Algorithms for Circuit Sizing in VLSI Design

One of the key problems in the physical design of computer chips, also known as integrated circuits, consists of choosing a  physical layout  for the logic gates and memory circuits (registers) on the chip. The layouts have a high influence on the power consumption and area of the chip and the delay of signal paths.  A discrete set of predefined layouts  for each logic function and register type with different physical properties is given by a library. One of the most influential characteristics of a circuit defined by the layout is its size. In this thesis we present new algorithms for the problem of choosing sizes for the circuits and its continuous relaxation,  and  evaluate these in theory and practice. A popular approach is based on Lagrangian relaxation and projected subgradient methods. We show that seemingly heuristic modifications that have been proposed for this approach can be theoretically justified by applying the well-known multiplicative weights algorithm. Subsequently, we propose a new model for the sizing problem as a min-max resource sharing problem. In our context, power consumption and signal delays are represented by resources that are distributed to customers. Under certain assumptions we obtain a polynomial time approximation for the continuous relaxation of the sizing problem that improves over the Lagrangian relaxation based approach. The new resource sharing algorithm has been implemented as part of the BonnTools software package which is developed at the Research Institute for Discrete Mathematics at the University of Bonn in cooperation with IBM. Our experiments on the ISPD 2013 benchmarks and state-of-the-art microprocessor designs provided by IBM illustrate that the new algorithm exhibits more stable convergence behavior compared to a Lagrangian relaxation based algorithm. Additionally, better timing and reduced power consumption was achieved on almost all instances. A subproblem of the new algorithm consists of finding sizes minimizing a weighted sum of power consumption and signal delays. We describe a method that approximates the continuous relaxation of this problem in polynomial time under certain assumptions. For the discrete problem we provide a fully polynomial approximation scheme under certain assumptions on the topology of the chip. Finally, we present a new algorithm for timing-driven optimization of registers. Their sizes and locations on a chip are usually determined during the clock network design phase, and remain mostly unchanged afterwards although the timing criticalities on which they were based can change. Our algorithm permutes register positions and sizes within so-called  clusters  without impairing the clock network such that it can be applied late in a design flow. Under mild assumptions, our algorithm finds an optimal solution which maximizes the worst cluster slack. It is implemented as part of the BonnTools and improves timing of registers on state-of-the-art microprocessor designs by up to 7.8% of design cycle time. </div

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Variation and power issues in VLSI clock networks

Clock Distribution Network (CDN) is an important component of any synchronous logic circuit. The function of CDN is to deliver the clock signal to the clock sinks. Clock skew is defined as the difference in the arrival time of the clock signal at the clock sinks. Higher uncertainty in skew (due to PVT variations) degrades circuit performance by decreasing the maximum possible delay between any two sequential elements. Aggressive frequency scaling has also led to high power consumption especially in CDN. This dissertation addresses variation and power issues in the design of current and potential future CDN. The research detailed in this work presents algorithmic techniques for the following problems: (1) Variation tolerance in useful skew design, (2) Link insertion for buffered clock nets, (3) Methodology and algorithms for rotary clocking and (4) Clock mesh optimization for skew-power trade off. For clock trees this dissertation presents techniques to integrate the different aspects of clock tree synthesis (skew scheduling, abstract topology and layout embedding) into one framework- tolerance to variations. This research addresses the issues involved in inserting cross-links in a buffered clock tree and proposes design criteria to avoid the risk of short-circuit current. Rotary clocking is a promising new clocking scheme that consists of unterminated rings formed by differential transmission lines. Rotary clocking achieves reduction in power dissipation clock skew. This dissertation addresses the issues in adopting current CAD methodology to rotary clocks. Alternative methodology and corresponding algorithmic techniques are detailed. Clock mesh is a popular form of CDN used in high performance systems. The problem of simultaneous sizing and placement of mesh buffers in a clock mesh is addressed. The algorithms presented remove the edges from the clock mesh to trade off skew tolerance for low power. For clock trees as well as link insertion, our experiments indicate significant reduction in clock skew due to variations. For clock mesh, experimental results indicate 18.5% reduction in power with 1.3% delay penalty on a average. In summary, this dissertation details methodologies/algorithms that address two critical issues- variation and power dissipation in current and potential future CDN

A Structured Design Methodology for High Performance VLSI Arrays

abstract: The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.Dissertation/ThesisPh.D. Electrical Engineering 201

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Interconnect delay modeling under exponential input

Interconnect has become the dominating factor in determining the performance of VLSI deep submicron designs. With the rapid shrinking of feature size and development in the process technologies, it has been observed that the resistance per unit length of the interconnect continues to increase, capacitance per unit length remains roughly constant, and transistor or gate delay continues to decrease. This had led to the increasing dominance of interconnect delay over logic delay, and this trend is expected to continue. With this being the main bottleneck in realizing high speed circuits, complete understanding of the interconnect delay and thereby efficient and accurate delay circulation has assumed a greater significance in physical design, optimization and fast verification. In this thesis, a interconnect delay model under exponential input is presented. Because of its simple closed form expression, fast computation speed, and fidelity with respect to simulation, Elmore delay model remains popular. More accurate delay computation methods are typically central processing unit intensive and/or difficult to implement. To bridge this gap between accuracy and efficiency/simplicity, a new RC delay metric for interconnects which is as efficient as the Elmore metric, but more accurate, is proposed. However, there is no interconnect delay model considering exponential input waveform existing in the literature. The proposed Exponential Delay Metric uses exponential waveform as input and captures resistive shielding effects by modeling the downstream by a [pi]-model. An application of the delay model to perform interconnect optimization using wire sizing is also presented. Experimental results show that the proposed delay model is significantly more accurate than the existing interconnect delay models

High performance IC clock networks with grid and tree topologies

In this dissertation, an essential step in the integrated circuit (IC) physical design flow—the clock network design—is investigated. Clock network design entailsa series of computationally intensive, large-scale design and optimization tasks for the generation and distribution of the clock signal through different topologies. The lack or inefficacy of the automation for implementing high performance clock networks, especially for low-power, high speed and variation-aware implementations, is the main driver for this research. The synthesis and optimization methods for the two most commonly used clock topologies in IC design—the grid topology and the tree topology—are primarily investigated.The clock mesh network, which uses the grid topology, has very low skew variation at the cost of high power dissipation. Two novel clock mesh network designmethodologies are proposed in this dissertation in order to reduce the power dissipation. These are the first methods known in literature that combine clock meshsynthesis with incremental register placement and clock gating for power saving purposes. The application of the proposed automation methods on the emerging resonant rotary clocking technology, which also has the grid topology, is investigated in this dissertation as well.The clock tree topology has the advantage of lower power dissipation compared to other traditional clock topologies (e.g. clock mesh, clock spine, clock tree with cross links) at the cost of increased performance degradation due to on-chip variations. A novel clock tree buffer polarity assignment flow is proposed in this dissertation in order to reduce these effects of on-chip variations on the clock tree topology. The proposed polarity assignment flow is the first work that introduces post-silicon, dynamic reconfigurability for polarity assignment, enabling clock gating for low power operation of the variation-tolerant clock tree networks.Ph.D., Electrical Engineering -- Drexel University, 201