Design Space Exploration in Cyber-Physical Systems

Cyber physical systems (CPS) integrate a variety of engineering areas such as control, mechanical and computer engineering in a holistic design effort. While interdependencies between the different disciplines are key attributes of CPS design science, little is known about the impact of design decisions of the cyber part on the overall system qualities. To investigate these interdependencies, this paper proposes a simulation-based Design Space Exploration (DSE) framework that considers detailed cyber system parameters such as cache size, bus width, and voltage levels in addition to physical and control parameters of the CPS. We propose an exploration algorithm that surfs the parameter configurations in the cyber physical sub-systems, in order to approximate the Pareto-optimal design points with regards to the trade-os among the design objectives, such as energy consumption and control stability. We apply the proposed framework to a network control system for an inverted-pendulum application. The presented holistic evaluation of the identified Pareto-points reveals the presence of non-trivial trade-os, which are imposed by the control, physical, and detailed cyber parameters. For instance the identified energy and control optimal design points comprise configurations with a wide range of CPU speeds, sample times and cache configuration following non-trivial zig-zag patterns. The proposed framework could identify and manage those trade-os and, as a result, is an imperative rst step to automate the search for superior CSP configurations

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Fog computing, applications , security and challenges, review

The internet of things originates a world where on daily basis objects can join the internet and interchange information and in addition process, store, gather them from the nearby environment, and effectively mediate on it. A remarkable number of services might be imagined by abusing the internet of things. Fog computing which is otherwise called edge computing was introduced in 2012 as a considered is a prioritized choice for the internet of things applications. As fog computing extend services of cloud near to the edge of the network and make possible computations, communications, and storage services in proximity to the end user. Fog computing cannot only provide low latency, location awareness but also enhance real-time applications, quality of services, mobility, security and privacy in the internet of things applications scenarios. In this paper, we will summarize and overview fog computing model architecture, characteristic, similar paradigm and various applications in real-time scenarios such as smart grid, traffic control system and augmented reality. Finally, security challenges are presented

A case study for NoC based homogeneous MPSoC architectures

The many-core design paradigm requires flexible and modular hardware and software components to provide the required scalability to next-generation on-chip multiprocessor architectures. A multidisciplinary approach is necessary to consider all the interactions between the different components of the design. In this paper, a complete design methodology that tackles at once the aspects of system level modeling, hardware architecture, and programming model has been successfully used for the implementation of a multiprocessor network-on-chip (NoC)-based system, the NoCRay graphic accelerator. The design, based on 16 processors, after prototyping with field-programmable gate array (FPGA), has been laid out in 90-nm technology. Post-layout results show very low power, area, as well as 500 MHz of clock frequency. Results show that an array of small and simple processors outperform a single high-end general purpose processo

Performance analysis and optimization of automotive GPUs

© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD) have drastically increased the performance demands of automotive systems. Suitable highperformance platforms building upon Graphic Processing Units (GPUs) have been developed to respond to this demand, being NVIDIA Jetson TX2 a relevant representative. However, whether high-performance GPU configurations are appropriate for automotive setups remains as an open question. This paper aims at providing light on this question by modelling an automotive GPU (Jetson TX2), analyzing its microarchitectural parameters against relevant benchmarks, and identifying specific configurations able to meaningfully increase performance within similar cost envelopes, or to decrease costs preserving original performance levels. Overall, our analysis opens the door to the optimization of automotive GPUs for further system efficiency.This work has been partially supported by the Spanish Ministry of Economy and Competitiveness (MINECO) under grant TIN2015-65316-P, the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (grant agreement No. 772773) and the HiPEAC Network of Excellence. Pedro Benedicte and Jaume Abella have been partially supported by the MINECO under FPU15/01394 grant and Ramon y Cajal postdoctoral fellowship number RYC-2013-14717 respectively and Leonidas Kosmidis under Juan de la Cierva-Formacin postdoctoral fellowship (FJCI-2017-34095).Peer ReviewedPostprint (author's final draft

Network-aware design-space exploration of a power-efficient embedded application

The paper presents the design and multi-parameter optimization of a networked embedded application for the health-care domain. Several hardware, software, and application parameters, such as clock frequency, sensor sampling rate, data packet rate, are tuned at design- and run-time according to application specifications and operating conditions to optimize hardware requirements, packet loss, power consumption. Experimental results show that further power efficiency can be achieved by considering also communication aspects during design space exploratio