Technology Mapping, Design for Testability, and Circuit Optimizations for NULL Convention Logic Based Architectures

Delay-insensitive asynchronous circuits have been the target of a renewed research effort because of the advantages they offer over traditional synchronous circuits. Minimal timing analysis, inherent robustness against power-supply, temperature, and process variations, reduced energy consumption, less noise and EMI emission, and easy design reuse are some of the benefits of these circuits. NULL Convention Logic (NCL) is one of the mainstream asynchronous logic design paradigms that has been shown to be a promising method for designing delay-insensitive asynchronous circuits. This dissertation investigates new areas in NCL design and test and is made of three sections. The first section discusses different CMOS implementations of NCL gates and proposes new circuit techniques to enhance their operation. The second section focuses on mapping multi-rail logic expressions to a standard NCL gate library, which is a form of technology mapping for a category of NCL design automation flows. Finally, the last section proposes design for testability techniques for a recently developed low-power variant of NCL called Sleep Convention Logic (SCL)

A design for testability study on a high performance automatic gain control circuit.

A comprehensive testability study on a commercial automatic gain control circuit is presented which aims to identify design for testability (DfT) modifications to both reduce production test cost and improve test quality. A fault simulation strategy based on layout extracted faults has been used to support the study. The paper proposes a number of DfT modifications at the layout, schematic and system levels together with testability. Guidelines that may well have generic applicability. Proposals for using the modifications to achieve partial self test are made and estimates of achieved fault coverage and quality levels presente

Design of Asynchronous Circuits for High Soft Error Tolerance in Deep Submicron CMOS Circuits

As the devices are scaling down, the combinational logic will become susceptible to soft errors. The conventional soft error tolerant methods for soft errors on combinational logic do not provide enough high soft error tolerant capability with reasonably small performance penalty. This paper investigates the feasibility of designing quasi-delay insensitive (QDI) asynchronous circuits for high soft error tolerance. We analyze the behavior of null convention logic (NCL) circuits in the presence of particle strikes, and propose an asynchronous pipeline for soft-error correction and a novel technique to improve the robustness of threshold gates, which are basic components in NCL, against particle strikes by using Schmitt trigger circuit and resizing the feedback transistor. Experimental results show that the proposed threshold gates do not generate soft errors under the strike of a particle within a certain energy range if a proper transistor size is applied. The penalties, such as delay and power consumption, are also presented

Low Cost NBTI Degradation Detection and Masking Approaches

Performance degradation of integrated circuits due to aging effects, such as Negative Bias Temperature Instability (NBTI), is becoming a great concern for current and future CMOS technology. In this paper, we propose two monitoring and masking approaches that detect late transitions due to NBTI degradation in the combinational part of critical data paths and guarantee the correctness of the provided output data by adapting the clock frequency. Compared to recently proposed alternative solutions, one of our approaches (denoted as Low Area and Power (LAP) approach) requires lower area overhead and lower, or comparable, power consumption, while exhibiting the same impact on system performance, while the other proposed approach (denoted as High Performance (HP) approach) allows us to reduce the impact on system performance, at the cost of some increase in area and power consumption

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Quantifiable Assurance: From IPs to Platforms

Hardware vulnerabilities are generally considered more difficult to fix than software ones because they are persistent after fabrication. Thus, it is crucial to assess the security and fix the vulnerabilities at earlier design phases, such as Register Transfer Level (RTL) and gate level. The focus of the existing security assessment techniques is mainly twofold. First, they check the security of Intellectual Property (IP) blocks separately. Second, they aim to assess the security against individual threats considering the threats are orthogonal. We argue that IP-level security assessment is not sufficient. Eventually, the IPs are placed in a platform, such as a system-on-chip (SoC), where each IP is surrounded by other IPs connected through glue logic and shared/private buses. Hence, we must develop a methodology to assess the platform-level security by considering both the IP-level security and the impact of the additional parameters introduced during platform integration. Another important factor to consider is that the threats are not always orthogonal. Improving security against one threat may affect the security against other threats. Hence, to build a secure platform, we must first answer the following questions: What additional parameters are introduced during the platform integration? How do we define and characterize the impact of these parameters on security? How do the mitigation techniques of one threat impact others? This paper aims to answer these important questions and proposes techniques for quantifiable assurance by quantitatively estimating and measuring the security of a platform at the pre-silicon stages. We also touch upon the term security optimization and present the challenges for future research directions

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Lightweight Architectures for Reliable and Fault Detection Simon and Speck Cryptographic Algorithms on FPGA

The widespread use of sensitive and constrained applications necessitates lightweight (lowpower and low-area) algorithms developed for constrained nano-devices. However, nearly all of such algorithms are optimized for platform-based performance and may not be useful for diverse and flexible applications. The National Security Agency (NSA) has proposed two relatively-recent families of lightweight ciphers, i.e., Simon and Speck, designed as efficient ciphers on both hardware and software platforms. This paper proposes concurrent error detection schemes to provide reliable architectures for these two families of lightweight block ciphers. The research work on analyzing the reliability of these algorithms and providing fault diagnosis approaches has not been undertaken to date to the best of our knowledge. The main aim of the proposed reliable architectures is to provide high error coverage while maintaining acceptable area and power consumption overheads. To achieve this, we propose a variant of recomputing with encoded operands. These low-complexity schemes are suited for lowresource applications such as sensitive, constrained implantable and wearable medical devices. We perform fault simulations for the proposed architectures by developing a fault model framework. The architectures are simulated and analyzed on recent field-programmable grate array (FPGA) platforms, and it is shown that the proposed schemes provide high error coverage. The proposed low-complexity concurrent error detection schemes are a step forward towards more reliable architectures for Simon and Speck algorithms in lightweight, secure applications

Développement de circuits logiques programmables résistants aux alas logiques en technologie CMOS submicrométrique

The electronics associated to the particle detectors of the Large Hadron Collider (LHC), under construction at CERN, will operate in a very harsh radiation environment. Most of the microelectronics components developed for the first generation of LHC experiments have been designed with very precise experiment-specific goals and are hardly adaptable to other applications. Commercial Off-The-Shelf (COTS) components cannot be used in the vicinity of particle collision due to their poor radiation tolerance. This thesis is a contribution to the effort to cover the need for radiation-tolerant SEU-robust programmable components for application in High Energy Physics (HEP) experiments. Two components are under development: a Programmable Logic Device (PLD) and a Field-Programmable Gate Array (FPGA). The PLD is a fuse-based, 10-input, 8-I/O general architecture device in 0.25 micron CMOS technology. The FPGA under development is instead a 32x32 logic block array, equivalent to ~25k gates, in 0.13 micron CMOS. This work focussed also on the research for an SEU-robust register in both the mentioned technologies. The SEU-robust register is employed as a user data flip-flop in the FPGA and PLD designs and as a configuration cell as well in the FPGA design

Null Convention Logic applications of asynchronous design in nanotechnology and cryptographic security

This dissertation presents two Null Convention Logic (NCL) applications of asynchronous logic circuit design in nanotechnology and cryptographic security. The first application is the Asynchronous Nanowire Reconfigurable Crossbar Architecture (ANRCA); the second one is an asynchronous S-Box design for cryptographic system against Side-Channel Attacks (SCA). The following are the contributions of the first application: 1) Proposed a diode- and resistor-based ANRCA (DR-ANRCA). Three configurable logic block (CLB) structures were designed to efficiently reconfigure a given DR-PGMB as one of the 27 arbitrary NCL threshold gates. A hierarchical architecture was also proposed to implement the higher level logic that requires a large number of DR-PGMBs, such as multiple-bit NCL registers. 2) Proposed a memristor look-up-table based ANRCA (MLUT-ANRCA). An equivalent circuit simulation model has been presented in VHDL and simulated in Quartus II. Meanwhile, the comparison between these two ANRCAs have been analyzed numerically. 3) Presented the defect-tolerance and repair strategies for both DR-ANRCA and MLUT-ANRCA. The following are the contributions of the second application: 1) Designed an NCL based S-Box for Advanced Encryption Standard (AES). Functional verification has been done using Modelsim and Field-Programmable Gate Array (FPGA). 2) Implemented two different power analysis attacks on both NCL S-Box and conventional synchronous S-Box. 3) Developed a novel approach based on stochastic logics to enhance the resistance against DPA and CPA attacks. The functionality of the proposed design has been verified using an 8-bit AES S-box design. The effects of decision weight, bitstream length, and input repetition times on error rates have been also studied. Experimental results shows that the proposed approach enhances the resistance to against the CPA attack by successfully protecting the hidden key --Abstract, page iii