Charge recycling 8T SRAM design for low voltage robust operation

It is attractive to design power efficient and robust SRAM in low voltage and high performance systems for mobile or battery-powered electronics. To reduce the power consumption resulting from bit-line activities, a new bit-line charge recycling circuit is proposed for 8T SRAMs. By eliminating the use of analog blocks required in existing circuits in literature, this proposed charge recycling scheme results in less design complexity. In addition, two types of SRAM cells are employed to improve the robustness in write operation, and hierarchical bit-line structure is applied to reduce the power consumption in read operation. Post-layout simulations demonstrate the proposed design results in 3.08 and 2.62 times enhancement of WSNM and SWN compared to conventional 6T SRAM design in the same technology, respectively. The power consumption of proposed design results in a reduction of 64.2% and 27.5% in write and read power consumption compared to 6T SRAM design. Moreover, given the same supply voltage (e.g., 1.2 V), post-layout simulation shows the proposed design is able to run at 5 times higher clock rate than the existing designs in literature. Given the same clock frequency requirement (e.g., 100 MHz), a lower supply voltage (e.g., 0.7 V) can sustain robust operation of the proposed design

Embracing Low-Power Systems with Improvement in Security and Energy-Efficiency

As the economies around the world are aligning more towards usage of computing systems, the global energy demand for computing is increasing rapidly. Additionally, the boom in AI based applications and services has already invited the pervasion of specialized computing hardware architectures for AI (accelerators). A big chunk of research in the industry and academia is being focused on providing energy efficiency to all kinds of power hungry computing architectures. This dissertation adds to these efforts. Aggressive voltage underscaling of chips is one the effective low power paradigms of providing energy efficiency. This dissertation identifies and deals with the reliability and performance problems associated with this paradigm and innovates novel energy efficient approaches. Specifically, the properties of a low power security primitive have been improved and, higher performance has been unlocked in an AI accelerator (Google TPU) in an aggressively voltage underscaled environment. And, novel power saving opportunities have been unlocked by characterizing the usage pattern of a baseline TPU with rigorous mathematical analysis

6T CMOS SRAM Stability in Nanoelectronic Era: From Metrics to Built-in Monitoring

The digital technology in the nanoelectronic era is based on intensive data processing and battery-based devices. As a consequence, the need for larger and energy-efficient circuits with large embedded memories is growing rapidly in current system-on-chip (SoC). In this context, where embedded SRAM yield dominate the overall SoC yield, the memory sensitivity to process variation and aging effects has aggressively increased. In addition, long-term aging effects introduce extra variability reducing the failure-free period. Therefore, although stability metrics are used intensively in the circuit design phases, more accurate and non-invasive methodologies must be proposed to observe the stability metric for high reliability systems. This chapter reviews the most extended memory cell stability metrics and evaluates the feasibility of tracking SRAM cell reliability evolution implementing a detailed bit-cell stability characterization measurement. The memory performance degradation observation is focused on estimating the threshold voltage (Vth) drift caused by process variation and reliability mechanisms. A novel SRAM stability degradation measurement architecture is proposed to be included in modern memory designs with minimal hardware intrusion. The new architecture may extend the failure-free period by introducing adaptable circuits depending on the measured memory stability parameter

Ultra-low-power SRAM design in high variability advanced CMOS

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.Cataloged from PDF version of thesis.Includes bibliographical references (p. 163-181).Embedded SRAMs are a critical component in modern digital systems, and their role is preferentially increasing. As a result, SRAMs strongly impact the overall power, performance, and area, and, in order to manage these severely constrained trade-offs, they must be specially designed for target applications. Highly energy-constrained systems (e.g. implantable biomedical devices, multimedia handsets, etc.) are an important class of applications driving ultra-low-power SRAMs. This thesis analyzes the energy of an SRAM sub-array. Since supply- and threshold-voltage have a strong effect, targets for these are established in order to optimize energy. Despite the heavy emphasis on leakage-energy, analysis of a high-density 256x256 sub-array in 45nm LP CMOS points to two necessary optimizations: (1) aggressive supply-voltage reduction (in addition to Vt elevation), and (2) performance enhancement. Important SRAM metrics, including read/write/hold-margin and read-current, are also investigated to identify trade-offs of these optimizations. Based on the need to lower supply-voltage, a 0.35V 256kb SRAM is demonstrated in 65nm LP CMOS. It uses an 8T bit-cell with peripheral circuit-assists to improve write-margin and bit-line leakage. Additionally, redundancy, to manage the increasing impact of variability in the periphery, is proposed to improve the area-offset trade-off of sense-amplifiers, demonstrating promise for highly advanced technology nodes. Based on the need to improve performance, which is limited by density constraints, a 64kb SRAM, using an offset-compensating sense-amplifier, is demonstrated in 45nm LP CMOS with high-density 0.25[mu]m2 bit-cells.(cont.) The sense-amplifier is regenerative, but non -strobed, overcoming timing uncertainties limiting performance, and it is single-ended, for compatibility with 8T cells. Compared to a conventional strobed sense-amplifier, it achieves 34% improvement in worst-case access-time and 4x improvement in the standard deviation of the access-time.by Naveen Verma.Ph.D

High-Speed Electronic Memories and Memory Subsystems

Memories have played a vital role in embedded system architectures over the years. A need for high-speed memory to be embedded with state-of-the-art embedded system to improve its performance is essential. This chapter focuses on the development of high-speed memories. The traditional static random access memory (SRAM) is first analyzed with its different variant in terms of static noise margin (SNM); these cells occupy a larger area as compared to dynamic random access memory (DRAM) cell, and hence, a comprehensive analysis of DRAM cell is then carried out in terms of power consumption, read and write access time, and retention time. A faster new design of P-3T1D DRAM cell is proposed which has about 50% faster reading time as compared to the traditional three-transistor DRAM cell. A complete layout of the structure is drawn along with its implementation in a practical 16-bit memory subsystem

Low-Power Soft-Error-Robust Embedded SRAM

Soft errors are radiation-induced ionization events (induced by energetic particles like alpha particles, cosmic neutron, etc.) that cause transient errors in integrated circuits. The circuit can always recover from such errors as the underlying semiconductor material is not damaged and hence, they are called soft errors. In nanometer technologies, the reduced node capacitance and supply voltage coupled with high packing density and lack of masking mechanisms are primarily responsible for the increased susceptibility of SRAMs towards soft errors. Coupled with these are the process variations (effective length, width, and threshold voltage), which are prominent in scaled-down technologies. Typically, SRAM constitutes up to 90% of the die in microprocessors and SoCs (System-on-Chip). Hence, the soft errors in SRAMs pose a potential threat to the reliable operation of the system. In this work, a soft-error-robust eight-transistor SRAM cell (8T) is proposed to establish a balance between low power consumption and soft error robustness. Using metrics like access time, leakage power, and sensitivity to single event transients (SET), the proposed approach is evaluated. For the purpose of analysis and comparisons the results of 8T cell are compared with a standard 6T SRAM cell and the state-of-the-art soft-error-robust SRAM cells. Based on simulation results in a 65-nm commercial CMOS process, the 8T cell demonstrates higher immunity to SETs along with smaller area and comparable leakage power. A 32-kb array of 8T cells was fabricated in silicon. After functional verification of the test chip, a radiation test was conducted to evaluate the soft error robustness. As SRAM cells are scaled aggressively to increase the overall packing density, the smaller transistors exhibit higher degrees of process variation and mismatch, leading to larger offset voltages. For SRAM sense amplifiers, higher offset voltages lead to an increased likelihood of an incorrect decision. To address this issue, a sense amplifier capable of cancelling the input offset voltage is presented. The simulated and measured results in 180-nm technology show that the sense amplifier is capable of detecting a 4 mV differential input signal under dc and transient conditions. The proposed sense amplifier, when compared with a conventional sense amplifier, has a similar die area and a greatly reduced offset voltage. Additionally, a dual-input sense amplifier architecture is proposed with corroborating silicon results to show that it requires smaller differential input to evaluate correctly.1 yea

Low energy digital circuit design using sub-threshold operation

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2006.Includes bibliographical references (p. 189-202).Scaling of process technologies to deep sub-micron dimensions has made power management a significant concern for circuit designers. For emerging low power applications such as distributed micro-sensor networks or medical applications, low energy operation is the primary concern instead of speed, with the eventual goal of harvesting energy from the environment. Sub-threshold operation offers a promising solution for ultra-low-energy applications because it often achieves the minimum energy per operation. While initial explorations into sub-threshold circuits demonstrate its promise, sub-threshold circuit design remains in its infancy. This thesis makes several contributions that make sub-threshold design more accessible to circuit designers. First, a model for energy consumption in sub-threshold provides an analytical solution for the optimum VDD to minimize energy. Fitting this model to a generic circuit allows easy estimation of the impact of processing and environmental parameters on the minimum energy point. Second, analysis of device sizing for sub-threshold circuits shows the trade-offs between sizing for minimum energy and for minimum voltage operation.(cont.) A programmable FIR filter test chip fabricated in 0.18pum bulk CMOS provides measurements to confirm the model and the sizing analysis. Third, a low-overhead method for integrating sub-threshold operation with high performance applications extends dynamic voltage scaling across orders of magnitude of frequency and provides energy scalability down to the minimum energy point. A 90nm bulk CMOS test chip confirms the range of operation for ultra-dynamic voltage scaling. Finally, sub-threshold operation is extended to memories. Analysis of traditional SRAM bitcells and architectures leads to development of a new bitcell for robust sub-threshold SRAM operation. The sub-threshold SRAM is analyzed experimentally in a 65nm bulk CMOS test chip.by Benton H. Calhoun.Ph.D

Always-On 674uW @ 4GOP/s Error Resilient Binary Neural Networks with Aggressive SRAM Voltage Scaling on a 22nm IoT End-Node

Binary Neural Networks (BNNs) have been shown to be robust to random bit-level noise, making aggressive voltage scaling attractive as a power-saving technique for both logic and SRAMs. In this work, we introduce the first fully programmable IoT end-node system-on-chip (SoC) capable of executing software-defined, hardware-accelerated BNNs at ultra-low voltage. Our SoC exploits a hybrid memory scheme where error-vulnerable SRAMs are complemented by reliable standard-cell memories to safely store critical data under aggressive voltage scaling. On a prototype in 22nm FDX technology, we demonstrate that both the logic and SRAM voltage can be dropped to 0.5Vwithout any accuracy penalty on a BNN trained for the CIFAR-10 dataset, improving energy efficiency by 2.2X w.r.t. nominal conditions. Furthermore, we show that the supply voltage can be dropped to 0.42V (50% of nominal) while keeping more than99% of the nominal accuracy (with a bit error rate ~1/1000). In this operating point, our prototype performs 4Gop/s (15.4Inference/s on the CIFAR-10 dataset) by computing up to 13binary ops per pJ, achieving 22.8 Inference/s/mW while keeping within a peak power envelope of 674uW - low enough to enable always-on operation in ultra-low power smart cameras, long-lifetime environmental sensors, and insect-sized pico-drones.Comment: Submitted to ISICAS2020 journal special issu