A study on buckled-beam actuators for RF MEMS applications

When combined with MEMS actuators, a mechanical lock is a useful device for various applications including memory cells, micro-relays, micro-valves, optical switches, and digital micro-mirrors. It allows removal of actuation force during idle periods without affecting an actuated state of a device, which makes standing power consumption completely unnecessary. In this thesis, a bistable buckled-beam actuator for RF MEMS switch applications has been examined. The buckled-beam geometry was designed based upon theoretical analysis. It was fabricated by SU-8 lithography and copper pulse electroplating. It was actuated by the Lorentz force using external magnet and current flow through the beam. Measured switching currents (10 to 200 mA) agree well with theoretical values. Required actuation voltage was less than 0.4 V for 20 to 60 μm displacement. The developed buckled-beams were incorporated into a RF MEMS switch design. The basic structure of the proposed switch is a combination of a coplanar waveguide and two buckled-beam actuators. The coplanar waveguide has a ground-signal-ground (GSG) configuration and its dimensions were designed for 50 ohm characteristic impedance over broad RF band. The proposed switch has several advantages compared to the conventional capacitive-type RF MEMS switches. First, since the electromagnetic actuation mechanism is adopted in the proposed switch, required actuation voltage is much lower than the electrostatic actuation mechanism. Second, all the structures can be made from the same layer so that only one mask is necessary for the entire process. Third, the trapped charge issue is dramatically diminished because the actuators are separated from the coplanar waveguide, very low voltage is applied to the actuators, and the polarity of voltage on the actuators is continuously toggled. The proposed RF MEMS switch finds a variety of usefulness in RF circuits and systems, including wireless communication devices – antenna switching, T/R (transmitter/receiver) switching, band selection, adjustable gain amplifiers; radar systems for military applications – phase shifters, phased array antennas; measurement equipments – impedance matching circuits, etc

Electrostatically actuated LIGA-MEMS structures with high aspect ratio beams for RF applications and mechanical property extraction

Microelectromechanical systems (MEMS) devices have been increasing in popularity for radio frequency (RF) and microwave communication systems due to the ability of MEMS devices to improve the performance of these circuits and systems. This interdisciplinary field combines the aspects of lithographic fabrication, mechanics, materials science, and RF/microwave circuit technology to produce moving structures with feature dimensions on the micron scale (micro-structures). MEMS technology has been used to improve switches, varactors, and inductors to name a few specific examples. Most MEMS devices have been fabricated using planar micro fabrication techniques that are similar to current integrated circuit (IC) fabrication techniques. These techniques limit the thickness of individual layers to a few microns, and restrict the structures to have planar and not vertical features. One micro fabrication technology that has not seen much application to microwave MEMS devices is LIGA, a German acronym for X-ray lithography, electroforming, and moulding. LIGA uses X-ray lithography to produce very tall structures (hundreds of microns) with excellent structural quality, and with lateral feature sizes smaller than a micron. These unique properties have led to an increased interest in LIGA for the development of high performance microwave devices, particularly as operating frequencies increase and physical device size decreases. Existing work using LIGA for microwave devices has concentrated on statically operating structures such as transmission lines, filters, couplers, and antennas. This research uses these unique fabrication capabilities to develop dynamically operating microwave devices with high frequency performance. This thesis documents the design, fabrication and testing of LIGA-MEMS variable capacitors that exploit the vertical dimension. Also included are methods to improve both the reliable fabrication and operation of these devices as well as material property characterization. Variable capacitors can be found in systems such as voltage-controlled oscillators, filters, impedance matching networks and phase shifters. Important figures-of-merit for these devices include the quality factor (Q), tuning range and tuning voltage. Two different types of variable capacitors are presented, a pull-away design and a design based on the principle of leveraged bending. The pull-away style variable capacitors were found to have high Q-factors, especially the devices fabricated using a thick gold device layer. As an example, the small gold half capacitance electrode design features a Q-factor of 95 at an operating frequency of 5.6 GHz and a tuning ratio of 1.36:1 with a tuning voltage range of 0 to 7.8 V. The design based on leveraged bending significantly improves the tuning ratio to a value of 1.9:1 while still maintaining a high Q-factor similar to those found in the pull-away style designs. A further increase in tuning ratio to a value of approximately 2.7:1 would be possible, based on simulated results, by simply changing the angle of the capacitance electrode in the layout. To improve device performance and fabrication reliability, modifications were made to both the fabrication process and the device layout. In the fabrication process the exposure step, electroplating step, and the etching process were modified to improve the quality of the resulting devices. In the layout, anti-stiction measures were introduced that reduce the contact area during collapse. To improve device characterization as well as the feedback link between simulation and fabrication, a set of test structures called VM-TEST was developed to accurately determine the important mechanical material properties of thick electroplated layers. These structures utilize the measurement of the pull-in voltage in cantilever and fixed-fixed beams, along with measured structure dimensions, to accurately extract the mechanical properties. Both nickel and gold test structures were analyzed with extracted Young’s modulus values of 186.2 and 60.8 GPa respectively. Also presented is a study of the gap shape in cantilever and fixed-fixed beams that significantly reduces the pull-in voltage while still maintaining a required maximum actuator displacement. It was shown that in the case of cantilever beam actuators, an approximately 40% reduction in pull-in voltage is possible, and in the case of fixed-fixed beam actuators, an approximately 30% reduction is possible by simply varying the shape of the gap between the beam and actuator electrode. These results can be used to significantly reduce the pull-in voltage of future designs. These promising results show that the LIGA fabrication process is capable of producing high performance dynamically operating RF MEMS devices, by exploiting the vertical dimension, not typically performed in most existing RF MEMS designs

A micromachined zipping variable capacitor

Micro-electro-mechanical systems (MEMS) have become ubiquitous in recent years and are found in a wide range of consumer products. At present, MEMS technology for radio-frequency (RF) applications is maturing steadily, and significant improvements have been demonstrated over solid-state components. A wide range of RF MEMS varactors have been fabricated in the last fifteen years. Despite demonstrating tuning ranges and quality factors that far surpass solid-state varactors, certain challenges remain. Firstly, it is difficult to scale up capacitance values while preserving a small device footprint. Secondly, many highly-tunable MEMS varactors include complex designs or process flows. In this dissertation, a new micromachined zipping variable capacitor suitable for application at 0.1 to 5 GHz is reported. The varactor features a tapered cantilever that zips incrementally onto a dielectric surface when actuated electrostatically by a pulldown electrode. Shaping the cantilever using a width function allows stable actuation and continuous capacitance tuning. Compared to existing MEMS varactors, this device has a simple design that can be implemented using a straightforward process flow. In addition, the zipping varactor is particularly suited for incorporating a highpermittivity dielectric, allowing the capacitance values and tuning range to be scaled up. This is important for portable consumer electronics where a small device footprint is attractive. Three different modelling approaches have been developed for zipping varactor design. A repeatable fabrication process has also been developed for varactors with a silicon dioxide dielectric. In proof-of-concept devices, the highest continuous tuning range is 400% (24 to 121 fF) and the measured quality factors are 123 and 69 (0.1 and 0.7 pF capacitance, respectively) at 2 GHz. The varactors have a compact design and fit within an area of 500 by 100 μm

Microwave LIGA-MEMS variable capacitors

Microelectromechanical systems (MEMS) devices have been increasing in popularity for radio frequency (RF) and microwave communication systems due to the ability of MEMS devices to improve the performance of these circuits and systems. This interdisciplinary field combines the aspects of lithographic fabrication, mechanics, materials science, and RF/microwave circuit technology to produce moving structures with feature dimensions on the micron scale (micro structures). MEMS technology has been used to improve switches, varactors, and inductors to name a few specific examples. Most MEMS devices have been fabricated using planar micro fabrication techniques that are similar to current IC fabrication techniques. These techniques limit the thickness of individual layers to a few microns, and restrict the structures to have planar and not vertical features. One micro fabrication technology that has not seen much application to microwave MEMS devices is LIGA, a German acronym for X-ray lithography, electroforming, and moulding. LIGA uses X-ray lithography to produce very tall structures (hundreds of microns) with excellent structural quality, and with lateral feature sizes smaller than a micron. These unique properties have led to an increased interest in LIGA for the development of high performance microwave devices, particularily as operating frequencies increase and physical device size decreases. Existing work using LIGA for microwave devices has concentrated on statically operating structures such as transmission lines, filters, and couplers. This research uses these unique fabrication capabilities to develop dynamically operating microwave devices with high frequency performance. This thesis documents the design, simulation, fabrication, and testing of MEMS variable capacitors (varactors), that are suitable for fabrication using the LIGA process. Variable capacitors can be found in systems such as voltage-controlled oscillators, filters, impedance matching networks and phase shifters. Important figures-of-merit for these devices include quality factor (Q), tuning range, and self-resonant frequency. The simulation results suggest that LIGA-MEMS variable capacitors are capable of high Q performance at upper microwave frequencies. Q-factors as large as 356 with a nickel device layer and 635 with a copper device layer, at operational frequency, have been simulated. The results indicate that self-resonant frequencies as large as 45 GHz are possible, with the ability to select the tuning range depending on the requirements of the application. Selected capacitors were fabricated with a shorter metal height for an initial fabrication attempt. Test results show a Q-factor of 175 and a nominal capacitance of 0.94 pF at 1 GHz. The devices could not be actuated as some seed layer metal remained beneath the cantilevers and further etching is required. As such, LIGA fabrication is shown to be a very promising technology for various dynamically operating microwave MEMS devices

A micromachined zipping variable capacitor

Micro-electro-mechanical systems (MEMS) have become ubiquitous in recent years and are found in a wide range of consumer products. At present, MEMS technology for radio-frequency (RF) applications is maturing steadily, and significant improvements have been demonstrated over solid-state components.A wide range of RF MEMS varactors have been fabricated in the last fifteen years. Despite demonstrating tuning ranges and quality factors that far surpass solid-state varactors, certain challenges remain. Firstly, it is difficult to scale up capacitance values while preserving a small device footprint. Secondly, many highly-tunable MEMS varactors include complex designs or process flows.In this dissertation, a new micromachined zipping variable capacitor suitable for application at 0.1 to 5 GHz is reported. The varactor features a tapered cantilever that zips incrementally onto a dielectric surface when actuated electrostatically by a pulldown electrode. Shaping the cantilever using a width function allows stable actuation and continuous capacitance tuning. Compared to existing MEMS varactors, this device has a simple design that can be implemented using a straightforward process flow. In addition, the zipping varactor is particularly suited for incorporating a highpermittivity dielectric, allowing the capacitance values and tuning range to be scaled up. This is important for portable consumer electronics where a small device footprint is attractive.Three different modelling approaches have been developed for zipping varactor design. A repeatable fabrication process has also been developed for varactors with a silicon dioxide dielectric. In proof-of-concept devices, the highest continuous tuning range is 400% (24 to 121 fF) and the measured quality factors are 123 and 69 (0.1 and 0.7 pF capacitance, respectively) at 2 GHz. The varactors have a compact design and fit within an area of 500 by 100 µm

Development of Tunable RF Integrated Passive Devices

Radio frequency (RF) lumped elements are crucial building blocks for designing any type of passives circuits for RF front-end applications in mobile devices. In particular, high-quality (Q) factor lumped elements are desirable for improving both insertion loss and noise performance. Integrated passive devices (IPD) technology is a platform that can provide miniature inductors, and capacitors with high- Q values that are unattainable with traditional CMOS technologies. Over the past several years, IPD technology has been used to implement devices such as filters, couplers and impedance-matching networks for a wide range of system-in-package applications. However, most of the IPD circuits do not yet have any tunable/reconfigurable functions for use in frequency agile applications. The objective of this research is to develop tunable integrated passive devices (IPDs) using barium strontium titanate (BST) and micro-electrical-mechanical-systems (MEMS) technologies. Another objective is to develop a fabrication process for monolithic integration of MEMS switches and IPD devices. A 4-mask IPD glass/alumina-based fabrication process is developed at the University of Waterloo for the first time. Details of the modeling and characterization of high-Q lumped elements, L and C, are investigated. The RF performance of these elements is compared with that of similar designs fabricated in a commercial IPD foundry. To highlight the benefits of the IPD process, lumped element bandpass filters are designed, fabricated, and tested. BST varactors are integrated with IPD circuits to demonstrate a highly miniaturized tunable impedance matching network featuring a wide impedance coverage from 2-3 GHz and an insertion loss of approximately 1 dB. The network promises to be useful in a broad range of wireless applications. A high performance tunable IPD/BST bandstop filter with a wideband balun as a multichip module is also proposed. Reconfigurable IPD/BST bandpass filters with tunable transmission zeros are presented and investigated experimentally for operation under high power levels. Intermodulation test results are presented for the integrated IPD/BST devices. Making use of the fact that the IPD fabrication process is amenable to the realization of MEMS devices, the IPD process originally developed for realizing passive circuits is further expanded to accommodate monolithic integration of MEMS switches with IPD circuits. Contact-type MEMS switches are developed, fabricated and tested. Also, a monolithically integrated IPD/MEMS 3-bit high resolution true-time delay network and high-Q switched-capacitor bank are fabricated and tested to demonstrate the benefits of integrating MEMS technology with the IPD technology

Developments of thick-metal inductors and applications to reactive lumped-element low-pass filter circuits

Strong demands for smaller, cheaper, and multifunction wireless systems have put very stringent requirements on passive devices, such as inductors and capacitors. This is especially true considering the size and weight of most radio frequency (RF) transceivers are mainly due to passives. RF micro-electro-mechanical-systems (MEMS) passives are addressing this issue by offering lower power consumption and losses, higher linearity and quality (Q)-factors, potential for integration and miniaturization, and batch fabrication. These advantages position RF MEMS passives as good candidates to replace conventional passives. Further, they also open an opportunity for using the passives as building blocks for lumped element-based RF circuits (e.g. Flters, couplers, etc.) which could replace the more-bulky distributed-element circuits. This thesis presents the design, simulation, fabrication using the deep X-ray lithography process, and testing of thick-metal RF inductors and their applications to lumped-element low-pass Filter (LPF) circuits. The 70-um tall single-turn loop inductors are structurally compatible to a pre-existing RF MEMS capacitor concept and allow the two device types to be fabricated together. This compatibility issue is crucial if they would be used to construct more complex RF circuits. At a 50-Ohm inductive reactance point, test results show Q-factors of 17- 55, self-resonant frequencies (SRF) exceeding 11 GHz, and nominal inductances of 0.4- 3 nH for 1-loop inductors and Q-factors of 11- 42, SRFs of 4- 22 GHz, and inductances of 0.8- 5.5 nH for 2-loop inductors. Further, test results reveal that high conductivity metals improve the Q-factors, and that low dielectric-constant substrates increase the SRFs. In terms of LPFs, measurements show that they demonstrate the expected third-order Chebyshev response. Two nickel Filters on a quartz glass substrate show a 0.6-dB ripple with 3-dB frequencies (f-3dB) of 6.1 GHz and 11.9 GHz respectively. On an alumina substrate, they exhibit a 1.4-dB ripple with f-3dB of 5.4 GHz and 10.6 GHz respectively. The filters are 203- 285 um tall and feature 6- 6.5 um wide capacitance air gaps. These dimensions are different than the original designs and the filter performances were shown to be somewhat sensitive to these discrepancies. Compared to a distributed approach, the lumped-element implementations led to an area reduction of up to 95%

Development and testing of a micromachined probe card.

This thesis is concerned with the design, fabrication and testing of micro scale probes. The probes were designed to act as temporary electrical connections to allow wafer level testing of integrated circuits. The work initially focused on the creation of free standing nickel cantilevers, angled up from the substrate with probe tips at the free end. These were fabricated using a novel method, combining pseudo grey scale lithography and thick photoresist sacrificial layers. Detailed analysis of the fabrication method, in particular the resist processing and lithography was undertaken and the limitations of the method explored.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

A new approach to evaluate fracture strength of UV-LIGA fabricated nickel specimens

One of the major difficulties faced by MEMS researchers today is the lack of data regarding properties of electroplated metals or alloys at micro-levels as those produced by the LIGA and LIGA related process. These mechanical properties are not well known and they cannot be extrapolated from macro-scale data without experimental verification. This lack of technical information about microscale physical properties has affected the consistency and reliability of batch-fabricated components and leads to very low rates of successful fabrication. Therefore, this material issue is of vital importance to the development of LIGA technology and to its industrial applications. This thesis focuses on the development of a new capability based on design, fabrication, and testing of groups of UV-LIGA fabricated nickel microspecimens for the evaluation of fracture strength. The design of the test specimens involved determining the appropriate dimensions and configuration based on a set of criteria dictated by the objectives of the project. Likewise, the development of the specimens required some experimentation with different microfabrication techniques, and combinations thereof, to generate a final fabrication sequence that would produce suitable freestanding, wafer-bound specimens. The devised testing mechanism demonstrated compatibility with the fabricated samples and capability of performing the desired experimentation by generating resistance-to-fracture values of the nickel specimens. The average fracture strength value obtained, expressed with a 95% confidence interval, was 315 ± 54 MPa. Preliminary testing results proved that further data acquisition, especially involving tensile specimen testing, and material analysis is needed to fully understand the implications of the information obtained. The products of this new microspecimen testing approach can be extended for use with other microfabricated metals and metal alloys, particularly on a more qualitative, comparative basis

Liquid cooled micro-scale gradient system for magnetic resonance

Schaltbare magnetische Feldgradientspulen sind ein geeignetes Werkzeug für die Modulation der Kernspinpräzession in der gepulsten Kernspinresonanzspektroskopie und Bildgebung. Die Magnetresonanztomographie von mikroskopischen Proben benötigt starke, schnell schaltbare Magnetfeldgradienten, um diffusionsbedingte Artefakte zu unterdrücken, Suszeptibilitätseffekte abzuschwächen und um die Messzeit zu verkürzen. Verschiedene Techniken können eingesetzt werden, um eine hohe Gradientenintensität zu erreichen, wie zum Beispiel die Erhöhung der Stromstärke oder die Steigerung der Windungsdichte der Feldspule. Ein weiterer, geeigneter technischer Ansatz besteht darin, die Gradientenspulen näher an der Probe zu platzieren. Als Konsequenz wird aber die durch die Joule-Erwärmung verursachte Wärmeentwicklung zu einem zentralen Problem. In dieser Arbeit wird ein neuartiges Design, ein Mikroherstellungsprozess und eine Kernspin-Evaluierung eines Feldgradientenchips präsentiert. Die Gradientenspulen wurden besonders hoch miniaturisiert und durch den Einsatz von verbesserten und neuartigen Strukturierungsverfahren entwickelt. Zuerst wird ein Fertigungsverfahren zur Herstellung einer kompakten Hochfrequenzspule vorgestellt. Durch den Einsatz einer maskenlosen Rückseitenlithographie konnte die Prozesskomplexität reduziert werden. Dieses Verfahren wurde durch Tintenstrahldruck mit Nanopartikeln realisiert, wobei die gedruckten Strukturen selbst als lithographische Maske für die Herstellung einer galvanischen Form dienen. Somit werden die Seitenwände der galvanischen Form durch die gedruckte Seed-Schicht optimal selbst ausgerichtet. Dies ermöglichte eine anisotrope Galvanisierung, um eine höhere elektrische Leitfähigkeit der gedruckten Leiterbahnen zu erzielen. Aus den Erkenntnissen der ausgearbeiteten Herstellungsprozesse wurde ein optimiertes Spulendesign für ein-axiale sowie drei-axiale linearen Gradientenchips entwickelt. Die einachsige lineare $z$-Gradientenspule wurde mit der Stream-Function-Methode berechnet, wobei die Optimierung darauf abgestimmt wurde, eine minimale Verlustleistung zu erzielen. Die Gradientenspulen wurden auf zwei Doppellagen implementiert, die mittels Cu-Galvanik in Kombination mit fotodefinierbaren Trockenfilm-Laminaten aufgebracht wurden. Bei dem hier vorgestellten Herstellungsverfahren diente die erste Metallisierungschicht gleichzeitig dazu, Widerstands-Temperaturdetektoren zu integrieren. Um niederohmige Spulen zu realisieren wurde der Galvanisierungsprozess soweit angepasst, um eine hohe Schichtdicke zu erzielen. Die Chipstruktur beinhaltet ein aktives Kühlsystem, um dem Aufheizen der Spulen entgegenzuwirken. Thermographische Aufnahmen in Kombination mit den eingebetteten Temperatursensoren ermöglichen es, die Erhitzung der Spule zu analysieren, um die Strombelastbarkeit zu ermitteln. Die Gradientenspule wurde mit einer Hochfrequenz-Mikrospule in einer Flip-Chip-Konfiguration zusammengebaut, und mit diesem Aufbau wurde ein eindimensionales Kernspinexperiment durchgeführt. Es wurde eine Gradienteneffizienz von 3.15 $T\,m^{−1}\,A^{−1}$ bei einer Profillänge von 1.2 $mm$ erreicht