Shore D surface hardness), and heat insulation properties (99.5 mW/m K for thermal conductivity).The corresponding board density was medium (687 kg/m³). Because of their promising heat insulation properties, these new fiberboards could be positioned on walls and ceilings for thermal insulation of buildings. The bulk cake also revealed very low thermal conductivity properties (only 65.6 mW/m K at 25°C) due to its very low bulk density (204 kg/m³). It could be used as loose fill in the attics of houses

Nonphotolithographic nanoscale memory density prospects

Technologies are now emerging to construct molecular-scale electronic wires and switches using bottom-up self-assembly. This opens the possibility of constructing nanoscale circuits and memories where active devices are just a few nanometers square and wire pitches may be on the order of ten nanometers. The features can be defined at this scale without using photolithography. The available assembly techniques have relatively high defect rates compared to conventional lithographic integrated circuits and can only produce very regular structures. Nonetheless, with proper memory organization, it is reasonable to expect these technologies to provide memory densities in excess of 10/sup 11/ b/cm/sup 2/ with modest active power requirements under 0.6 W/Tb/s for random read operations

D0 Silicon Microstrip Tracker fro Run IIa

We briefly describe the production, installation and commissioning of the new 800,000 channel D0 Silicon Microstrip Tracker to be used for the 2 fb$^{-1}$ of the Run IIa at the Tevatron.Comment: 5 Latex pages, 3 figures. to appear in proceedings of Como 200

Printed Circuit Board (PCB) design process and fabrication

This module describes main characteristics of Printed Circuit Boards (PCBs). A brief history of PCBs is introduced in the first chapter. Then, the design processes and the fabrication of PCBs are addressed and finally a study case is presented in the last chapter of the module.Peer ReviewedPostprint (published version