This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional comments about best practices in the fabrication and design process are also included
