Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies

One of the main challenges in building future high performance systems is the ability to maintain safe on-chip temperatures in presence of high power densities. Handling such high power densities necessitates novel cooling solutions that are significantly more efficient than their existing counterparts. A number of advanced cooling methods have been proposed to address the temperature problem in processors. However, tradeoffs exist between performance, cost, and efficiency of those cooling methods, and these tradeoffs depend on the target system properties. Hence, a single cooling solution satisfying optimum conditions for any arbitrary system does not exist. This thesis claims that in order to reach exascale computing, a dramatic improvement in energy efficiency is needed, and achieving this improvement requires a temperature-centric co-design of the cooling and computing subsystems. Such co-design requires detailed system-level thermal modeling, design-time optimization, and runtime management techniques that are aware of the underlying processor architecture and application requirements. To this end, this thesis first proposes compact thermal modeling methods to characterize the complex thermal behavior of cutting-edge cooling solutions, mainly Phase Change Material (PCM)-based cooling, liquid cooling, and thermoelectric cooling (TEC), as well as hybrid designs involving a combination of these. The proposed models are modular and they enable fast and accurate exploration of a large design space. Comparisons against multi-physics simulations and measurements on testbeds validate the accuracy of our models (resulting in less than 1C error on average) and demonstrate significant reductions in simulation time (up to four orders of magnitude shorter simulation times). This thesis then introduces temperature-aware optimization techniques to maximize energy efficiency of a given system as a whole (including computing and cooling energy). The proposed optimization techniques approach the temperature problem from various angles, tackling major sources of inefficiency. One important angle is to understand the application power and performance characteristics and to design management techniques to match them. For workloads that require short bursts of intense parallel computation, we propose using PCM-based cooling in cooperation with a novel Adaptive Sprinting technique. By tracking the PCM state and incorporating this information during runtime decisions, Adaptive Sprinting utilizes the PCM heat storage capability more efficiently, achieving 29\% performance improvement compared to existing sprinting policies. In addition to the application characteristics, high heterogeneity in on-chip heat distribution is an important factor affecting efficiency. Hot spots occur on different locations of the chip with varying intensities; thus, designing a uniform cooling solution to handle worst-case hot spots significantly reduces the cooling efficiency. The hybrid cooling techniques proposed as part of this thesis address this issue by combining the strengths of different cooling methods and localizing the cooling effort over hot spots. Specifically, the thesis introduces LoCool, a cooling system optimizer that minimizes cooling power under temperature constraints for hybrid-cooled systems using TECs and liquid cooling. Finally, the scope of this work is not limited to existing advanced cooling solutions, but it also extends to emerging technologies and their potential benefits and tradeoffs. One such technology is integrated flow cell array, where fuel cells are pumped through microchannels, providing both cooling and on-chip power generation. This thesis explores a broad range of design parameters including maximum chip temperature, leakage power, and generated power for flow cell arrays in order to maximize the benefits of integrating this technology with computing systems. Through thermal modeling and runtime management techniques, and by exploring the design space of emerging cooling solutions, this thesis provides significant improvements in processor energy efficiency.2018-07-09T00:00:00

Mitigating impacts of workload variation on ring oscillator-based thermometers.

Thermal issues have resulted in growing concerns among industries fabricating semiconductor devices such as Chip Multiprocessors (CMP) and reconfigurable hardware devices. To reduce passive cooling costs and eliminate the need to package for worst-case temperatures, dynamic thermal management (DTM) techniques are being devised to combat thermal effects. Reliable runtime measurement of device temperature is necessary for implementing DTM techniques. Ring oscillators have often been used for on-chip Field Programmable Gate Array (FPGA) temperature measurement due to their strong linear temperature dependence and compact design using available spare reconfigurable resources. A major problem in using ring oscillators to measure temperature, however, is that their frequency of oscillation is affected by changes in device core voltage and current distribution, induced by changes in application workload. The need, then, is to have a workload-compensated ring oscillator-based thermometer for reconfigurable devices. This work performs a characterization of the ideal as well as non-ideal effects of workload variation on ring oscillator frequency response. Where non-ideal refers to impacts on ring oscillator oscillation frequency due to phenomena other than the workload\u27s impact on device temperature. The data obtained from this characterization is used to compensate for these non-ideal effects. A complete hardware-software solution is implemented to collect temperature and power related data along with ring oscillator frequency response to varying workload configurations. The characterization results show an error of approximately 1°C in the estimated temperature for every 8.6mA change in current drawn from the supply on a Xilinx Virtex-5 LX110T FPGA, with respect to the current draw measured while running a baseline workload during thermometer calibration. This lead to a maximum error of ∼74°C for the workloads evaluated. The compensation technique implemented is shown to reduce this error to ∼2°C. In addition, a potential issue with using the Xilinx System Monitor to measure die temperature at high temperatures is observed. The System Monitor reported temperatures show a deviation of up to 20°C from temperatures obtained using a case-mounted thermal probe

Techniques for Aging, Soft Errors and Temperature to Increase the Reliability of Embedded On-Chip Systems

This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliability estimation for embedded on-chip systems. In addition, it also proposes new techniques to increase the reliability of register files within processors against aging effects and soft errors. It also introduces a novel thermal measurement setup that perspicuously captures the infrared images of modern multi-core processors

Degradation in FPGAs: Monitoring, Modeling and Mitigation

This dissertation targets the transistor aging degradation as well as the associated thermal challenges in FPGAs (since there is an exponential relation between aging and chip temperature). The main objectives are to perform experimentation, analysis and device-level model abstraction for modeling the degradation in FPGAs, then to monitor the FPGA to keep track of aging rates and ultimately to propose an aging-aware FPGA design flow to mitigate the aging

Run-time management for future MPSoC platforms

In recent years, we are witnessing the dawning of the Multi-Processor Systemon- Chip (MPSoC) era. In essence, this era is triggered by the need to handle more complex applications, while reducing overall cost of embedded (handheld) devices. This cost will mainly be determined by the cost of the hardware platform and the cost of designing applications for that platform. The cost of a hardware platform will partly depend on its production volume. In turn, this means that ??exible, (easily) programmable multi-purpose platforms will exhibit a lower cost. A multi-purpose platform not only requires ??exibility, but should also combine a high performance with a low power consumption. To this end, MPSoC devices integrate computer architectural properties of various computing domains. Just like large-scale parallel and distributed systems, they contain multiple heterogeneous processing elements interconnected by a scalable, network-like structure. This helps in achieving scalable high performance. As in most mobile or portable embedded systems, there is a need for low-power operation and real-time behavior. The cost of designing applications is equally important. Indeed, the actual value of future MPSoC devices is not contained within the embedded multiprocessor IC, but in their capability to provide the user of the device with an amount of services or experiences. So from an application viewpoint, MPSoCs are designed to ef??ciently process multimedia content in applications like video players, video conferencing, 3D gaming, augmented reality, etc. Such applications typically require a lot of processing power and a signi??cant amount of memory. To keep up with ever evolving user needs and with new application standards appearing at a fast pace, MPSoC platforms need to be be easily programmable. Application scalability, i.e. the ability to use just enough platform resources according to the user requirements and with respect to the device capabilities is also an important factor. Hence scalability, ??exibility, real-time behavior, a high performance, a low power consumption and, ??nally, programmability are key components in realizing the success of MPSoC platforms. The run-time manager is logically located between the application layer en the platform layer. It has a crucial role in realizing these MPSoC requirements. As it abstracts the platform hardware, it improves platform programmability. By deciding on resource assignment at run-time and based on the performance requirements of the user, the needs of the application and the capabilities of the platform, it contributes to ??exibility, scalability and to low power operation. As it has an arbiter function between different applications, it enables real-time behavior. This thesis details the key components of such an MPSoC run-time manager and provides a proof-of-concept implementation. These key components include application quality management algorithms linked to MPSoC resource management mechanisms and policies, adapted to the provided MPSoC platform services. First, we describe the role, the responsibilities and the boundary conditions of an MPSoC run-time manager in a generic way. This includes a de??nition of the multiprocessor run-time management design space, a description of the run-time manager design trade-offs and a brief discussion on how these trade-offs affect the key MPSoC requirements. This design space de??nition and the trade-offs are illustrated based on ongoing research and on existing commercial and academic multiprocessor run-time management solutions. Consequently, we introduce a fast and ef??cient resource allocation heuristic that considers FPGA fabric properties such as fragmentation. In addition, this thesis introduces a novel task assignment algorithm for handling soft IP cores denoted as hierarchical con??guration. Hierarchical con??guration managed by the run-time manager enables easier application design and increases the run-time spatial mapping freedom. In turn, this improves the performance of the resource assignment algorithm. Furthermore, we introduce run-time task migration components. We detail a new run-time task migration policy closely coupled to the run-time resource assignment algorithm. In addition to detailing a design-environment supported mechanism that enables moving tasks between an ISP and ??ne-grained recon??gurable hardware, we also propose two novel task migration mechanisms tailored to the Network-on-Chip environment. Finally, we propose a novel mechanism for task migration initiation, based on reusing debug registers in modern embedded microprocessors. We propose a reactive on-chip communication management mechanism. We show that by exploiting an injection rate control mechanism it is possible to provide a communication management system capable of providing a soft (reactive) QoS in a NoC. We introduce a novel, platform independent run-time algorithm to perform quality management, i.e. to select an application quality operating point at run-time based on the user requirements and the available platform resources, as reported by the resource manager. This contribution also proposes a novel way to manage the interaction between the quality manager and the resource manager. In order to have a the realistic, reproducible and ??exible run-time manager testbench with respect to applications with multiple quality levels and implementation tradev offs, we have created an input data generation tool denoted Pareto Surfaces For Free (PSFF). The the PSFF tool is, to the best of our knowledge, the ??rst tool that generates multiple realistic application operating points either based on pro??ling information of a real-life application or based on a designer-controlled random generator. Finally, we provide a proof-of-concept demonstrator that combines these concepts and shows how these mechanisms and policies can operate for real-life situations. In addition, we show that the proposed solutions can be integrated into existing platform operating systems

Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives

© ACM, 2020. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in ACM Computing Surveys, Vol. 53, No. 5, Article 95. Publication date: September 2020. https://doi.org/10.1145/3403956[EN] Performance and power constraints come together with Complementary Metal Oxide Semiconductor technology scaling in future Exascale systems. Technology scaling makes each individual transistor more prone to faults and, due to the exponential increase in the number of devices per chip, to higher system fault rates. Consequently, High-performance Computing (HPC) systems need to integrate prediction, detection, and recovery mechanisms to cope with faults efficiently. This article reviews fault detection, fault prediction, and recovery techniques in HPC systems, from electronics to system level. We analyze their strengths and limitations. Finally, we identify the promising paths to meet the reliability levels of Exascale systems.This work has received funding from the European Union's Horizon 2020 (H2020) research and innovation program under the FET-HPC Grant Agreement No. 801137 (RECIPE). Jaume Abella was also partially supported by the Ministry of Economy and Competitiveness of Spain under Contract No. TIN2015-65316-P and under Ramon y Cajal Postdoctoral Fellowship No. RYC-2013-14717, as well as by the HiPEAC Network of Excellence. Ramon Canal is partially supported by the Generalitat de Catalunya under Contract No. 2017SGR0962.Canal, R.; Hernández Luz, C.; Tornero-Gavilá, R.; Cilardo, A.; Massari, G.; Reghenzani, F.; Fornaciari, W.... (2020). Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives. ACM Computing Surveys. 53(5):1-32. https://doi.org/10.1145/3403956S132535Abella, J., Hernandez, C., Quinones, E., Cazorla, F. J., Conmy, P. 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IEEE Internet Com

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Summer 2008 Research Symposium Abstract Book

Summer 2008 volume of abstracts for science research projects conducted by Trinity College students