A high speed Tri-Vision system for automotive applications

Purpose: Cameras are excellent ways of non-invasively monitoring the interior and exterior of vehicles. In particular, high speed stereovision and multivision systems are important for transport applications such as driver eye tracking or collision avoidance. This paper addresses the synchronisation problem which arises when multivision camera systems are used to capture the high speed motion common in such applications. Methods: An experimental, high-speed tri-vision camera system intended for real-time driver eye-blink and saccade measurement was designed, developed, implemented and tested using prototype, ultra-high dynamic range, automotive-grade image sensors specifically developed by E2V (formerly Atmel) Grenoble SA as part of the European FP6 project – sensation (advanced sensor development for attention stress, vigilance and sleep/wakefulness monitoring). Results : The developed system can sustain frame rates of 59.8 Hz at the full stereovision resolution of 1280 × 480 but this can reach 750 Hz when a 10 k pixel Region of Interest (ROI) is used, with a maximum global shutter speed of 1/48000 s and a shutter efficiency of 99.7%. The data can be reliably transmitted uncompressed over standard copper Camera-Link® cables over 5 metres. The synchronisation error between the left and right stereo images is less than 100 ps and this has been verified both electrically and optically. Synchronisation is automatically established at boot-up and maintained during resolution changes. A third camera in the set can be configured independently. The dynamic range of the 10bit sensors exceeds 123 dB with a spectral sensitivity extending well into the infra-red range. Conclusion: The system was subjected to a comprehensive testing protocol, which confirms that the salient requirements for the driver monitoring application are adequately met and in some respects, exceeded. The synchronisation technique presented may also benefit several other automotive stereovision applications including near and far-field obstacle detection and collision avoidance, road condition monitoring and others.Partially funded by the EU FP6 through the IST-507231 SENSATION project.peer-reviewe

Range imager performance comparison in homodyne and heterodyne operating modes

Range imaging cameras measure depth simultaneously for every pixel in a given field of view. In most implementations the basic operating principles are the same. A scene is illuminated with an intensity modulated light source and the reflected signal is sampled using a gain-modulated imager. Previously we presented a unique heterodyne range imaging system that employed a bulky and power hungry image intensifier as the high speed gain-modulation mechanism. In this paper we present a new range imager using an internally modulated image sensor that is designed to operate in heterodyne mode, but can also operate in homodyne mode. We discuss homodyne and heterodyne range imaging, and the merits of the various types of hardware used to implement these systems. Following this we describe in detail the hardware and firmware components of our new ranger. We experimentally compare the two operating modes and demonstrate that heterodyne operation is less sensitive to some of the limitations suffered in homodyne mode, resulting in better linearity and ranging precision characteristics. We conclude by showing various qualitative examples that demonstrate the system’s three-dimensional measurement performance

TechNews digests: Jan - Nov 2006

TechNews is a technology, news and analysis service aimed at anyone in the education sector keen to stay informed about technology developments, trends and issues. TechNews focuses on emerging technologies and other technology news. TechNews service : digests september 2004 till May 2010 Analysis pieces and News combined publish every 2 to 3 month

CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends

CMOS Image Sensors (CIS) are key for imaging technol-ogies. These chips are conceived for capturing opticalscenes focused on their surface, and for delivering elec-trical images, commonly in digital format. CISs may incor-porate intelligence; however, their smartness basicallyconcerns calibration, error correction and other similartasks. The term CVISs (CMOS VIsion Sensors) definesother class of sensor front-ends which are aimed at per-forming vision tasks right at the focal plane. They havebeen running under names such as computational imagesensors, vision sensors and silicon retinas, among others. CVIS and CISs are similar regarding physical imple-mentation. However, while inputs of both CIS and CVISare images captured by photo-sensors placed at thefocal-plane, CVISs primary outputs may not be imagesbut either image features or even decisions based on thespatial-temporal analysis of the scenes. We may hencestate that CVISs are more “intelligent” than CISs as theyfocus on information instead of on raw data. Actually,CVIS architectures capable of extracting and interpretingthe information contained in images, and prompting reac-tion commands thereof, have been explored for years inacademia, and industrial applications are recently ramp-ing up.One of the challenges of CVISs architects is incorporat-ing computer vision concepts into the design flow. Theendeavor is ambitious because imaging and computervision communities are rather disjoint groups talking dif-ferent languages. The Cellular Nonlinear Network Univer-sal Machine (CNNUM) paradigm, proposed by Profs.Chua and Roska, defined an adequate framework forsuch conciliation as it is particularly well suited for hard-ware-software co-design [1]-[4]. This paper overviewsCVISs chips that were conceived and prototyped at IMSEVision Lab over the past twenty years. Some of them fitthe CNNUM paradigm while others are tangential to it. Allthem employ per-pixel mixed-signal processing circuitryto achieve sensor-processing concurrency in the quest offast operation with reduced energy budget.Junta de Andalucía TIC 2012-2338Ministerio de Economía y Competitividad TEC 2015-66878-C3-1-R y TEC 2015-66878-C3-3-

Image capture using integrated 3D SoftChip technology

Mobile multimedia communication has rapidly become a significant area of research and development. The processing requirements for the capture, conversion, compression, decompression, enhancement, display, etc. of high quality multimedia content places heavy demands even on current ULSI (ultra large scale integration) systems, particularly for mobile applications where area and power are primary considerations. The system presented is designed as a vertically integrated (3D) system comprising two distinct layers bonded together using indium bump technology. The top layer is a CMOS imaging array containing analog-to-digital converters, and a buffer memory. The bottom layer takes the form of a configurable array processor (CAP), a highly parallel array of soft programmable processors capable of carrying out complex processing tasks directly on data stored in the top plane. Until recently, the dominant format of data in imaging devices has been analog. The analog photocurrent or sampled voltage is transferred to the ADC via a column or a column/row bus. In the proposed system, an array of analog-to-digital converters is distributed, so that a one-bit cell is associated with one sensor. The analog-to-digital converters are algorithmic current-mode converters. Eight such cells are cascaded to form an 8-bit converter. Additionally, each photosensor is equipped with a current memory cell, and multiple conversions are performed with scaled values of the photocurrent for colour processing

Field test of multi-hop image sensing network prototype on a city-wide scale

Open Access funded by Chongqing University of Posts and Telecommuniocations Under a Creative Commons license, https://creativecommons.org/licenses/by-nc-nd/4.0/Wireless multimedia sensor network drastically stretches the horizon of traditional monitoring and surveillance systems, of which most existing research have utilised Zigbee or WiFi as the communication technology. Both technologies use ultra high frequencies (mainly 2.4 GHz) and suffer from relatively short transmission range (i.e. 100 m line-of-sight). The objective of this paper is to assess the feasibility and potential of transmitting image information using RF modules with lower frequencies (e.g. 433 MHz) in order to achieve a larger scale deployment such as a city scenario. Arduino platform is used for its low cost and simplicity. The details of hardware properties are elaborated in the article, followed by an investigation of optimum configurations for the system. Upon an initial range testing outcome of over 2000 m line-of-sight transmission distance, the prototype network has been installed in a real life city plot for further examination of performance. A range of suitable applications has been proposed along with suggestions for future research.Peer reviewe

Depth Fields: Extending Light Field Techniques to Time-of-Flight Imaging

A variety of techniques such as light field, structured illumination, and time-of-flight (TOF) are commonly used for depth acquisition in consumer imaging, robotics and many other applications. Unfortunately, each technique suffers from its individual limitations preventing robust depth sensing. In this paper, we explore the strengths and weaknesses of combining light field and time-of-flight imaging, particularly the feasibility of an on-chip implementation as a single hybrid depth sensor. We refer to this combination as depth field imaging. Depth fields combine light field advantages such as synthetic aperture refocusing with TOF imaging advantages such as high depth resolution and coded signal processing to resolve multipath interference. We show applications including synthesizing virtual apertures for TOF imaging, improved depth mapping through partial and scattering occluders, and single frequency TOF phase unwrapping. Utilizing space, angle, and temporal coding, depth fields can improve depth sensing in the wild and generate new insights into the dimensions of light's plenoptic function.Comment: 9 pages, 8 figures, Accepted to 3DV 201

Single chip camera device having double sampling operation

A single chip camera device is formed on a single substrate including an image acquisition portion for control portion and the timing circuit formed on the substrate. The timing circuit also controls the photoreceptors in a double sampling mode in which are reset level is first read and then after an integration time a charged level is read