Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Throughput-Centric Wave-Pipelined Interconnect Circuits for Gigascale Integration

The central thesis of this research is that VLSI interconnect design strategies should shift from using global wires that can support only a single binary transition during the latency of the line to global wires that can sustain multiple bits traveling simultaneously along the length of the line. It is shown in this thesis that such throughput-centric multibit transmission can be achieved by wave-pipelining the interconnects using repeaters. A holistic analysis of wave-pipelined interconnect circuits, along with the full-custom optimization of these circuits, is performed in this research. With the help of models and methodologies developed in this thesis, the design rules for repeater insertion are crafted to simultaneously optimize performance, power, and area of VLSI global interconnect networks through a simultaneous application of voltage scaling and wire sizing. A qualitative analysis of latency, throughput, signal integrity, power dissipation, and area is performed that compares the results of design optimizations in this work to those of conventional global interconnect circuits. The objective of this thesis is to study the circuit- and system-level opportunities of voltage scaling, wire sizing, and repeater insertion in wave-pipelined global interconnect networks that are implemented in deep submicron technologies.Ph.D.Committee Chair: Davis, Jeffrey; Committee Member: Kohl, Paul; Committee Member: Meindl, James; Committee Member: Swaminathan, Madhavan; Committee Member: Wills, D. Scot

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Dynamic Voltage and Frequency Scaling for Wireless Network-on-Chip

Previously, research and design of Network-on-Chip (NoC) paradigms where mainly focused on improving the performance of the interconnection networks. With emerging wide range of low-power applications and energy constrained high-performance applications, it is highly desirable to have NoCs that are highly energy efficient without incurring performance penalty. In the design of high-performance massive multi-core chips, power and heat have become dominant constrains. Increased power consumption can raise chip temperature, which in turn can decrease chip reliability and performance and increase cooling costs. It was proven that Small-world Wireless Network-on-Chip (SWNoC) architecture which replaces multi-hop wire-line path in a NoC by high-bandwidth single hop long range wireless links, reduces the overall energy dissipation when compared to wire-line mesh-based NoC architecture. However, the overall energy dissipation of the wireless NoC is still dominated by wire-line links and switches (buffers). Dynamic Voltage Scaling is an efficient technique for significant power savings in microprocessors. It has been proposed and deployed in modern microprocessors by exploiting the variance in processor utilization. On a Network-on-Chip paradigm, it is more likely that the wire-line links and buffers are not always fully utilized even for different applications. Hence, by exploiting these characteristics of the links and buffers over different traffic, DVFS technique can be incorporated on these switches and wire-line links for huge power savings. In this thesis, a history based DVFS mechanism is proposed. This mechanism uses the past utilization of the wire-line links & buffers to predict the future traffic and accordingly tune the voltage and frequency for the links and buffers dynamically for each time window. This mechanism dynamically minimizes the power consumption while substantially maintaining a high performance over the system. Performance analysis on these DVFS enabled Wireless NoC shows that, the overall energy dissipation is improved by around 40% when compared Small-world Wireless NoCs

Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are reaching their fundamental limits and interconnection bottleneck is dominating IC operational power and performance. Migrating to 3-D, as a way to advance scaling, has eluded us due to inherent customization and manufacturing requirements in CMOS that are incompatible with 3-D organization. Partial attempts with die-die and layer-layer stacking have their own limitations. We propose a 3-D IC fabric technology, Skybridge[TM], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge's core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance per watt benefits, and 10X reduction in interconnect lengths vs. scaled 16-nm CMOS. Fabric-level heat extraction features are shown to successfully manage IC thermal profiles in 3-D. Skybridge can provide continuous scaling of integrated circuits beyond CMOS in the 21st century.Comment: 53 Page

An efficient design space exploration framework to optimize power-efficient heterogeneous many-core multi-threading embedded processor architectures

By the middle of this decade, uniprocessor architecture performance had hit a roadblock due to a combination of factors, such as excessive power dissipation due to high operating frequencies, growing memory access latencies, diminishing returns on deeper instruction pipelines, and a saturation of available instruction level parallelism in applications. An attractive and viable alternative embraced by all the processor vendors was multi-core architectures where throughput is improved by using micro-architectural features such as multiple processor cores, interconnects and low latency shared caches integrated on a single chip. The individual cores are often simpler than uniprocessor counterparts, use hardware multi-threading to exploit thread-level parallelism and latency hiding and typically achieve better performance-power figures. The overwhelming success of the multi-core microprocessors in both high performance and embedded computing platforms motivated chip architects to dramatically scale the multi-core processors to many-cores which will include hundreds of cores on-chip to further improve throughput. With such complex large scale architectures however, several key design issues need to be addressed. First, a wide range of micro- architectural parameters such as L1 caches, load/store queues, shared cache structures and interconnection topologies and non-linear interactions between them define a vast non-linear multi-variate micro-architectural design space of many-core processors; the traditional method of using extensive in-loop simulation to explore the design space is simply not practical. Second, to accurately evaluate the performance (measured in terms of cycles per instruction (CPI)) of a candidate design, the contention at the shared cache must be accounted in addition to cycle-by-cycle behavior of the large number of cores which superlinearly increases the number of simulation cycles per iteration of the design exploration. Third, single thread performance does not scale linearly with number of hardware threads per core and number of cores due to memory wall effect. This means that at every step of the design process designers must ensure that single thread performance is not unacceptably slowed down while increasing overall throughput. While all these factors affect design decisions in both high performance and embedded many-core processors, the design of embedded processors required for complex embedded applications such as networking, smart power grids, battlefield decision-making, consumer electronics and biomedical devices to name a few, is fundamentally different from its high performance counterpart because of the need to consider (i) low power and (ii) real-time operations. This implies the design objective for embedded many-core processors cannot be to simply maximize performance, but improve it in such a way that overall power dissipation is minimized and all real-time constraints are met. This necessitates additional power estimation models right at the design stage to accurately measure the cost and reliability of all the candidate designs during the exploration phase. In this dissertation, a statistical machine learning (SML) based design exploration framework is presented which employs an execution-driven cycle- accurate simulator to accurately measure power and performance of embedded many-core processors. The embedded many-core processor domain is Network Processors (NePs) used to processed network IP packets. Future generation NePs required to operate at terabits per second network speeds captures all the aspects of a complex embedded application consisting of shared data structures, large volume of compute-intensive and data-intensive real-time bound tasks and a high level of task (packet) level parallelism. Statistical machine learning (SML) is used to efficiently model performance and power of candidate designs in terms of wide ranges of micro-architectural parameters. The method inherently minimizes number of in-loop simulations in the exploration framework and also efficiently captures the non-linear interactions between the micro-architectural design parameters. To ensure scalability, the design space is partitioned into (i) core-level micro-architectural parameters to optimize single core architectures subject to the real-time constraints and (ii) shared memory level micro- architectural parameters to explore the shared interconnection network and shared cache memory architectures and achieves overall optimality. The cost function of our exploration algorithm is the total power dissipation which is minimized, subject to the constraints of real-time throughput (as determined from the terabit optical network router line-speed) required in IP packet processing embedded application