A micro-electro-mechanical-system-based thermal shear-stress sensor with self-frequency compensation

By applying the micro-electro-mechanical-system (MEMS) fabrication technology, we developed a micro-thermal sensor to measure surface shear stress. The heat transfer from a polysilicon heater depends on the normal velocity gradient and thus provides the surface shear stress. However, the sensitivity of the shear-stress measurements in air is less than desirable due to the low heat capacity of air. A unique feature of this micro-sensor is that the heating element, a film 1 µm thick, is separated from the substrate by a vacuum cavity 2 µm thick. The vacuum cavity prevents the conduction of heat to the substrate and therefore improves the sensitivity by an order of magnitude. Owing to the low thermal inertia of the miniature sensing element, this shear-stress micro-sensor can provide instantaneous measurements of small-scale turbulence. Furthermore, MEMS technology allows us make multiple sensors on a single chip so that we can perform distributed measurements. In this study, we use multiple polysilicon sensor elements to improve the dynamic performance of the sensor itself. It is demonstrated that the frequency-response range of a constant-current sensor can be extended from the order of 100 Hz to 100 kHz

Temperature and heat flux measurements: Challenges for high temperature aerospace application

The measurement of high temperatures and the influence of heat transfer data is not strictly a problem of either the high temperatures involved or the level of the heating rates to be measured at those high temperatures. It is a problem of duration during which measurements are made and the nature of the materials in which the measurements are made. Thermal measurement techniques for each application must respect and work with the unique features of that application. Six challenges in the development of measurement technology are discussed: (1) to capture the character and localized peak values within highly nonuniform heating regions; (2) to manage large volumes of thermal instrumentation in order to efficiently derive critical information; (3) to accommodate thermal sensors into practical flight structures; (4) to broaden the capabilities of thermal survey techniques to replace discrete gages in flight and on the ground; (5) to provide supporting instrumentation conduits which connect the measurement points to the thermally controlled data acquisition system; and (6) to develop a class of 'vehicle tending' thermal sensors to assure the integrity of flight vehicles in an efficient manner

Bridges Structural Health Monitoring and Deterioration Detection Synthesis of Knowledge and Technology

INE/AUTC 10.0

Significant Phonon Drag Enables High Power Factor in the AlGaN/GaN Two-Dimensional Electron Gas

In typical thermoelectric energy harvesters and sensors, the Seebeck effect is caused by diffusion of electrons or holes in a temperature gradient. However, the Seebeck effect can also have a phonon drag component, due to momentum exchange between charge carriers and lattice phonons, which is more difficult to quantify. Here, we present the first study of phonon drag in the AlGaN/GaN two-dimensional electron gas (2DEG). We find that phonon drag does not contribute significantly to the thermoelectric behavior of devices with ~100 nm GaN thickness, which suppress the phonon mean free path. However, when the thickness is increased to ~1.2 $\mu$m, up to 32% (88%) of the Seebeck coefficient at 300 K (50 K) can be attributed to the drag component. In turn, the phonon drag enables state-of-the-art thermoelectric power factor in the thicker GaN film, up to ~40 mW m$^{-1}$ K$^{-2}$ at 50 K. By measuring the thermal conductivity of these AlGaN/GaN films, we show that the magnitude of the phonon drag can increase even when the thermal conductivity decreases. Decoupling of thermal conductivity and Seebeck coefficient could enable important advancements in thermoelectric power conversion with devices based on 2DEGs

Advanced sensors technology survey

This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

Smart polymeric temperature sensors – for biological systems

The damaged brain is vulnerable to increase in brain temperature after a severe head injury. Continuous monitoring of intracranial temperature depicts functionality essential to the treatment of brain injury Many innovations have been made in the biomedical industry relying on electronic implants in treating condition such as traumatic brain injury (TBI) or other cerebral diseases. Hence, a methodical and reliable way to measure the temperature is crucial to assess the patient’s situation. In this investigation, an analysis of various approaches to detect the change in the temperature due to resistance, current-voltage characteristics with respect to time has been evaluated. Also, studies describing various materials used in sensors, their working principles and the results anticipated in these discrete procedures are presented. These smart temperature sensors have provided the accuracy and the stability compared to earlier methods used to detect the change in brain temperature since temperature is one of the most important variables in brain monitoring

An FPGA Noise Resistant Digital Temperature Sensor with Auto Calibration

In recent years, thermal sensing in digital devices has become increasingly important. From a security perspective, new thermal-based attacks have revealed vulnerabilities in digital devices. Traditional temperature sensors using analog-to-digital converters consume significant power and are not conducive to rapid development. As a result, there has been an escalating demand for low cost, low power digital temperature sensors that can be seamlessly integrated onto digital devices. This research seeks to create a modular Field Programmable Gate Array digital temperature sensor with auto one-point calibration to eliminate the excessive costs and time associated with calibrating existing digital temperature sensors. In addition, to support the auxiliary protection role, the sensor is evaluated alongside a RSA circuit implemented on the same chip, with methods developed to mitigate noise and power fluctuations introduced by the main circuit. The result is a digital temperature sensor resistant to noise and suitable for quick mass deployment in digital devices

Using smart sensor strings for continuous monitoring of temperature stratification in large water bodies

Copyright © 2006 IEEEA "smart" thermistor string for continuous long-term temperature profiling in large water bodies is described allowing highly matched yet low-cost spatial and temporal temperature measurements. The sensor uses the three-wire SDI-12 communications standard to enable a low-powered radio or data logger on supporting buoys to command measurements and retrieve high-resolution temperature data in digital form. Each "smart" temperature sensor integrates a thermistor element, measurement circuitry, power control, calibration coefficient storage, temperature computation, and data communications. Multiple addressable sensors at discrete vertical depths are deployed along a three-wire cable that provides power and allows data transfer at regular intervals. Circuit, manufacturing, and automated calibration techniques allow temperature measurements with a resolution of plusmn0.003degC, and with intersensor matching of plusmn0.006degC. The low cost of each sensor is achieved by using poor tolerance thermistor and circuit components in conjunction with a 15-bit charge-balance analog-to-digital converter. Sensor inaccuracies and temperature coefficients are corrected by a two-point calibration procedure made possible by a standard-curve generator within the sensor, based upon the method of finite differences. This two-point calibration process allows in-field sensor string calibration in stratified water bodies and provides a means to correct for long-term calibration drift without having to return the string to a laboratory.Andrew J. Skinner and Martin F. Lamber

Soft capacitor fibers using conductive polymers for electronic textiles

A novel, highly flexible, conductive polymer-based fiber with high electric capacitance is reported. In its crossection the fiber features a periodic sequence of hundreds of conductive and isolating plastic layers positioned around metallic electrodes. The fiber is fabricated using fiber drawing method, where a multi-material macroscopic preform is drawn into a sub-millimeter capacitor fiber in a single fabrication step. Several kilometres of fibers can be obtained from a single preform with fiber diameters ranging between 500um -1000um. A typical measured capacitance of our fibers is 60-100 nF/m and it is independent of the fiber diameter. For comparison, a coaxial cable of the comparable dimensions would have only ~0.06nF/m capacitance. Analysis of the fiber frequency response shows that in its simplest interrogation mode the capacitor fiber has a transverse resistance of 5 kOhm/L, which is inversely proportional to the fiber length L and is independent of the fiber diameter. Softness of the fiber materials, absence of liquid electrolyte in the fiber structure, ease of scalability to large production volumes, and high capacitance of our fibers make them interesting for various smart textile applications ranging from distributed sensing to energy storage