An effective AMS Top-Down Methodology Applied to the Design of a Mixed-SignalUWB System-on-Chip

The design of Ultra Wideband (UWB) mixed-signal SoC for localization applications in wireless personal area networks is currently investigated by several researchers. The complexity of the design claims for effective top-down methodologies. We propose a layered approach based on VHDL-AMS for the first design stages and on an intelligent use of a circuit-level simulator for the transistor-level phase. We apply the latter just to one block at a time and wrap it within the system-level VHDL-AMS description. This method allows to capture the impact of circuit-level design choices and non-idealities on system performance. To demonstrate the effectiveness of the methodology we show how the refinement of the design affects specific UWB system parameters such as bit-error rate and localization estimations

Energy Detection UWB Receiver Design using a Multi-resolution VHDL-AMS Description

Ultra Wide Band (UWB) impulse radio systems are appealing for location-aware applications. There is a growing interest in the design of UWB transceivers with reduced complexity and power consumption. Non-coherent approaches for the design of the receiver based on energy detection schemes seem suitable to this aim and have been adopted in the project the preliminary results of which are reported in this paper. The objective is the design of a UWB receiver with a top-down methodology, starting from Matlab-like models and refining the description down to the final transistor level. This goal will be achieved with an integrated use of VHDL for the digital blocks and VHDL-AMS for the mixed-signal and analog circuits. Coherent results are obtained using VHDL-AMS and Matlab. However, the CPU time cost strongly depends on the description used in the VHDL-AMS models. In order to show the functionality of the UWB architecture, the receiver most critical functions are simulated showing results in good agreement with the expectations

High-speed civil transport flight- and propulsion-control technological issues

Technology advances required in the flight and propulsion control system disciplines to develop a high speed civil transport (HSCT) are identified. The mission and requirements of the transport and major flight and propulsion control technology issues are discussed. Each issue is ranked and, for each issue, a plan for technology readiness is given. Certain features are unique and dominate control system design. These features include the high temperature environment, large flexible aircraft, control-configured empennage, minimizing control margins, and high availability and excellent maintainability. The failure to resolve most high-priority issues can prevent the transport from achieving its goals. The flow-time for hardware may require stimulus, since market forces may be insufficient to ensure timely production. Flight and propulsion control technology will contribute to takeoff gross weight reduction. Similar technology advances are necessary also to ensure flight safety for the transport. The certification basis of the HSCT must be negotiated between airplane manufacturers and government regulators. Efficient, quality design of the transport will require an integrated set of design tools that support the entire engineering design team

Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

Monte Carlo simulations of high-performance implant free In_0.3Ga_0.7 nano-MOSFETs for low-power CMOS applications

No abstract available

The Future of High Frequency Circuit Design

The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced a unique opportunity for a completely new class of holistic circuit design combining electromagnetics, device physics, circuits, and communication system theory in one place. In this paper, we discuss some of these opportunities and their associated challenges in greater detail and provide a few of examples of how they can be used in practice