A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.Framework of the IQONIC Project; European Union’s Horizon 2020 Research and Innovation Program

Automated flaw detection method for X-ray images in nondestructive evaluation

Private, government and commercial sectors of the manufacturing world are plagued with imperfect materials, defective components, and aging assemblies that continuously infiltrate the products and services provided to the public. Increasing awareness of public safety and economic stability has caused the manufacturing world to search deeper for a solution to identify these mechanical weaknesses and thereby reduce their impact. The areas of digital image and signal processing have benefited greatly from the technological advances in computer hardware and software capabilities and the development of new processing methods resulting from extensive research in information theory, artificial intelligence, pattern recognition and related fields. These new processing methodologies and capabilities are laying a foundation of knowledge that empowers the industrial and academic community to boldly address this problem and begin designing and building better products and systems for tomorrow

Texture and Colour in Image Analysis

Research in colour and texture has experienced major changes in the last few years. This book presents some recent advances in the field, specifically in the theory and applications of colour texture analysis. This volume also features benchmarks, comparative evaluations and reviews

Optical Imaging Method for Bridge Painting Maintenance and Inspection

The term quality is defined as the conformance to predetermined requirements or specifications. These requirements may be set in terms of the end result required or as a detailed description of how work should be executed. Recently, there has been increasing interest in quality assurance in the construction industry. Quality assurance includes design and planning, sampling, inspection, testing, and assessment to ensure that end products perform according to specifications. This research proposes a new quality assessment model for highway steel bridges and more specifically for coating rust assessment. The research proposes a hybrid model using image processing and neural networks for defect recognition and measurement. The basic concept of the model is to acquire digital images of the areas to be assessed and analyze those images to recognize and measure defect patterns. Neural networks are incorporated into the model to learn from example and simulate human expertise to automate the process for future use. The model is supplemented with a statistical quality assessment plan to use the model efficiently and obtain consistent and reliable results. The statistical plan will determine the number and locations of assessment images to be taken. Moreover, the plan will address the risks associated with the estimated assessment. Finally, the plan will assist making the final acceptance/rejection decision based on the predefined criteria for acceptance and rejection

Exploring information retrieval using image sparse representations:from circuit designs and acquisition processes to specific reconstruction algorithms

New advances in the field of image sensors (especially in CMOS technology) tend to question the conventional methods used to acquire the image. Compressive Sensing (CS) plays a major role in this, especially to unclog the Analog to Digital Converters which are generally representing the bottleneck of this type of sensors. In addition, CS eliminates traditional compression processing stages that are performed by embedded digital signal processors dedicated to this purpose. The interest is twofold because it allows both to consistently reduce the amount of data to be converted but also to suppress digital processing performed out of the sensor chip. For the moment, regarding the use of CS in image sensors, the main route of exploration as well as the intended applications aims at reducing power consumption related to these components (i.e. ADC & DSP represent 99% of the total power consumption). More broadly, the paradigm of CS allows to question or at least to extend the Nyquist-Shannon sampling theory. This thesis shows developments in the field of image sensors demonstrating that is possible to consider alternative applications linked to CS. Indeed, advances are presented in the fields of hyperspectral imaging, super-resolution, high dynamic range, high speed and non-uniform sampling. In particular, three research axes have been deepened, aiming to design proper architectures and acquisition processes with their associated reconstruction techniques taking advantage of image sparse representations. How the on-chip implementation of Compressed Sensing can relax sensor constraints, improving the acquisition characteristics (speed, dynamic range, power consumption) ? How CS can be combined with simple analysis to provide useful image features for high level applications (adding semantic information) and improve the reconstructed image quality at a certain compression ratio ? Finally, how CS can improve physical limitations (i.e. spectral sensitivity and pixel pitch) of imaging systems without a major impact neither on the sensing strategy nor on the optical elements involved ? A CMOS image sensor has been developed and manufactured during this Ph.D. to validate concepts such as the High Dynamic Range - CS. A new design approach was employed resulting in innovative solutions for pixels addressing and conversion to perform specific acquisition in a compressed mode. On the other hand, the principle of adaptive CS combined with the non-uniform sampling has been developed. Possible implementations of this type of acquisition are proposed. Finally, preliminary works are exhibited on the use of Liquid Crystal Devices to allow hyperspectral imaging combined with spatial super-resolution. The conclusion of this study can be summarized as follows: CS must now be considered as a toolbox for defining more easily compromises between the different characteristics of the sensors: integration time, converters speed, dynamic range, resolution and digital processing resources. However, if CS relaxes some material constraints at the sensor level, it is possible that the collected data are difficult to interpret and process at the decoder side, involving massive computational resources compared to so-called conventional techniques. The application field is wide, implying that for a targeted application, an accurate characterization of the constraints concerning both the sensor (encoder), but also the decoder need to be defined

Proceedings of the 2011 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory

This book is a collection of 15 reviewed technical reports summarizing the presentations at the 2011 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory. The covered topics include image processing, optical signal processing, visual inspection, pattern recognition and classification, human-machine interaction, world and situation modeling, autonomous system localization and mapping, information fusion, and trust propagation in sensor networks