Design and analysis of a control system for an optical delay-line circuit used as reconfigurable gain equalizer

The design and analysis of a control system for a coherent two-port lattice-form optical delay-line circuit used as reconfigurable gain equalizer is presented. The design of the control system, which is based on a real device model and a least-square optimization method, is described in detail. Analysis on a five-stage device for the 32 possible solutions of phase parameters showed that, for some filter characteristics, the variations in power dissipation can vary up to a factor of 2. Furthermore, the solution selection has influence on the optimization result and number of iterations needed. A sensitivity analysis of the phase parameters showed that the allowable error in the phase parameters should not exceed a standard deviation of /spl pi//500 in order to achieve a total maximal absolute accuracy error not greater than approximately 0.6 dB. A five-stage device has been fabricated using planar lightwave circuit technology that uses the thermooptic effect. Excellent agreement between simulations and measurements has been achieved

Combined C-V/I-V and RTN CMOS Variability Characterization Using An On-Chip Measurement System

With the number of transistors integrated into a single integrated circuit (IC) crossing the one-billion mark and complementary metal-oxide-semiconductor (CMOS) technology scaling pushing device dimensions ever-so-close to atomic scales, variability in transistor performance is becoming the dominant constraint in modern-day CMOS IC design. Developing novel approaches for device characterization, which allow a detailed study of electrical transistor characteristics across large statistical sample sets, is crucial for the proper identification, characterization, and modeling of different physical sources of device variability. On-chip characterization methodologies have the potential to address all of these issues by enabling the characterization of large statistical device sample sets, while also allowing for high measurement quality and throughput. In this work, a fully-integrated system for on-chip combined capacitance-voltage (C-V) and current-voltage (I-V) characterization of a large integrated test transistor array implemented in a 45-nm bulk CMOS process is presented. On-chip I-V characterization is implemented using a four-point Kelvin measurement technique with 12-bit sub-10 nA current measurement resolution, 10-bit sub-1 mV voltage measurement resolution, and sampling speeds on the order of 100 kHz. C-V characterization is performed using a novel leakage- and parasitics-insensitive charge-based capacitance measurement (CBCM) technique with atto-Farad resolution. The on-chip system is employed in developing a comprehensive CMOS transistor variability characterization methodology, studying both random and systematic sources of quasi-static device variability. For the first time, combined C-V/I-V characterization of circuit-representative devices is demonstrated and used to extract variations in the under- lying physical parameters of the device. Additionally, the fast current sampling capabilities of the system are used for the characterization of random telegraph noise (RTN) in small area devices. An automated methodology for the extraction of RTN parameters is developed, and the statistics of RTN are studied across device type, bias, and geometry

Enhanced Model of Nonlinear Spiral High Voltage Divider

This paper deals with the enhanced accurate DC and RF model of nonlinear spiral polysilicon voltage divider. The high resistance polysilicon divider is a sensing part of the high voltage start-up MOSFET transistor that can operate up to 700 V. This paper presents the structure of a proposed model, implemented voltage, frequency and temperature dependency, and scalability. A special attention is paid to the ability of the created model to cover the mismatch and influence of a variation of process parameters on the device characteristics. Finally, the comparison of measured data vs. simulation is presented in order to confirm the model validity and a typical application is demonstrated

Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

On the Resilience of RTL NN Accelerators: Fault Characterization and Mitigation

Machine Learning (ML) is making a strong resurgence in tune with the massive generation of unstructured data which in turn requires massive computational resources. Due to the inherently compute- and power-intensive structure of Neural Networks (NNs), hardware accelerators emerge as a promising solution. However, with technology node scaling below 10nm, hardware accelerators become more susceptible to faults, which in turn can impact the NN accuracy. In this paper, we study the resilience aspects of Register-Transfer Level (RTL) model of NN accelerators, in particular, fault characterization and mitigation. By following a High-Level Synthesis (HLS) approach, first, we characterize the vulnerability of various components of RTL NN. We observed that the severity of faults depends on both i) application-level specifications, i.e., NN data (inputs, weights, or intermediate), NN layers, and NN activation functions, and ii) architectural-level specifications, i.e., data representation model and the parallelism degree of the underlying accelerator. Second, motivated by characterization results, we present a low-overhead fault mitigation technique that can efficiently correct bit flips, by 47.3% better than state-of-the-art methods.Comment: 8 pages, 6 figure

Characterisation and macro-modeling of patterned micronic and nano-scale dummy metal-fills in integrated circuits

In this paper, a wideband characterization and macro-modeling of patterned micronic and nano-scale dummy metal-fills is presented. Impacts of patterned dummy metal-fill topologies including square, cross, vertical and horizontal shaped arrays on electrical performances (isolation/coupling, attenuation, guiding properties, etc…) are investigated. The validity of the proposed macro-modeling methodology is demonstrated by comparison with high frequency measurements of dedicated carrier structures including on-chip interconnects and RF inductive loops. An original extraction approach, based on local ground concept, is proposed to capture high frequency behaviour of dummy metal-fill in physics-based compact broadband SPICE model. The RLC parameters are accurately derived using fully scalable closed-form semi-analytical expressions

Electricity from photovoltaic solar cells: Flat-Plate Solar Array Project final report. Volume VI: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project, funded by the U.S. Government and managed by the Jet Propulsion Laboratory, was formed in 1975 to develop the module/array technology needed to attain widespread terrestrial use of photovoltaics by 1985. To accomplish this, the FSA Project established and managed an Industry, University, and Federal Government Team to perform the needed research and development. This volume of the series of final reports documenting the FSA Project deals with the Project's activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety and reliability requirements of large-scale terrestrial photovoltaic systems applications. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis to define design shortfalls and, thus, areas requiring additional research and development. During the life of the FSA Project, these activities were known by and included a variety of evolving organizational titles: Design and Test, Large-Scale Procurements, Engineering, Engineering Sciences, Operations, Module Performance and Failure Analysis, and at the end of the Project, Reliability and Engineering Sciences. This volume provides both a summary of the approach and technical outcome of these activities and provides a complete Bibliography (Appendix A) of the published documentation covering the detailed accomplishments and technologies developed

Behavioral Models of I/O Ports from Measured Transient Waveforms

This paper addresses the development of accurate and efficient behavioral models of digital integrated circuit ports from measured transient responses. The proposed approach is based on the estimation of parametric models from port voltage and current waveforms. The modeling process is described and applied to the modeling of output ports. Its feasibility is demonstrated by the identification of a real device from actual measurements, and by the comparison of the predicted device response with the measured one