Analysis of Dynamic Logic Circuits in Deep Submicron CMOS Technologies

Dynamic logic circuits are utilized to minimize the delay in the critical path of high-performance designs such as the datapath circuits in state-of-the-art microprocessors. However, as integrated circuits (ICs) scale to the very deep submicron (VDSM) regime, dynamic logic becomes susceptible to a variety of failure modes due to decreasing noise margins and increasing leakage currents. The objective of this thesis is to characterize the performance of dynamic logic circuits in VDSM technologies and to evaluate various design strategies to mitigate the effects of leakage currents and small noise margins

Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

Low Power SoC Design

The design of Low Power Systems-on-Chips (SoC) in very deep submicron technologies becomes a very complex task that has to bridge very high level system description with low-level considerations due to technology defaults and variations and increasing system and circuit complexity. This paper describes the major low-level issues, such as dynamic and static power consumption, temperature, technology variations, interconnect, DFM, reliability and yield, and their impact on high-level design, such as the design of multi-Vdd, fault-tolerant, redundant or adaptive chip architectures. Some very low power System-on-Chip (SoC) will be presented in three domains: wireless sensor networks, vision sensors and mobile TV

Modelling and analysis of crosstalk in scaled CMOS interconnects

The development of a general coupled RLC interconnect model for simulating scaled bus structures m VLSI is presented. Several different methods for extracting submicron resistance, inductance and capacitance parameters are documented. Realistic scaling dimensions for deep submicron design rules are derived and used within the model. Deep submicron HSPICE device models are derived through the use of constant-voltage scaling theory on existing 0.75µm and 1.0µm models to create accurate interconnect bus drivers. This complete model is then used to analyse crosstalk noise and delay effects on multiple scaling levels to determine the dependence of crosstalk on scaling level. Using this data, layout techniques and processing methods are suggested to reduce crosstalk in system

Optimization techniques for high-performance digital circuits

The relentless push for high performance in custom dig-ital circuits has led to renewed emphasis on circuit opti-mization or tuning. The parameters of the optimization are typically transistor and interconnect sizes. The de-sign metrics are not just delay, transition times, power and area, but also signal integrity and manufacturability. This tutorial paper discusses some of the recently pro-posed methods of circuit optimization, with an emphasis on practical application and methodology impact. Circuit optimization techniques fall into three broad categories. The rst is dynamic tuning, based on time-domain simulation of the underlying circuit, typically combined with adjoint sensitivity computation. These methods are accurate but require the specication of in-put signals, and are best applied to small data- ow cir-cuits and \cross-sections " of larger circuits. Ecient sensitivity computation renders feasible the tuning of cir-cuits with a few thousand transistors. Second, static tuners employ static timing analysis to evaluate the per-formance of the circuit. All paths through the logic are simultaneously tuned, and no input vectors are required. Large control macros are best tuned by these methods. However, in the context of deep submicron custom de-sign, the inaccuracy of the delay models employed by these methods often limits their utility. Aggressive dy-namic or static tuning can push a circuit into a precip-itous corner of the manufacturing process space, which is a problem addressed by the third class of circuit op-timization tools, statistical tuners. Statistical techniques are used to enhance manufacturability or maximize yield. In addition to surveying the above techniques, topics such as the use of state-of-the-art nonlinear optimization methods and special considerations for interconnect siz-ing, clock tree optimization and noise-aware tuning will be brie y considered.

INVESTIGATING THE EFFECTS OF SINGLE-EVENT UPSETS IN STATIC AND DYNAMIC REGISTERS

Radiation-induced single-event upsets (SEUs) pose a serious threat to the reliability of registers. The existing SEU analyses for static CMOS registers focus on the circuit-level impact and may underestimate the pertinent SEU information provided through node analysis. This thesis proposes SEU node analysis to evaluate the sensitivity of static registers and apply the obtained node information to improve the robustness of the register through selective node hardening (SNH) technique. Unlike previous hardening techniques such as the Triple Modular Redundancy (TMR) and the Dual Interlocked Cell (DICE) latch, the SNH method does not introduce larger area overhead. Moreover, this thesis also explores the impact of SEUs in dynamic flip-flops, which are appealing for the design of high-performance microprocessors. Previous work either uses the approaches for static flip-flops to evaluate SEU effects in dynamic flip-flops or overlook the SEU injected during the precharge phase. In this thesis, possible SEU sensitive nodes in dynamic flip-flops are re-examined and their window of vulnerability (WOV) is extended. Simulation results for SEU analysis in non-hardened dynamic flip-flops reveal that the last 55.3 % of the precharge time and a 100% evaluation time are affected by SEUs