Microfabricated Implantable Parylene-Based Wireless Passive Intraocular Pressure Sensors

This paper presents an implantable parylene-based wireless pressure sensor for biomedical pressure sensing applications specifically designed for continuous intraocular pressure (IOP) monitoring in glaucoma patients. It has an electrical LC tank resonant circuit formed by an integrated capacitor and an inductor coil to facilitate passive wireless sensing using an external interrogating coil connected to a readout unit. Two surface-micromachined sensor designs incorporating variable capacitor and variable capacitor/inductor resonant circuits have been implemented to realize the pressure-sensitive components. The sensor is monolithically microfabricated by exploiting parylene as a biocompatible structural material in a suitable form factor for minimally invasive intraocular implantation. Pressure responses of the microsensor have been characterized to demonstrate its high pressure sensitivity (> 7000 ppm/mmHg) in both sensor designs, which confirms the feasibility of pressure sensing with smaller than 1 mmHg of resolution for practical biomedical applications. A six-month animal study verifies the in vivo bioefficacy and biostability of the implant in the intraocular environment with no surgical or postoperative complications. Preliminary ex vivo experimental results verify the IOP sensing feasibility of such device. This sensor will ultimately be implanted at the pars plana or on the iris of the eye to fulfill continuous, convenient, direct, and faithful IOP monitoring

Wireless Intraocular Pressure Sensing Using Microfabricated Minimally Invasive Flexible-Coiled LC Sensor Implant

This paper presents an implant-based wireless pressure sensing paradigm for long-range continuous intraocular pressure (IOP) monitoring of glaucoma patients. An implantable parylene-based pressure sensor has been developed, featuring an electrical LC-tank resonant circuit for passive wireless sensing without power consumption on the implanted site. The sensor is microfabricated with the use of parylene C (poly-chlorop- xylylene) to create a flexible coil substrate that can be folded for smaller physical form factor so as to achieve minimally invasive implantation, while stretched back without damage for enhanced inductive sensor–reader coil coupling so as to achieve strong sensing signal. A data-processed external readout method has also been developed to support pressure measurements. By incorporating the LC sensor and the readout method, wireless pressure sensing with 1-mmHg resolution in longer than 2-cm distance is successfully demonstrated. Other than extensive on-bench characterization, device testing through six-month chronic in vivo and acute ex vivo animal studies has verified the feasibility and efficacy of the sensor implant in the surgical aspect, including robust fixation and long-term biocompatibility in the intraocular environment. With meeting specifications of practical wireless pressure sensing and further reader development, this sensing methodology is promising for continuous, convenient, direct, and faithful IOP monitoring

Radio Frequency Microelectromechanical Systems in Defence and Aerospace

For all onboard systems applications, it is important to have very low-loss characteristics and low power consumption coupled with size reduction. The controls and instrumentation in defence and aerospace continually calls for newer technologies and developments. One such technology showing remarkable potential over the years is radio frequency microelectromechanical systems (RF MEMS) which have already made their presence felt prominently by offering replacement in radar and communication systems with high quality factors and precise tunability. The RF MEMS components have emerged as potential candidates for defence and aerospace applications. The core theme of this paper is to drive home the fact that the limitations faced by the current RF devices can be overcome by the flexibility and better device performance characteristics of RF MEMS components, which ultimately propagate the device level benefits to the final system to attain the unprecedented levels of performance.Defence Science Journal, 2009, 59(6), pp.568-567, DOI:http://dx.doi.org/10.14429/dsj.59.156

Utilisation of microsystems technology in radio frequency and microwave applications

The market trends of the rapidly growing communication systems require new product architectures and services that are only realisable by utilising technologies beyond that of planar integrated circuits. Microsystems technology (MST) is one such technology which can revolutionise radio frequency (RF) and microwave applications. This article discusses the enabling potential of the MST to meet the stringent requirements of modern communication systems. RF MST fabrication technologies and actuation mechanisms empower conventional processes by alleviating the substrate effects on passive devices and provide product designers with high quality versatile microscale components which can facilitate system integration and lead to novel architectures with enhanced robustness and reduced power consumption. An insight on the variety of components that can be fabricated using the MST is given, emphasizing their excellent electrical performance and versatility. Research issues that need to be addressed are also discussed. Finally, this article discusses the main approaches for integrating MST devices in RF and microwave applications together with the difficulties that need to be overcome in order to make such devices readily available for volume-production.peer-reviewe

A Nail-Size Piezoelectric Energy Harvesting System Integrating a MEMS Transducer and a CMOS SSHI Circuit

Piezoelectric vibration energy harvesting has drawn much interest to power distributed wireless sensor nodes for Internet of Things (IoT) applications where ambient kinetic energy is available. For certain applications, the harvesting system should be small and able to generate sufficient output power. Standard rectification topologies such as the full-bridge rectifier are typically inefficient when adapted to power conditioning from miniaturized harvesters. Therefore, active rectification circuits have been researched to improve overall power conversion efficiency, and meet both the output power and miniaturization requirements while employing a MEMS harvester. In this paper, a MEMS piezoelectric energy harvester is designed and cointegrated with an active synchronized switch harvesting on inductor (SSHI) rectification circuit designed in a CMOS process to achieve high output power for system miniaturization. The system is fully integrated on a nail-size board, which is ready to provide a stable DC power for low-power mini sensors. A MEMS energy harvester of 0.005 cm3 size, co-integrated with the CMOS conditioning circuit, outputs a peak rectified DC power of 40.6 µW and achieves a record DC power density of 8.12 mW/cm3 when compared to state-of-the-art harvesters

Analysis on One-Stage SSHC Rectifier for Piezoelectric Vibration Energy Harvesting

Conventional SSHI (synchronized switch harvesting on inductor) has been believed to be one of the most efficient interface circuits for piezoelectric vibration energy harvesting systems. It employs an inductor and the resulting RLC loop to synchronously invert the charge across the piezoelectric material to avoid charge and energy loss due to charging its internal capacitor ($C_P$). The performance of the SSHI circuit greatly depends on the inductor and a large inductor is often needed; hence significantly increases the volume of the system. An efficient interface circuit using a synchronous charge inversion technique, named as SSHC, was proposed recently. The SSHC rectifier utilizes capacitors, instead of inductors, to flip the voltage across the harvester. For a one-stage SSHC rectifier, one single intermediate capacitor ($C_T$) is employed to temporarily store charge flowed from $C_P$ and inversely charge $C_P$ to perform the charge inversion. In previous studies, the voltage flip efficiency achieves 1/3 when $C_T = C_P$. This paper presents that the voltage flip efficiency can be further increased to approach 1/2 if $C_T$ is chosen to be much larger than $C_P$

A new power MEMS component with variable capacitance

Autonomous devices such as wireless sensors and sensor networks need a long battery lifetime in a small volume. Incorporating micro-power generators based on ambient energy increases the lifetime of these systems while reducing the volume. This paper describes a new approach to the conversion of mechanical energy, available in vibrations, to electrical energy. The conversion principle is based on charge transportation between two parallel capacitors. An electret is used to polarize the device. A large-signal model was developed, allowing simulations of the behavior of the generator. A small-signal model was then derived in order to quantify the output power as a function of the design parameters. These models show the possibility of generating up to 40 muW with a device of 10 mm 2. A layout was made based on a standard SOI-technology, available in an MPW. With this design a power of 1 muW at 1020 Hz is expected