A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism.

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB

MODELING THE PHYSICS OF FAILURE FOR ELECTRONIC PACKAGING COMPONENTS SUBJECTED TO THERMAL AND MECHANICAL LOADING

This dissertation presents three separate studies that examined electronic components using numerical modeling approaches. The use of modeling techniques provided a deeper understanding of the physical phenomena that contribute to the formation of cracks inside ceramic capacitors, damage inside plated through holes, and to dynamic fracture of MEMS structures. The modeling yielded numerical substantiations for previously proposed theoretical explanations. Multi-Layer Ceramic Capacitors (MLCCs) mounted with stiffer lead-free solder have shown greater tolerance than tin-lead solder for single cycle board bending loads with low strain rates. In contrast, flexible terminations have greater tolerance than stiffer standard terminations under the same conditions. It has been proposed that residual stresses in the capacitor account for this disparity. These stresses have been attributed to the higher solidification temperature of lead free solders coupled with the CTE mismatch between the board and the capacitor ceramic. This research indicated that the higher solidification temperatures affected the residual stresses. Inaccuracies in predicting barrel failures of plated through holes are suspected to arise from neglecting the effects of the reflow process on the copper material. This research used thermo mechanical analysis (TMA) results to model the damage in the copper above the glass transition temperature (Tg) during reflow. Damage estimates from the hysteresis plots were used to improve failure predictions. Modeling was performed to examine the theory that brittle fracture in MEMS structures is not affected by strain rates. Numerical modeling was conducted to predict the probability of dynamic failure caused by shock loads. The models used a quasi-static global gravitational load to predict the probability of brittle fracture. The research presented in this dissertation explored drivers for failure mechanisms in flex cracking of capacitors, barrel failures in plated through holes, and dynamic fracture of MEMS. The studies used numerical modeling to provide new insights into underlying physical phenomena. In each case, theoretical explanations were examined where difficult geometries and complex material properties made it difficult or impossible to obtain direct measurements

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo-Mechanical Stresses

Microvias allow signal and power transmission between layers in high density interconnection printed circuit boards. Presence of voiding in filled microvias due to defective manufacturing process has raised concerns in industry. Voids can vary widely in shape and size and have been observed in both stacked and single-level microvias. IPC standards have addressed the presence of voids in microvias using void size as the acceptance criterion. The purpose of this study is to determine how voiding affects the degradation of microvias; if void size is the only parameter that needs to be taken into consideration or void shape is important as well. Voided as well as non-voided microvias were tested using liquid-to-liquid thermal shock to understand the difference between behavior of voided and non-voided microvias under thermo-mechanical stresses

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresse

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C)

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses