Dependable and Certifiable Real-World Systems – Issue of Software Engineering Education

Embedded software and dedicated hardware are vital elements of the modern world, from personal electronics to transportation, from communication to aerospace, from military to gaming, from medical systems to banking. Combinations of even minor hardware or software defects in a complex system may lead to violation of safety with or even without evident system failure, a major problem that the computing profession faces is the lack of a universal approach to unite the dissimilar viewpoints presented by computer science, with its discrete and mathematical underpinnings, and by computer engineering, which focuses on building real systems and considering spatial and material constraints of space, energy, and time. Modern embedded systems include both viewpoints: microprocessors running software and programmable electronic hardware created with an extensive use of software. The gap between science and engineering approaches is clearly visible in engineering education. This survey paper focuses on exploring the commonalities between building software and building hardware in an attempt to establish a new framework for rejuvenating computing education, specifically software engineering for dependable systems. We present here a perspective on software/hardware relationship, aviation system certification, role of software engineering education, and future directions in computing

Faculty Senate Bill FSB-2013-11-18-01: University Curriculum Committee

Faculty Senate Bill FSB-2013-11-18-01: University Curriculum Committe

November 18, 2013 AASU Faculty Senate Agenda

November 18, 2013 AASU Faculty Senate Agend

The Journal of Microelectronic Research

https://scholarworks.rit.edu/meec_archive/1013/thumbnail.jp

Journal of Microelectronic Research - May 2003

https://scholarworks.rit.edu/meec_archive/1012/thumbnail.jp

2011-2012 Louisiana Tech University Catalog

The Louisiana Tech University Catalog includes announcements and course descriptions for courses offered at Louisiana Tech University for the academic year of 2011-2012.https://digitalcommons.latech.edu/university-catalogs/1004/thumbnail.jp

2009-2010 Louisiana Tech University Catalogs

The Louisiana Tech University Catalog includes announcements and course descriptions for courses offered at Louisiana Tech University for the academic year of 2008-2009.https://digitalcommons.latech.edu/university-catalogs/1005/thumbnail.jp

Comparison of low-temperature co-fired ceramic and direct bonded copper for single ended primary inductance topology

This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional comments about best practices in the fabrication and design process are also included