Power supply noise in delay testing

As technology scales into the Deep Sub-Micron (DSM) regime, circuit designs have become more and more sensitive to power supply noise. Excessive noise can significantly affect the timing performance of DSM designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This will eventually result in delay test overkill. To reduce this overkill, we propose a low-cost pattern-dependent approach to analyze noise-induced delay variation for each delay test pattern applied to the design. Two noise models have been proposed to address array bond and wire bond power supply networks, and they are experimentally validated and compared. Delay model is then applied to calculate path delay under noise. This analysis approach can be integrated into static test compaction or test fill tools to control supply noise level of delay tests. We also propose an algorithm to predict transition count of a circuit, which can be applied to control switching activity during dynamic compaction. Experiments have been performed on ISCAS89 benchmark circuits. Results show that compacted delay test patterns generated by our compaction tool can meet a moderate noise or delay constraint with only a small increase in compacted test set size. Take the benchmark circuit s38417 for example: a 10% delay increase constraint only results in 1.6% increase in compacted test set size in our experiments. In addition, different test fill techniques have a significant impact on path delay. In our work, a test fill tool with supply noise analysis has been developed to compare several test fill techniques, and results show that the test fill strategy significant affect switching activity, power supply noise and delay. For instance, patterns with minimum transition fill produce less noise-induced delay than random fill. Silicon results also show that test patterns filled in different ways can cause as much as 14% delay variation on target paths. In conclusion, we must take noise into consideration when delay test patterns are generated

CTX: A Clock-Gating-Based Test Relaxation and X-Filling Scheme for Reducing Yield Loss Risk in At-Speed Scan Testing

At-speed scan testing is susceptible to yield loss risk due to power supply noise caused by excessive launch switching activity. This paper proposes a novel two-stage scheme, namely CTX (Clock-Gating-Based Test Relaxation and X-Filling), for reducing switching activity when test stimulus is launched. Test relaxation and X-filling are conducted (1) to make as many FFs inactive as possible by disabling corresponding clock-control signals of clock-gating circuitry in Stage-1 (Clock-Disabling), and (2) to make as many remaining active FFs as possible to have equal input and output values in Stage-2 (FF-Silencing). CTX effectively reduces launch switching activity, thus yield loss risk, even with a small number of donpsilat care (X) bits as in test compression, without any impact on test data volume, fault coverage, performance, and circuit design.2008 17th Asian Test Symposium (ATS 2008), 24-27 November 2008, Sapporo, Japa

CAT: A Critical-Area-Targeted Test Set Modification Scheme for Reducing Launch Switching Activity in At-Speed Scan Testing

Reducing excessive launch switching activity (LSA) is now mandatory in at-speed scan testing for avoiding test-induced yield loss, and test set modification is preferable for this purpose. However, previous low-LSA test set modification methods may be ineffective since they are not targeted at reducing launch switching activity in the areas around long sensitized paths, which are spatially and temporally critical for test-induced yield loss. This paper proposes a novel CAT (Critical-Area-Targeted) low-LSA test modification scheme, which uses long sensitized paths to guide launch-safety checking, test relaxation, and X-filling. As a result, launch switching activity is reduced in a pinpoint manner, which is more effective for avoiding test-induced yield loss. Experimental results on industrial circuits demonstrate the advantage of the CAT scheme for reducing launch switching activity in at-speed scan testing.2009 Asian Test Symposium, 23-26 November 2009, Taichung, Taiwa

シグナルインテグリティ考慮型LSIテストを目指して

LSIの大規模化,微細化,高速化,及び低電圧化に伴い,テスト時の信号劣化が深刻な問題になってきている.信号劣化は誤ったテスト結果を引き起こし,歩留りを低下させる危険性を持っている.本稿では,まずLSIテストに多用されるスキャン方式を説明し,それに関連する様々なシグナルインテグリティ問題を明らかにする.次に,シグナルインテグリティ問題の1つである電源ノイズの原因となるIRドロップを削減する技術を紹介する.最後に,種々のシグナルインテグリティ問題を体系的に解決するSIAT(Signal-Integrity-Aware Testing)の概念を提起し,関連する研究テーマを探る

Multi-Cycle at Speed Test

In this research, we focus on the development of an algorithm that is used to generate a minimal number of patterns for path delay test of integrated circuits using the multi-cycle at-speed test. We test the circuits in functional mode, where multiple functional cycles follow after the test pattern scan-in operation. This approach increases the delay correlation between the scan and functional test, due to more functionally realistic power supply noise. We use multiple at-speed cycles to compact K-longest paths per gate tests, which reduces the number of scan patterns. After a path is generated, we try to place each path in the first pattern in the pattern pool. If the path does not fit due to conflicts, we attempt to place it in later functional cycles. This compaction approach retains the greedy nature of the original dynamic compaction algorithm where it will stop if the path fits into a pattern. If the path is not able to compact in any of the functional cycles of patterns in the pool, we generate a new pattern. In this method, each path delay test is compared to at-speed patterns in the pool. The challenge is that the at-speed delay test in a given at-speed cycle must have its necessary value assignments set up in previous (preamble) cycles, and have the captured results propagated to a scan cell in the later (coda) cycles. For instance, if we consider three at-speed (capture) cycles after the scan-in operation, and if we need to place a fault in the first capture cycle, then we must generate it with two propagation cycles. In this case, we consider these propagation cycles as coda cycles, so the algorithm attempts to select the most observable path through them. Likewise, if we are placing the path test in the second capture cycle, then we need one preamble cycle and one coda cycle, and if we are placing the path test in the third capture cycle, we require two preamble cycles with no coda cycles

On-Chip Structure for Timing Uncertainity Measurement Induced by Noise in Integrated Circuits

Noise such as voltage drop and temperature in integrated circuits can cause significant performance variation and even functional failure in lower technology nodes. In this paper, we propose an on-chip structure that measures the timing uncertainty induced by noise during functional and test operations. The proposed on-chip structure facilitates the speed characterization under various workloads and test conditions. The basic structure is highly scalable and can be tailored for various applications such as silicon validation, monitoring operation condition and validating logic built-in-self-test conditions. Simulation results show that it offers very high measurement resolution in a highly efficient manner

A Capture-Safe Test Generation Scheme for At-Speed Scan Testing

Capture-safety, defined as the avoidance of any timing error due to unduly high launch switching activity in capture mode during at-speed scan testing, is critical for avoiding test- induced yield loss. Although point techniques are available for reducing capture IR-drop, there is a lack of complete capture-safe test generation flows. The paper addresses this problem by proposing a novel and practical capture-safe test generation scheme, featuring (1) reliable capture-safety checking and (2) effective capture-safety improvement by combining X-bit identification & X-filling with low launch- switching-activity test generation. This scheme is compatible with existing ATPG flows, and achieves capture-safety with no changes in the circuit-under-test or the clocking scheme.2008 13th European Test Symposium, 25-29 May 2008, Verbania, Ital

A Novel Scheme to Reduce Power Supply Noise for High-Quality At-Speed Scan Testing

High-quality at-speed scan testing, characterized by high small-delay-defect detecting capability, is indispensable to achieve high delay test quality for DSM circuits. However, such testing is susceptible to yield loss due to excessive power supply noise caused by high launch-induced switching activity. This paper addresses this serious problem with a novel and practical post-ATPG X-filling scheme, featuring (1) a test relaxation method, called path keeping X-identification, that finds don\u27t-care bits from a fully-specified transition delay test set while preserving its delay test quality by keeping the longest paths originally sensitized for fault detection, and (2) an X-filling method, called justification-probability-based fill (JP-fill), that is both effective and scalable for reducing launch-induced switching activity. This scheme can be easily implemented into any ATPG flow to effectively reduce power supply noise, without any impact on delay test quality, test data volume, area overhead, and circuit timing.2007 IEEE International Test Conference, 21-26 October 2007, Santa Clara, CA, US

Low Cost Power and Supply Noise Estimation and Control in Scan Testing of VLSI Circuits

Test power is an important issue in deep submicron semiconductor testing. Too much power supply noise and too much power dissipation can result in excessive temperature rise, both leading to overkill during delay test. Scan-based test has been widely adopted as one of the most commonly used VLSI testing method. The test power during scan testing comprises shift power and capture power. The power consumed in the shift cycle dominates the total power dissipation. It is crucial for IC manufacturing companies to achieve near constant power consumption for a given timing window in order to keep the chip under test (CUT) at a near constant temperature, to make it easy to characterize the circuit behavior and prevent delay test over kill. To achieve constant test power, first, we built a fast and accurate power model, which can estimate the shift power without logic simulation of the circuit. We also proposed an efficient and low power X-bit Filling process, which could potentially reduce both the shift power and capture power. Then, we introduced an efficient test pattern reordering algorithm, which achieves near constant power between groups of patterns. The number of patterns in a group is determined by the thermal constant of the chip. Experimental results show that our proposed power model has very good correlation. Our proposed X-Fill process achieved both minimum shift power and capture power. The algorithm supports multiple scan chains and can achieve constant power within different regions of the chip. The greedy test pattern reordering algorithm can reduce the power variation from 29-126 percent to 8-10 percent or even lower if we reduce the power variance threshold. Excessive noise can significantly affect the timing performance of Deep Sub-Micron (DSM) designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This can result in delay test overkill. Prior approaches to power supply noise aware delay test compaction are too costly due to many logic simulations, and are limited to static compaction. We proposed a realistic low cost delay test compaction flow that guardbands the delay using a sequence of estimation metrics to keep the circuit under test supply noise more like functional mode. This flow has been implemented in both static compaction and dynamic compaction. We analyzed the relationship between delay and voltage drop, and the relationship between effective weighted switching activity (WSA) and voltage drop. Based on these correlations, we introduce the low cost delay test pattern compaction framework considering power supply noise. Experimental results on ISCAS89 circuits show that our low cost framework is up to ten times faster than the prior high cost framework. Simulation results also verify that the low cost model can correctly guardband every path‟s extra noise-induced delay. We discussed the rules to set different constraints in the levelized framework. The veto process used in the compaction can be also applied to other constraints, such as power and temperature