115 research outputs found

    An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

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    Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

    Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

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    Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

    A Survey and Comparative Study of Hard and Soft Real-time Dynamic Resource Allocation Strategies for Multi/Many-core Systems

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    Multi-/many-core systems are envisioned to satisfy the ever-increasing performance requirements of complex applications in various domains such as embedded and high-performance computing. Such systems need to cater to increasingly dynamic workloads, requiring efficient dynamic resource allocation strategies to satisfy hard or soft real-time constraints. This article provides an extensive survey of hard and soft real-time dynamic resource allocation strategies proposed since the mid-1990s and highlights the emerging trends for multi-/many-core systems. The survey covers a taxonomy of the resource allocation strategies and considers their various optimization objectives, which have been used to provide comprehensive comparison. The strategies employ various principles, such as market and biological concepts, to perform the optimizations. The trend followed by the resource allocation strategies, open research challenges, and likely emerging research directions have also been provided

    Optimization-based design of fault-tolerant avionics

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    This dissertation considers the problem of improving the self-consciousness for avionic systems using numerical optimization techniques, emphasizing UAV applications. This self-consciousness implies a sense of awareness for oneself to make a reliable decision on some crucial aspects. In the context of the avionics or aerospace industry, those aspects are SWaP-C as well as safety and reliability. The decision-making processes to optimize these aspects, which are the main contributions of this work, are presented. In addition, implementation on various types of applications related to avionics and UAV are also provided. The first half of this thesis lays out the background of avionics development ranging from a mechanical gyroscope to a current state-of-the-art electronics system. The relevant mathematics regarding convex optimization and its algorithms, which will be used for formulating this self-consciousness problem, are also provided. The latter half presents two problem formulations for redundancy design automation and reconfigurable middleware. The first formulation focuses on the minimization of SWaP-C while satisfying safety and reliability requirements. The other one aims to maximize the system safety and reliability by introducing a fault-tolerant capability via the task scheduler of middleware or RTOS. The usage of these two formulations is shown by four aerospace applications---reconfigurable multicore avionics, a SITL simulation of a UAV GNC system, a modular drone, and a HITL simulation of a fault-tolerant distributed engine control architecture.Ph.D

    Polymorphic computing abstraction for heterogeneous architectures

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    Integration of multiple computing paradigms onto system on chip (SoC) has pushed the boundaries of design space exploration for hardware architectures and computing system software stack. The heterogeneity of computing styles in SoC has created a new class of architectures referred to as Heterogeneous Architectures. Novel applications developed to exploit the different computing styles are user centric for embedded SoC. Software and hardware designers are faced with several challenges to harness the full potential of heterogeneous architectures. Applications have to execute on more than one compute style to increase overall SoC resource utilization. The implication of such an abstraction is that application threads need to be polymorphic. Operating system layer is thus faced with the problem of scheduling polymorphic threads. Resource allocation is also an important problem to be dealt by the OS. Morphism evolution of application threads is constrained by the availability of heterogeneous computing resources. Traditional design optimization goals such as computational power and lower energy per computation are inadequate to satisfy user centric application resource needs. Resource allocation decisions at application layer need to permeate to the architectural layer to avoid conflicting demands which may affect energy-delay characteristics of application threads. We propose Polymorphic computing abstraction as a unified computing model for heterogeneous architectures to address the above issues. Simulation environment for polymorphic applications is developed and evaluated under various scheduling strategies to determine the effectiveness of polymorphism abstraction on resource allocation. User satisfaction model is also developed to complement polymorphism and used for optimization of resource utilization at application and network layer of embedded systems

    Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture

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    With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip. Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip. Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements. On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip

    LEAP Scratchpads: Automatic Memory and Cache Management for Reconfigurable Logic [Extended Version]

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    CORRECTION: The authors for entry [4] in the references should have been "E. S. Chung, J. C. Hoe, and K. Mai".Developers accelerating applications on FPGAs or other reconfigurable logic have nothing but raw memory devices in their standard toolkits. Each project typically includes tedious development of single-use memory management. Software developers expect a programming environment to include automatic memory management. Virtual memory provides the illusion of very large arrays and processor caches reduce access latency without explicit programmer instructions. LEAP scratchpads for reconfigurable logic dynamically allocate and manage multiple, independent, memory arrays in a large backing store. Scratchpad accesses are cached automatically in multiple levels, ranging from shared on-board, RAM-based, set-associative caches to private caches stored in FPGA RAM blocks. In the LEAP framework, scratchpads share the same interface as on-die RAM blocks and are plug-in replacements. Additional libraries support heap management within a storage set. Like software developers, accelerator authors using scratchpads may focus more on core algorithms and less on memory management. Two uses of FPGA scratchpads are analyzed: buffer management in an H.264 decoder and memory management within a processor microarchitecture timing model

    A Reconfigurable Processor for Heterogeneous Multi-Core Architectures

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    A reconfigurable processor is a general-purpose processor coupled with an FPGA-like reconfigurable fabric. By deploying application-specific accelerators, performance for a wide range of applications can be improved with such a system. In this work concepts are designed for the use of reconfigurable processors in multi-tasking scenarios and as part of multi-core systems
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