125 research outputs found

    Accurate Jitter Decomposition in High-Speed Links

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    In a high-speed digital communication system, jitter performance plays a crucial role in Bit-Error Rate (BER). It is important to accurately derive each type of jitter as well as total jitter (TJ) and to identify the root causes of jitter by jitter decomposition. In this work, we propose new jitter decomposition techniques in high-speed links testing. The background of jitter decomposition is described in chapter 1. In chapter 2, duty cycle distortion jitter amplification is introduced. As channel loss results in both ISI and jitter amplification, DCD amplification is a big concern in high-speed links. The derivation of a formula of DCD amplification for data channels is included and the calculation result matches the time-domain simulation in the system. Chapter 3 provides an accurate jitter decomposition algorithm using Least Squares (LS) which simultaneously separates ISI, RJ, and PJ. A new time domain ISI model is proposed, which is faster and more accurate than the conventional ISI model. This algorithm obtains the estimated individual jitter component value with fine accuracy by using less samples of total jitter data compared with conventional methods. The simulation and measurement show the accuracy and efficiency of this algorithm with less data samples. In chapter 4, a low-cost comparator-based jitter decomposition algorithm is proposed. Instead of using TIE jitter sequence to decompose, it uses a low cost and simple comparator network to identify the deviation of current sampling positions from the ideal sampling positions to represent the TIE. It simultaneously separates ISI, DCD, and PJ and can achieve similar accuracy compared to the instrument test. Both the simulation and measurement show the decomposition algorithm with great accuracy and efficiency. In chapter 5, a low cost and simple dithering method to improve the test of linearity of analog-to-digital converter (ADC) is proposed. This method exhibits an improvement and enhancement for the ultra-fast segmented model identification of linearity error (uSMILE) algorithm which reduces 99% of the test time compared to the conventional method. In this study, we proposed three types of distribution dithering methods adding to the ramp input signal to reduce the estimation error when uSMILE was applied in low resolution ADCs. The fix pattern distribution was proved as the most efficient and cost-effective method by comparing with the Gaussian, uniform, and fix-pattern distributions. Both the simulation results and hardware measurement indicate that the estimation error can be significantly reduced in 12-bit SAR ADC with effective dithering

    Methodology for testing high-performance data converters using low-accuracy instruments

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    There has been explosive growth in the consumer electronics market during the last decade. As the IC industry is shifting from PC-centric to consumer electronics-centric, digital technologies are no longer solving all the problems. Electronic devices integrating mixed-signal, RF and other non-purely digital functions are becoming new challenges to the industry. When digital testing has been studied for long time, testing of analog and mixed-signal circuits is still in its development stage. Existing solutions have two major problems. First, high-performance mixed-signal test equipments are expensive and it is difficult to integrate their functions on chip. Second, it is challenging to improve the test capability of existing methods to keep up with the fast-evolving performance of mixed-signal products demanded on the market. The International Technology Roadmap for Semiconductors identified mixed-signal testing as one of the most daunting system-on-a-chip challenges;My works have been focused on developing new strategies for testing the analog-to-digital converter (ADC) and digital-to-analog converter (DAC). Different from conventional methods that require test instruments to have better performance than the device under test, our algorithms allow the use of medium and low-accuracy instruments in testing. Therefore, we can provide practical and accurate test solutions for high-performance data converters. Meanwhile, the test cost is dramatically reduced because of the low price of such test instruments. These algorithms have the potential for built-in self-test and can be generalized to other mixed-signal circuitries. When incorporated with self-calibration, these algorithms can enable new design techniques for mixed-signal integrated circuits. Following contents are covered in the dissertation:;(1) A general stimulus error identification and removal (SEIR) algorithm that can test high-resolution ADCs using two low-linearity signals with a constant offset in between; (2) A center-symmetric interleaving (CSI) strategy for generating test signals to be used with the SEIR algorithm; (3) An architecture-based test algorithm for high-performance pipelined or cyclic ADCs using a single nonlinear stimulus; (4) Using Kalman Filter to improve the efficiency of ADC testing; and (5) A testing algorithm for high-speed high-resolution DACs using low-resolution ADCs with dithering

    Built-in self-test and self-calibration for analog and mixed signal circuits

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    Analog-to-digital converters (ADC) are one of the most important components in modern electronic systems. In the mission-critical applications such as automotive, the reliability of the ADC is critical as the ADC impacts the system level performance. Due to the aging effect and environmental changes, the performance of the ADC may degrade and even fail to meet the accuracy requirement over time. Built-in self-test (BIST) and self-calibration are becoming the ultimate solution to achieve lifetime reliability. This dissertation introduces two ADC testing algorithms and two ADC built-in self-test circuit implementations to test the ADC integral nonlinearity (INL) and differential nonlinearity (DNL) on-chip. In the first testing algorithm, the ultrafast stimulus error removal and segmented model identification of linearity errors (USER-SMILE) is developed for ADC built-in self-test, which eliminates the need for precision stimulus and reduces the overall test time. In this algorithm, the ADC is tested twice with a nonlinear ramp, instead of using a linear ramp signal. Therefore, the stimulus can be easily generated on-chip in a low-cost way. For the two ramps, there is a constant voltage shift in between. As the input stimulus linearity is completely relaxed, there is no requirement on the waveform of the input stimulus as long as it covers the ADC input range. In the meantime, the high-resolution ADC linearity is modeled with segmented parameters, which reduces the number of samples required for achieving high-precision test, thus saving the test time. As a result, the USER-SMILE algorithm is able to use less than 1 sample/code nonlinear stimulus to test high resolution ADCs with less than 0.5 least significant bit (LSB) INL estimation error, achieving more than 10-time test time reduction. This algorithm is validated with both board-level implementation and on-chip silicon implementation. The second testing algorithm is proposed to test the INL/DNL for multi-bit-per-stages pipelined ADCs with reduced test time and better test coverage. Due to the redundancy characteristics of multi-bit-per-stages pipelined ADC, the conventional histogram test cannot estimate and calibrate the static linearity accurately. The proposed method models the pipelined ADC nonlinearity as segmented parameters with inter-stage gain errors using the raw codes instead of the final output codes. During the test phase, a pure sine wave is sent to the ADC as the input and the model parameters are estimated from the output data with the system identification method. The modeled errors are then removed from the digital output codes during the calibration phase. A high-speed 12-bit pipelined ADC is tested and calibrated with the proposed method. With only 4000 samples, the 12-bit ADC is accurately tested and calibrated to achieve less than 1 LSB INL. The ADC effective number of bits (ENOB) is improved from 9.7 bits to 10.84 bits and the spurious-free dynamic range (SFDR) is improved by more than 20dB after calibration. In the first circuit implementation, a low-cost on-chip built-in self-test solution is developed using an R2R digital-to-analog converter (DAC) structure as the signal generator and the voltage shift generator for ADC linearity test. The proposed DAC is a subradix-2 R2R DAC with a constant voltage shift generation capability. The subradix-2 architecture avoids positive voltage gaps caused by mismatches, which relaxes the DAC matching requirements and reduces the design area. The R2R DAC based BIST circuit is fabricated in TSMC 40nm technology with a small area of 0.02mm^2. Measurement results show that the BIST circuit is capable of testing a 15-bit ADC INL accurately with less than 0.5 LSB INL estimation error. In the second circuit implementation, a complete SAR ADC built-in self-test solution using the USER-SMILE is developed and implemented in a 28nm automotive microcontroller. A low-cost 12-bit resistive DAC with less than 12-bit linearity is used as the signal generator to test and calibrate a SAR ADC with a target linearity of 12 bits. The voltage shift generation is created inside the ADC with capacitor switching. The entire algorithm processing unit for USER-SMILE algorithm is also implemented on chip. The final testing results are saved in the memory for further digital calibration. Both the total harmonic distortion (THD) and the SFDR are improved by 20dB after calibration, achieving -84.5dB and 86.5dB respectively. More than 700 parts are tested to verify the robustness of the BIST solution

    A 14-bit 250 MS/s IF Sampling Pipelined ADC in 180 nm CMOS Process

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    This paper presents a 14-bit 250 MS/s ADC fabricated in a 180 nm CMOS process, which aims at optimizing its linearity, operating speed, and power efficiency. The implemented ADC employs an improved SHA with parasitic optimized bootstrapped switches to achieve high sampling linearity over a wide input frequency range. It also explores a dedicated foreground calibration to correct the capacitor mismatches and the gain error of residue amplifier, where a novel configuration scheme with little cost for analog front-end is developed. Moreover, a partial non-overlapping clock scheme associated with a high-speed reference buffer and fast comparators is proposed to maximize the residue settling time. The implemented ADC is measured under different input frequencies with a sampling rate of 250 MS/s and it consumes 300 mW from a 1.8 V supply. For 30 MHz input, the measured SFDR and SNDR of the ADC is 94.7 dB and 68.5 dB, which can remain over 84.3 dB and 65.4 dB for up to 400 MHz. The measured DNL and INL after calibration are optimized to 0.15 LSB and 1.00 LSB, respectively, while the Walden FOM at Nyquist frequency is 0.57 pJ/step

    Fully digital-compatible built-in self-test solutions to linearity testing of embedded mixed-signal functions

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    Mixed-signal circuits, especially analog-to-digital and digital-to-analog converters, are the most widely used circuitry in electronic systems. In the most of the cases, mixed-signal circuits form the interface between the analog and digital worlds and enable the processing and recovering of the real-world information. Performance of mixed-signal circuits, such as linearity and noise, are then critical to any applications. Conventionally, mixed-signal circuits are tested by mixed-signal automatic test equipment (ATE). However, along with the continuous performance improvement, using conventionally methods increases test costs significantly since it takes much more time to test high-performance parts than low-performance ones and mixed-signal ATE testers could be extremely expensive depending on the test precision they provide. Another factor that makes mixed-signal testing more and more challenging is the advance of the integration level. In the popular system-on-chip applications, mixed-signal circuits are deeply embedded in the systems. With less observability and accessibility, conventionally external test methods can not guarantee the precision of the source signals and evaluations. Test performance is then degraded. This work investigates new methods using digital testers incorporated with on-chip, built-in self-test circuits to test the linearity performance of data converters with less test cost and better test performance. Digital testers are cheap to use since they only offer logic signals with direct connections. The analog sourcing and evaluation capabilities have to be absorbed by the on-chip BIST circuits, which, meanwhile, could benefit the test performance with access to the internal circuit nodes. The main challenge of the digital-compatible BIST methods is to implement the BIST circuits with enough high test performance but with low design complexity and cost. High-resolution data converter testing needs much higher-precision analog source signals and evaluation circuits. However, high-precision analog circuits are conventionally hard to design and costly, and their performance is subject to mismatch errors and process variations and cannot be guaranteed without careful testing. On the digital side, BIST circuits usually conduct procedure control and data processing. To make the BIST solution more universal, the control and processing performed by the digital BIST circuits should be simple and not rely on any complex microcontroller and DSP block. Therefore, the major tasks of this dissertation are 1) performance-robust analog BIST circuit design and 2) test procedure development. Analog BIST circuits in this work consist of only low-accuracy analog components, which are usually easy to design and cost effective. The precision is then obtained by applying the so-called deterministic dynamic element matching technique to the low-accuracy analog cells. The test procedure and data processing designed for the BIST system are simple and can be implemented by small logic circuits. In this dissertation, we discuss the proposed BIST solutions to ADC and DAC linearity testing in chapter 3 and chapter 5, respectively. In each case, the structure of the test system, the test procedure, and the theoretical analysis of the test performance are presented. Simulation results are shown to verify the efficacy of the methods. The ADC BIST system is also verified experimentally. In addition, chapter 4 introduces a system-identification based reduced-code testing method for pipeline ADCs. This method is able to reduce test time by more than 95%. And it is compatible with the proposed BIST method discussed in chapter 3

    The design of calibration circuit for analog-to-digital converter (ADC).

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    Dua jenis (Jenis 1 dan Jenis 2) litar tentukuran untuk ADC saluran maklumat telah direka bentuk menggunakan kod Verilog-A yang boleh didapati daripada arkib ahdlib dari alat simulasi perisian Cadence Virtuoso. Kod yang diguna pakai telah diubahsuai bagi memenuhi litar tentukuran yang dicadangkan. Dua blok ADC saluran maklumat yang sama (ADC saluran maklumat 1 dan ADC saluran maklumat 2) direalisasi menggunakan 130nm proses Silterra CMOS dengan setiap ADC mempunyai output digital 4-bit masing-masing. Voltan rujukan pada 600mV digunakan dalam operasi ADC saluran maklumat ini dengan bekalan kuasa 1.2V bagi Vdd dan 0V bagi Vss. ADC saluran maklumat beroperasi pada frekuensi pensampelan 2.2727MHz dengan frekuensi input dari DC ke 1.1364 MHz. Julat Voltan input ADC saluran maklumat adalah dari 300 mV ke 900 mV dengan voltan pertengahan pada 600 mV. Peringkat-peringkat saluran maklumat yang digunakan dalam pembinaan kedua-dua ADC saluran maklumat mengunakan litar Pendaraban Digital-ke-Analog Penukar (MDAC). Litar MDAC adalah berdasarkan kepada konfigurasi 1.5-bit suis-kapasitor dengan penguat kendalian (op-amp) pengamiran sepenuhnya yang mempunyai gandaan hampir 2. Pembetulan Ralat Digital (DEC) juga dicadangkan menggunakan kod Verilog-A pada dua blok, pengatur-masa dan penambah 4-bit. Tiada konsep pembetulan secara isyarat digunakan dalam litar tentukuran yang dicadangkan, membolehkan litar MDAC yang sama digunakan tanpa pengubahsuaian. Pejana palsu-rawak (PN) tidak digunakan dalam litar tentukuran yang dicadangkan. INL yang dicapai dengan tentukuran jenis litar 1 adalah dari maksimum 1 LSB ke minimum -1 LSB . Untuk tentukuran jenis litar 2 , INL yang dicapai adalah maksimum 1 LSB dan minimum 0 LSB . DNL yang dicapai dengan jenis 1 adalah dari maksimum 0 LSB ke minimum -1 LSB manakala jenis 2 mencapai 0 LSB . Two types (Type 1 and Type 2) of calibration circuits for the pipelined ADC was desgined using Verilog-A code modeling available from ahdlib Library of the Cadence Virtuoso tool. The modelling codes were modified to suit the proposed calibration circuit. Two identical pipelined ADC blocks (Pipelined ADC 1 and Pipelined ADC 2) were realized in 130nm Silterra CMOS process with each ADC having a 4-bit digital output respectively. A reference voltage of 600mV was used in the operation of the pipelined ADC with power supply connected to 1.2V for Vdd and ground GND for Vss. The pipelined ADC operates at a sampling frequency of 2.2727MHz with input frequency from DC to 1.1364MHz. The input range voltage of the pipelined ADC is 300mV to 900mV with common-mode voltage of 600mV. Stages used in the construction of each pipelined ADCs employed Multiplying Digital-to-Analog Converter (MDAC) circuit architecture. The MDAC circuit is based on the 1.5-bit switched capacitor configuration with fully-differential operational amplifier (op-amp) gain or radix of approximately 2. A Digital Error Correction (DEC) was also proposed using Verilog-A code modeling where two blocks, time-align block and 4-bit adder made up the DEC block. No dithering signal or concept was used in the proposed calibration circuit, enabling the same MDAC circuit to be used with no modifications. A DNL of 0 LSB was achieved when calibration was enabled. The INL achieved by Calibration circuit type 1 is from maximum +1 LSB to minimum -1 LSB. For the Calibration circuit type 2, INL achieved is maximum +1 LSB and minimum 0 LSB. The DNL achieved by type 1 is from maximum 0 LSB to minimum -1 LSB while type 2 achieved 0 LSB

    Low Power and Small Area Mixed-Signal Circuits:ADCs, Temperature Sensors and Digital Interfaces

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    Bidirectional Neural Interface Circuits with On-Chip Stimulation Artifact Reduction Schemes

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    Bidirectional neural interfaces are tools designed to “communicate” with the brain via recording and modulation of neuronal activity. The bidirectional interface systems have been adopted for many applications. Neuroscientists employ them to map neuronal circuits through precise stimulation and recording. Medical doctors deploy them as adaptable medical devices which control therapeutic stimulation parameters based on monitoring real-time neural activity. Brain-machine-interface (BMI) researchers use neural interfaces to bypass the nervous system and directly control neuroprosthetics or brain-computer-interface (BCI) spellers. In bidirectional interfaces, the implantable transducers as well as the corresponding electronic circuits and systems face several challenges. A high channel count, low power consumption, and reduced system size are desirable for potential chronic deployment and wider applicability. Moreover, a neural interface designed for robust closed-loop operation requires the mitigation of stimulation artifacts which corrupt the recorded signals. This dissertation introduces several techniques targeting low power consumption, small size, and reduction of stimulation artifacts. These techniques are implemented for extracellular electrophysiological recording and two stimulation modalities: direct current stimulation for closed-loop control of seizure detection/quench and optical stimulation for optogenetic studies. While the two modalities differ in their mechanisms, hardware implementation, and applications, they share many crucial system-level challenges. The first method aims at solving the critical issue of stimulation artifacts saturating the preamplifier in the recording front-end. To prevent saturation, a novel mixed-signal stimulation artifact cancellation circuit is devised to subtract the artifact before amplification and maintain the standard input range of a power-hungry preamplifier. Additional novel techniques have been also implemented to lower the noise and power consumption. A common average referencing (CAR) front-end circuit eliminates the cross-channel common mode noise by averaging and subtracting it in analog domain. A range-adapting SAR ADC saves additional power by eliminating unnecessary conversion cycles when the input signal is small. Measurements of an integrated circuit (IC) prototype demonstrate the attenuation of stimulation artifacts by up to 42 dB and cross-channel noise suppression by up to 39.8 dB. The power consumption per channel is maintained at 330 nW, while the area per channel is only 0.17 mm2. The second system implements a compact headstage for closed-loop optogenetic stimulation and electrophysiological recording. This design targets a miniaturized form factor, high channel count, and high-precision stimulation control suitable for rodent in-vivo optogenetic studies. Monolithically integrated optoelectrodes (which include 12 µLEDs for optical stimulation and 12 electrical recording sites) are combined with an off-the-shelf recording IC and a custom-designed high-precision LED driver. 32 recording and 12 stimulation channels can be individually accessed and controlled on a small headstage with dimensions of 2.16 x 2.38 x 0.35 cm and mass of 1.9 g. A third system prototype improves the optogenetic headstage prototype by furthering system integration and improving power efficiency facilitating wireless operation. The custom application-specific integrated circuit (ASIC) combines recording and stimulation channels with a power management unit, allowing the system to be powered by an ultra-light Li-ion battery. Additionally, the µLED drivers include a high-resolution arbitrary waveform generation mode for shaping of µLED current pulses to preemptively reduce artifacts. A prototype IC occupies 7.66 mm2, consumes 3.04 mW under typical operating conditions, and the optical pulse shaping scheme can attenuate stimulation artifacts by up to 3x with a Gaussian-rise pulse rise time under 1 ms.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147674/1/mendrela_1.pd
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