Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Design Space Re-Engineering for Power Minimization in Modern Embedded Systems

Power minimization is a critical challenge for modern embedded system design. Recently, due to the rapid increase of system's complexity and the power density, there is a growing need for power control techniques at various design levels. Meanwhile, due to technology scaling, leakage power has become a significant part of power dissipation in the CMOS circuits and new techniques are needed to reduce leakage power. As a result, many new power minimization techniques have been proposed such as voltage island, gate sizing, multiple supply and threshold voltage, power gating and input vector control, etc. These design options further enlarge the design space and make it prohibitively expensive to explore for the most energy efficient design solution. Consequently, heuristic algorithms and randomized algorithms are frequently used to explore the design space, seeking sub-optimal solutions to meet the time-to-market requirements. These algorithms are based on the idea of truncating the design space and restricting the search in a subset of the original design space. While this approach can effectively reduce the runtime of searching, it may also exclude high-quality design solutions and cause design quality degradation. When the solution to one problem is used as the base for another problem, such solution quality degradation will accumulate. In modern electronics system design, when several such algorithms are used in series to solve problems in different design levels, the final solution can be far off the optimal one. In my Ph.D. work, I develop a {\em re-engineering} methodology to facilitate exploring the design space of power efficient embedded systems design. The direct goal is to enhance the performance of existing low power techniques. The methodology is based on the idea that design quality can be improved via iterative ``re-shaping'' the design space based on the ``bad'' structure in the obtained design solutions; the searching run-time can be reduced by the guidance from previous exploration. This approach can be described in three phases: (1) apply the existing techniques to obtain a sub-optimal solution; (2) analyze the solution and expand the design space accordingly; and (3) re-apply the technique to re-explore the enlarged design space. We apply this methodology at different levels of embedded system design to minimize power: (i) switching power reduction in sequential logic synthesis; (ii) gate-level static leakage current reduction; (iii) dual threshold voltage CMOS circuits design; and (iv) system-level energy-efficient detection scheme for wireless sensor networks. An extensive amount of experiments have been conducted and the results have shown that this methodology can effectively enhance the power efficiency of the existing embedded system design flows with very little overhead

Power Efficient Data-Aware SRAM Cell for SRAM-Based FPGA Architecture

The design of low-power SRAM cell becomes a necessity in today\u27s FPGAs, because SRAM is a critical component in FPGA design and consumes a large fraction of the total power. The present chapter provides an overview of various factors responsible for power consumption in FPGA and discusses the design techniques of low-power SRAM-based FPGA at system level, device level, and architecture levels. Finally, the chapter proposes a data-aware dynamic SRAM cell to control the power consumption in the cell. Stack effect has been adopted in the design to reduce the leakage current. The various peripheral circuits like address decoder circuit, write/read enable circuits, and sense amplifier have been modified to implement a power-efficient SRAM-based FPGA

An Ultra-Low-Energy, Variation-Tolerant FPGA Architecture Using Component-Specific Mapping

As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to increased margins in both delay and energy. Parameter variation both slows down devices and causes devices to fail. For applications that require high performance, the possibility of very slow devices on critical paths forces designers to reduce clock speed in order to meet timing. For an important and emerging class of applications that target energy-minimal operation at the cost of delay, the impact of variation-induced defects at very low voltages mandates the sizing up of transistors and operation at higher voltages to maintain functionality. With post-fabrication configurability, FPGAs have the opportunity to self-measure the impact of variation, determining the speed and functionality of each individual resource. Given that information, a delay-aware router can use slow devices on non-critical paths, fast devices on critical paths, and avoid known defects. By mapping each component individually and customizing designs to a component's unique physical characteristics, we demonstrate that we can eliminate delay margins and reduce energy margins caused by variation. To quantify the potential benefit we might gain from component-specific mapping, we first measure the margins associated with parameter variation, and then focus primarily on the energy benefits of FPGA delay-aware routing over a wide range of predictive technologies (45 nm--12 nm) for the Toronto20 benchmark set. We show that relative to delay-oblivious routing, delay-aware routing without any significant optimizations can reduce minimum energy/operation by 1.72x at 22 nm. We demonstrate how to construct an FPGA architecture specifically tailored to further increase the minimum energy savings of component-specific mapping by using the following techniques: power gating, gate sizing, interconnect sparing, and LUT remapping. With all optimizations considered we show a minimum energy/operation savings of 2.66x at 22 nm, or 1.68--2.95x when considered across 45--12 nm. As there are many challenges to measuring resource delays and mapping per chip, we discuss methods that may make component-specific mapping more practical. We demonstrate that a simpler, defect-aware routing achieves 70% of the energy savings of delay-aware routing. Finally, we show that without variation tolerance, scaling from 16 nm to 12 nm results in a net increase in minimum energy/operation; component-specific mapping, however, can extend minimum energy/operation scaling to 12 nm and possibly beyond.</p

Parametric Yield of VLSI Systems under Variability: Analysis and Design Solutions

Variability has become one of the vital challenges that the designers of integrated circuits encounter. variability becomes increasingly important. Imperfect manufacturing process manifest itself as variations in the design parameters. These variations and those in the operating environment of VLSI circuits result in unexpected changes in the timing, power, and reliability of the circuits. With scaling transistor dimensions, process and environmental variations become significantly important in the modern VLSI design. A smaller feature size means that the physical characteristics of a device are more prone to these unaccounted-for changes. To achieve a robust design, the random and systematic fluctuations in the manufacturing process and the variations in the environmental parameters should be analyzed and the impact on the parametric yield should be addressed. This thesis studies the challenges and comprises solutions for designing robust VLSI systems in the presence of variations. Initially, to get some insight into the system design under variability, the parametric yield is examined for a small circuit. Understanding the impact of variations on the yield at the circuit level is vital to accurately estimate and optimize the yield at the system granularity. Motivated by the observations and results, found at the circuit level, statistical analyses are performed, and solutions are proposed, at the system level of abstraction, to reduce the impact of the variations and increase the parametric yield. At the circuit level, the impact of the supply and threshold voltage variations on the parametric yield is discussed. Here, a design centering methodology is proposed to maximize the parametric yield and optimize the power-performance trade-off under variations. In addition, the scaling trend in the yield loss is studied. Also, some considerations for design centering in the current and future CMOS technologies are explored. The investigation, at the circuit level, suggests that the operating temperature significantly affects the parametric yield. In addition, the yield is very sensitive to the magnitude of the variations in supply and threshold voltage. Therefore, the spatial variations in process and environmental variations make it necessary to analyze the yield at a higher granularity. Here, temperature and voltage variations are mapped across the chip to accurately estimate the yield loss at the system level. At the system level, initially the impact of process-induced temperature variations on the power grid design is analyzed. Also, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. Then, a statistical analysis of the timing yield is conducted, by taking into account both the process and environmental variations. By considering the statistical profile of the temperature and supply voltage, the process variations are mapped to the delay variations across a die. This ensures an accurate estimation of the timing yield. In addition, a method is proposed to accurately estimate the power yield considering process-induced temperature and supply voltage variations. This helps check the robustness of the circuits early in the design process. Lastly, design solutions are presented to reduce the power consumption and increase the timing yield under the variations. In the first solution, a guideline for floorplaning optimization in the presence of temperature variations is offered. Non-uniformity in the thermal profiles of integrated circuits is an issue that impacts the parametric yield and threatens chip reliability. Therefore, the correlation between the total power consumption and the temperature variations across a chip is examined. As a result, floorplanning guidelines are proposed that uses the correlation to efficiently optimize the chip's total power and takes into account the thermal uniformity. The second design solution provides an optimization methodology for assigning the power supply pads across the chip for maximizing the timing yield. A mixed-integer nonlinear programming (MINLP) optimization problem, subject to voltage drop and current constraint, is efficiently solved to find the optimum number and location of the pads

ILP-based Supply and Threshold Voltage Assignment For Total Power Minimization

In this paper we present an ILP-based method to simultaneously assign supply and threshold voltages to individual gates for dynamic and leakage power minimization. In our three-step approach, low power min-flipflop (FF) retiming is first performed to reduce the clock period while taking the FF delay/power into consideration. Next, the subsequent voltage assignment formulated in ILP makes the best possible supply/threshold voltage assignment under the given clock period constraint set by the retiming. Finally, a post-process further refines the voltage assignment solution by exploiting the remaining timing slack in the circuit. Related experiments show that the min-FF retiming plus simultaneous Vdd/Vth assignment approach outperforms the existing max-FF retiming plus Vdd-only assignment approach

Leakage Power Modeling and Reduction Techniques for Field Programmable Gate Arrays

FPGAs have become quite popular for implementing digital circuits and systems because of reduced costs and fast design cycles. This has led to increased complexity of FPGAs, and with technology scaling, many new challenges have come up for the FPGA industry, leakage power being one of the key challenges. The current generation FPGAs are being implemented in 90nm technology, therefore, managing leakage power in deep-submicron FPGAs has become critical for the FPGA industry to remain competitive in the semiconductor market and to enter the mobile applications domain. In this work an analytical state dependent leakage power model for FPGAs is developed, followed by dual-Vt based designs of the FPGA architecture for reducing leakage power. The leakage power model computes subthreshold and gate leakage in FPGAs, since these are the two dominant components of total leakage power in the scaled nanometer technologies. The leakage power model takes into account the dependency of gate and subthreshold leakage on the state of the circuit inputs. The leakage power model has two main components, one which computes the probability of a state for a particular FPGA circuit element, and the other which computes the leakage of the FPGA circuit element for a given input using analytical equations. This FPGA power model is particularly important for rapidly analyzing various FPGA architectures across different technology nodes. Dual-Vt based designs of the FPGA architecture are proposed, developed, and evaluated, for reducing the leakage power using a CAD framework. The logic and the routing resources of the FPGA are considered for dual-Vt assignment. The number of the logic elements that can be assigned high-Vt in the ideal case by using a dual-Vt assignment algorithm in the CAD framework is estimated. Based upon this estimate two kinds of architectures are developed and evaluated, homogeneous and heterogeneous architectures. Results indicate that leakage power savings of up to 50% can be obtained from these architectures. The analytical state dependent leakage power model developed has been used for estimating the leakage power savings from the dual-Vt FPGA architectures. The CAD framework that has been developed can also be used for developing and evaluating different dual-Vt FPGA architectures, other than the ones proposed in this work

A methodology for the design of dynamic accuracy operators by runtime back bias

Mobile and IoT applications must balance increasing processing demands with limited power and cost budgets. Approximate computing achieves this goal leveraging the error tolerance features common in many emerging applications to reduce power consumption. In particular, adequate (i.e., energy/quality-configurable) hardware operators are key components in an error tolerant system. Existing implementations of these operators require significant architectural modifications, hence they are often design-specific and tend to have large overheads compared to accurate units. In this paper, we propose a methodology to design adequate data-path operators in an automatic way, which uses threshold voltage scaling as a knob to dynamically control the power/accuracy tradeoff. The method overcomes the limitations of previous solutions based on supply voltage scaling, in that it introduces lower overheads and it allows fine-grain regulation of this tradeoff. We demonstrate our approach on a state-of-the-art 28nm FDSOI technology, exploiting the strong effect of back biasing on threshold voltage. Results show a power consumption reduction of as much as 39% compared to solutions based only on supply voltage scaling, at iso-accuracy

Cross-Layer Resiliency Modeling and Optimization: A Device to Circuit Approach

The never ending demand for higher performance and lower power consumption pushes the VLSI industry to further scale the technology down. However, further downscaling of technology at nano-scale leads to major challenges. Reduced reliability is one of them, arising from multiple sources e.g. runtime variations, process variation, and transient errors. The objective of this thesis is to tackle unreliability with a cross layer approach from device up to circuit level

Multi-objective digital circuit block optimisation based on cell mapping in an industrial electronic design automation flow

Abstract Modern electronic design automation (EDA) tools can handle the complexity of state‐of‐the‐art electronic systems by decomposing them into smaller blocks or cells, introducing different levels of abstraction and staged design flows. However, throughout each independently optimised design step, overheads and inefficiencies can accumulate in the resulting overall design. Performing design‐specific optimisation from a more global viewpoint requires more time due to the larger search space but has the potential to provide solutions with improved performanc. In this work, a fully‐automated, multi‐objective (MO) EDA flow is introduced to address this issue. It specifically tunes drive strength mapping, prior to physical implementation, through MO population‐based search algorithms. Designs are evaluated with respect to their power, performance and area (PPA). The proposed approach is aimed at digital circuit optimisation at the block level, where it is capable of expanding the design space and offers a set of trade‐off solutions for different case‐specific utilisation. We have applied the proposed multi‐objective electronic design automation flow (MOEDA) framework to ISCAS‐85 and EPFL benchmark circuits by using a commercial 65 nm standard cell library. The experimental results demonstrate how the MOEDA flow enhances the solutions initially generated by the standard digital flow and how simultaneously a significant improvement in PPA metrics is achieved