White paper on the future of plasma science and technology in plastics and textiles

This is the peer reviewed version of the following article: “Uros, C., Walsh, J., Cernák, M., Labay, C., Canal, J.M., Canal, C. (2019) White paper on the future of plasma science and technology in plastics and textiles. Plasma processes and polymers, 16 1 which has been published in final form at [doi: 10.1002/ppap.201700228]. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving."This white paper considers the future of plasma science and technology related to the manufacturing and modifications of plastics and textiles, summarizing existing efforts and the current state‐of‐art for major topics related to plasma processing techniques. It draws on the frontier of plasma technologies in order to see beyond and identify the grand challenges which we face in the following 5–10 years. To progress and move the frontier forward, the paper highlights the major enabling technologies and topics related to the design of surfaces, coatings and materials with non‐equilibrium plasmas. The aim is to progress the field of plastics and textile production using advanced plasma processing as the key enabling technology which is environmentally friendly, cost efficient, and offers high‐speed processingPeer ReviewedPostprint (author's final draft

Micro/Nano Structures and Systems

Micro/Nano Structures and Systems: Analysis, Design, Manufacturing, and Reliability is a comprehensive guide that explores the various aspects of micro- and nanostructures and systems. From analysis and design to manufacturing and reliability, this reprint provides a thorough understanding of the latest methods and techniques used in the field. With an emphasis on modern computational and analytical methods and their integration with experimental techniques, this reprint is an invaluable resource for researchers and engineers working in the field of micro- and nanosystems, including micromachines, additive manufacturing at the microscale, micro/nano-electromechanical systems, and more. Written by leading experts in the field, this reprint offers a complete understanding of the physical and mechanical behavior of micro- and nanostructures, making it an essential reference for professionals in this field

E-Textiles. Study of the interaction between devices, connection methods and substrates

It is common knowledge that textiles and textile products are available in different forms along the textile chain. However, right now, all the attention is paid to the relationship between these materials and the most recent developments in the world of electronics. When a garment is implementing electronic components, ranging from sensors to conductor paths, that are applied or integrated into the textile surface, it’s commonly called an E-Textile. Nowadays there is a continuous demand for these products because they can satisfy a great extent of needs without interfering too much with the user’s life or without the obligation of modifying too much the original product in the beginning. This study, however, focuses on analyzing the interaction and interactivity which allows electronic communication between the components present in the textiles. It is believed that there is a knowledge gap in these most recent developments. In this paper, a literature investigation is carried out using various databases, which resulted in different contributions to the researched subjects. Also, an overview of materials, production technologies and testing methods is given. The concepts of smart and e-textile, textile structure, conductive materials, electronic communication and connection are classified. The influencing factors on the properties of the material structure are presented and a discussion is made referring to the potentials and challenges related to e-textiles. Finally, a brief consideration of sustainability and environmental aspects is done and, in the end, the main conclusions of the investigation are stated. The main focus of the research lies in defining processes and material properties for improving connection techniques between the textiles and the electronic components, and also between the components themselves. Only limited research will be conducted on simulating the behavior of these technologies. Various ideas for applications exist, starting from ones of classical nature (flexural rigid materials), to 3d printed additive manufacturing or other ones of a textile nature in the form of embroidered conductor paths. Unluckily little research has been conducted on real applications. Therefore, the challenges are only identified, and future research directions are derive

Micro-manufacturing : research, technology outcomes and development issues

Besides continuing effort in developing MEMS-based manufacturing techniques, latest effort in Micro-manufacturing is also in Non-MEMS-based manufacturing. Research and technological development (RTD) in this field is encouraged by the increased demand on micro-components as well as promised development in the scaling down of the traditional macro-manufacturing processes for micro-length-scale manufacturing. This paper highlights some EU funded research activities in micro/nano-manufacturing, and gives examples of the latest development in micro-manufacturing methods/techniques, process chains, hybrid-processes, manufacturing equipment and supporting technologies/device, etc., which is followed by a summary of the achievements of the EU MASMICRO project. Finally, concluding remarks are given, which raise several issues concerning further development in micro-manufacturing

Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an electrochemical impedance sensor, and Complementary Metal Oxide Semiconductor (CMOS) die. Both are drawn from an MPW batch, thinned at die-level after dicing and singulation down to 60 µm. The thinned dies were flip-chip bonded to flexible substrates and hermetically sealed by two techniques: thermosonic bonding of Au stud bumps and anisotropic conductive paste (ACP) bonding. The performance of the thinned dies was assessed via functional tests and compared to the original dies. Furthermore, the long-term reliability of the flip-chip bonded thinned sensors was demonstrated to be higher than the conventional wire-bonded sensors

Materials and processes to enable polymeric waveguide integration on flexible substrates

Polymeric waveguide-on-flex has the potential to replace complex and costly light-turning devices in optoelectronic applications. As light signals are propagated and confined through the definition of core-cladding interface, the light guiding structure is required to adhere well and ensure long term interfacial stability. This thesis addresses the gap that has emerged in the fundamental material issues such as the polymeric optical waveguide materials deposited on the flexible substrates. In addition, this thesis investigates the feasibility of a new approach using electrostatic-induced lithography in micro-patterning of polymer, in optical waveguide fabrication. Plasma treatment is applied to enhance interfacial adhesion between flex substrates and optical cladding layers. The modified flex surfaces of polyimide KaptonHNTM and liquid crystal polymer VecstarTM materials are characterised. In addition, sonochemical surface treatment is evaluated on these flexible substrates. ToF-SIMS depth profiling has confirmed the interface reaction mechanisms where it has shown that plasma treatment increases the interfacial interpenetration. The larger interfacial width increases the possible entanglement mechanism between the polymer chains. These results, together with the double cantilever beam testing, indicate the strengthening of the polymeric interface upon plasma treatment, which is essential for long term optical and mechanical stability of waveguide-on-flex applications. A new method of micro-pattering of polymer material has been adopted for fabricating multimode waveguide-on-flex. The method, using an electrostatic-induced lithography, is developed to produce 50 μm x 50 μm arrays of polysiloxane LightlinkTM waveguide on flex. This thesis looks at various process recipes of the technique and reports the pattern formation of polymeric optical core. By adjusting the spin-coated liquid core thickness, pre-bake condition, UV exposure and applied voltage, the aspect ratio and profile of the optical core microstructure can be varied. As the electrostatic pressure overcoming the surface tension of spin-coated waveguide material induces the optical core formation, the core structure is smooth, making it ideal for low scattering loss waveguide. The propagation loss of fabricated waveguide is measured at 1.97 dB/cm at 850 nm wavelength. The result shows that the use of electrostatic-induced lithography in optical polymer is a promising approach for low cost and low temperature (<150 °C) processing at back end optical-electrical integrated circuitry assembly

Fundamental Characterization of Low Dimensional Carbon Nanomaterials for 3D Electronics Packaging

Transistor miniaturization has over the last half century paved the way for higher value electronics every year along an exponential pace known as \u27Moore\u27s law\u27. Now, as the industry is reaching transistor features that no longer makes economic sense, this way of developing integrated circuits (ICs) is coming to its definitive end. As a solution to this problem, the industry is moving toward higher hanging fruits that can enable larger sets of functionalities and ensuring a sustained performance increase to continue delivering more cost-effective ICs every product cycle. These design strategies beyond Moore\u27s law put emphasis on 3D stacking and heterogeneous integration, which if implemented correctly, will deliver a continued development of ICs for a foreseeable future. However, this way of building semiconductor systems does bring new issues to the table as this generation of devices will place additional demands on materials to be successful. The international roadmap of devices and systems (IRDS) highlights the need for improved materials to remove bottlenecks in contemporary as well as future systems in terms of thermal dissipation and interconnect performance. For this very purpose, low dimensional carbon nanomaterials such as graphene and carbon nanotubes (CNTs) are suggested as potential candidates due to their superior thermal, electrical and mechanical properties. Therefore, a successful implementation of these materials will ensure a continued performance to cost development of IC devices.This thesis presents a research study on some fundamental materials growth and reliability aspects of low dimensional carbon based thermal interface materials (TIMs) and interconnects for electronics packaging applications. Novel TIMs and interconnects based on CNT arrays and graphene are fabricated and investigated for their thermal resistance contributions as well electrical performance. The materials are studied and optimized with the support of chemical and structural characterization. Furthermore, a reliability study was performed which found delamination issues in CNT array TIMs due to high strains from thermal expansion mismatches. This study concludes that CNT length is an important factor when designing CNT based systems and the results show that by further interface engineering, reliability can be substantially improved with maintained thermal dissipation and electrical performance. Additionally, a heat treatment study was made that enables improvement of the bulk crystallinity of the materials which will enable even better performance in future applications

The use of rapid prototyping techniques (RPT) to manufacture micro channels suitable for high operation pressures and uPIV

This paper aims to present a new methodology to manufacture micro-channels suitable for high operating pressures and micro particle image velocimetry (µPIV) measurements using a rapid-prototyping high-resolution 3D printer. This methodology can fabricate channels down to 250 µm and withstand pressures of up to 5 ± 0.2 MPa. The manufacturing times are much shorter than in soft lithography processes. The novel manufacturing method developed takes advantage of the recently improved resolution in 3D printers to manufacture an rapid prototyping technique part that contains the hose connections and a micro-channel useful for microfluidics. A method to assemble one wall of the micro-channel using UV curable glue with a glass slide is presented – an operation required to prepare the channel for µPIV measurements. Once built, the micro-channel has been evaluated when working under pressure and the grease flow behavior in it has been measured using µPIV. Furthermore, the minimum achievable channels have been defined using a confocal microscopy study. This technique is much faster than previous micro-manufacturing techniques where different steps were needed to obtain the micro-machined parts. However, due to current 3D printers ' resolutions (around 50 µm) and according to the experimental results, channels smaller than 250-µm2 cross-section should not be used to characterize fluid flow behaviors, as inaccuracies in the channel boundaries can deeply affect the fluid flow behavior. The present methodology is developed due to the need to validate micro-channels using µPIV to lubricate critical components (bearings and gears) in wind turbines. This novel micro-manufacturing technique overcomes current techniques, as it requires less manufacturing steps and therefore it is faster and with less associated costs to manufacture micro-channels down to 250-µm2 cross-section that can withstand pressures higher than 5 MPa that can be used to characterize microfluidic flow behavior using µPIV.Peer ReviewedPostprint (author's final draft