Analysis and application of improved feedthrough logic

Continuous technology scaling and increased frequency of operation of VLSI circuits leads to increase in power density which raises thermal management problem. Therefore design of low power VLSI circuit technique is a challenging task without sacrificing its performance. This thesis presents the design of a low power dynamic circuit using a new CMOS domino logic family called feedthrough (FTL) logic. Dynamic logic circuits are more significant because of its faster speed and lesser transistor requirement as compared to static CMOS logic circuits. The need for faster circuits compels designers to use FTL as compared static and domino CMOS logic and the requirement of output inverter for cascading of various logic blocks in domino logic are eliminated in the proposed design. The proposed circuit for low power (LP-FTL) improves dynamic power consumption as compared to the existing FTL and to further improve its speed we propose another circuit (HS-FTL). This logic family improves speed at the cost of dynamic power consumption and area. Proposed modified FTL circuit families provide better PDP as compared to the existing FTL. Simulation results of both the proposed circuit using 0.18 µm, 1.8 V CMOS process technology indicate that the LP-FTL structure reduces the dynamic power approximately by 42% and the HS-FTL structure achieves a speed up- 1.4 for 10-stage of inverters and 8-bit ripple carry adder in comparison to existing FTL logic. Furthermore, we present various circuit design techniques to improve noise tolerance of the proposed FTL logic families. Noise in deep submicron technology limits the reliability and performance of ICs. The ANTE (average noise threshold energy) metric is used for the analysis of noise tolerance of proposed FTL. A 2-input NAND and NOR gate is designed by the proposed technique. Simulation results for a 2-input NAND gate at 0.18-µm, 1.8 V CMOS process technology show that the proposed noise tolerant circuit achieves 1.79X ANTE improvement along with the reduction in leakage power. Continuous scaling of technology towards the nanometer range significantly increases leakage current level and the effect of noise. This research can be further extended for performance optimization in terms of power, speed, area and noise immunity

Improved Techniques for High Performance Noise-Tolerant Domino CMOS Logic Circuits

Domino CMOS logic circuit family finds a wide variety of applications in microprocessors, digital signal processors, and dynamic memory due to their high speed and low device count. However, there are inevitable problems that degrade the noise immunity of this family; they are the inevitable leakage current and the charge sharing. Added to the drawbacks is the relatively large power consumption, especially if compared to the static complementary CMOS logic family. To make the matter worse, these drawbacks are more tactile with the scaling of CMOS technology. In my thesis, An introduction to domino logic, The impact of CMOS technology scaling on the performance of domino CMOS logic, Three Phase Domino Logic Circuit, High-performance noise-tolerant circuit techniques for CMOS dynamic logic and other Domino logic techniques are studied and corresponding Domino logic techniques have been designed and simulated. Specifically, the need to decrease the dynamic power consumption forces the designer to use a lower power-supply voltage. This in turn necessitates the reduction of threshold voltage to maintain the performance with the associated increase in sub threshold leakage current. So, a properly sized PMOS keeper must be used to compensate for this leakage. It will be found that the speed, which is the major advantage of domino logic compared to other logic styles, will degrade with CMOS technology scaling due to the contention current of the keeper. To assure high performance in noise tolerant techniques, the inevitable effects like leakage currents and charge distribution have to be minimized. In this thesis few modifications have also been made to already existing domino techniques and different Domino logic circuits are simulated in both Cadence virtuoso (implemented using GPDK090- library of 90nm technology) and Mentor graphics (implemented at different technologies like Tsmc 035.mod, Tsmc 025.mod, Tsmc 018.mod) environments. The performance parameters are also compared with other standard architectures of Domino logic

Investigating the Optical Link Performance of the End-of Substructure Card and Susceptibility to SEUs

Particle physics experiments carried out by CERN attempt to investigate the fundamental forces of matter. One of these experiments is the ATLAS experiment, which studies the proton-proton collisions in the LHC. A series of upgrades are planned to increase the luminosity by a factor of five, leading to the high-luminosity LHC (HL-LHC). This upgrade will increase the potential for new discoveries but brings with it design challenges in relation to the harsh radiation environment and significant data throughput required. The ATLAS experiment is building a new detector to cope with these challenges, titled the Inner Tracker (ITk). A crucial part of this new detector is the End-of-Substructure (EoS) card, which constitutes the interface between the ondetector electronics and the off-detector systems. In addition to the operational challenges, the HL-LHC does not allow for repairs or replacing of EoS cards once operation commences, emphasizing the need for thorough testing and qualification of this component. This thesis focuses on characterizing the performance of the EoS card in the presence of radiation, under non-ideal operating conditions and the impact of optical link parameters. The first set of tests is centered on qualifying the radiation tolerance of the EoS card. The radiation environment within the ITk poses a threat to the stable operation of electronics as energetic particles have the potential to cause erroneous changes in device logic, known as Single Event Upsets (SEU). The SEU susceptibility of the EoS card, with a focus on the Versatile Link Plus Transceiver (VTRx+) component, is studied by irradiating the EoS card with a neutron source with a distributed energy spectrum and a peak energy of 11MeV while performing a bit error rate (BER) test to monitor for radiation induced errors. The second set of tests deals with characterizing the impact of an irregular power supply on the EoS card's performance through simulating noise on the supply lines and monitoring the response in BER. The final set of tests investigates the impact the VTRx+ configuration parameters have on the quality of the optical signal. These tests were carried out at the University of Cape Town (UCT) with the support of DESY, a national research institute in Germany, responsible for the production of the EoS cards. A number of new firmware, software and hardware modules were developed as part of this work in order to carry out the tests required. The most significant of which comprised a novel firmware addition allowing for the evaluation of the optical signal quality with an FPGA. This contribution is now being integrated into the quality control proceedings at DESY, to be used in assessing optical signal quality of the entire set of approximately 1552 EoS cards being produced

Statistical circuit simulations - from ‘atomistic’ compact models to statistical standard cell characterisation

This thesis describes the development and application of statistical circuit simulation methodologies to analyse digital circuits subject to intrinsic parameter fluctuations. The specific nature of intrinsic parameter fluctuations are discussed, and we explain the crucial importance to the semiconductor industry of developing design tools which accurately account for their effects. Current work in the area is reviewed, and three important factors are made clear: any statistical circuit simulation methodology must be based on physically correct, predictive models of device variability; the statistical compact models describing device operation must be characterised for accurate transient analysis of circuits; analysis must be carried out on realistic circuit components. Improving on previous efforts in the field, we posit a statistical circuit simulation methodology which accounts for all three of these factors. The established 3-D Glasgow atomistic simulator is employed to predict electrical characteristics for devices aimed at digital circuit applications, with gate lengths from 35 nm to 13 nm. Using these electrical characteristics, extraction of BSIM4 compact models is carried out and their accuracy in performing transient analysis using SPICE is validated against well characterised mixed-mode TCAD simulation results for 35 nm devices. Static d.c. simulations are performed to test the methodology, and a useful analytic model to predict hard logic fault limitations on CMOS supply voltage scaling is derived as part of this work. Using our toolset, the effect of statistical variability introduced by random discrete dopants on the dynamic behaviour of inverters is studied in detail. As devices scaled, dynamic noise margin variation of an inverter is increased and higher output load or input slew rate improves the noise margins and its variation. Intrinsic delay variation based on CV/I delay metric is also compared using ION and IEFF definitions where the best estimate is obtained when considering ION and input transition time variations. Critical delay distribution of a path is also investigated where it is shown non-Gaussian. Finally, the impact of the cell input slew rate definition on the accuracy of the inverter cell timing characterisation in NLDM format is investigated

Modelling and Test Generation for Crosstalk Faults in DSM Chips

In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the components to be operating at high clock speeds. With the shrinking feature size and ever increasing clock frequencies, the DSM technology has led to a well-known problem of Signal Integrity (SI) more especially in the connecting layout design. The increasing aspect ratios of metal wires and also the ratio of coupling capacitance over substrate capacitance result in electrical coupling of interconnects which leads to crosstalk problems. In this thesis, first the work carried out to model the crosstalk behaviour between aggressor and victim by considering the distributed RLGC parameters of interconnect and the coupling capacitance and mutual conductance between the two nets is presented. The proposed model also considers the RC linear models of the CMOS drivers and receivers. The behaviour of crosstalk in case of under etching problem has been studied and modelled by distributing and approximating the defect behaviour throughout the nets. Next, the proposed model has also been extended to model the behaviour of crosstalk in case of one victim is influenced by several aggressors by considering all aggressors have similar effect (worst-case) on victim. In all the above cases simulation experiments were also carried out and compared with well-known circuit simulation tool PSPICE. It has been proved that the generated crosstalk model is faster and the results generated are within 10% of error margin compared to latter simulation tool. Because of the accuracy and speed of the proposed model, the model is very useful for both SoC designers and test engineers to analyse the crosstalk behaviour. Each manufactured device needs to be tested thoroughly to ensure the functionality before its delivery. The test pattern generation for crosstalk faults is also necessary to test the corresponding crosstalk faults. In this thesis, the well-known PODEM algorithm for stuck-at faults is extended to generate the test patterns for crosstalk faults between single aggressor and single victim. To apply modified PODEM for crosstalk faults, the transition behaviour has been divided into two logic parts as before transition and after transition. After finding individually required test patterns for before transition and after transition, the generated logic vectors are appended to create transition test patterns for crosstalk faults. The developed algorithm is also applied for a few ISCAS 85 benchmark circuits and the fault coverage is found excellent in most circuits. With the incorporation of proposed algorithm into the ATPG tools, the efficiency of testing will be improved by generating the test patterns for crosstalk faults besides for the conventional stuck-at faults. In generating test patterns for crosstalk faults on single victim due to multiple aggressors, the modified PODEM algorithm is found to be more time consuming. The search capability of Genetic Algorithms in finding the required combination of several input factors for any optimized problem fascinated to apply GA for generating test patterns as generating the test pattern is also similar to finding the required vector out of several input transitions. Initially the GA is applied for generating test patterns for stuck-at faults and compared the results with PODEM algorithm. As the fault coverage is almost similar to the deterministic algorithm PODEM, the GA developed for stuck-at faults is extended to find test patterns for crosstalk faults between single aggressor and single victim. The elitist GA is also applied for a few ISCAS 85 benchmark circuits. Later the algorithm is extended to generate test patterns for worst-case crosstalk faults. It has been proved that elitist GA developed in this thesis is also very useful in generating test patterns for crosstalk faults especially for multiple aggressor and single victim crosstalk faults

High Quality Compact Delay Test Generation

Delay testing is used to detect timing defects and ensure that a circuit meets its timing specifications. The growing need for delay testing is a result of the advances in deep submicron (DSM) semiconductor technology and the increase in clock frequency. Small delay defects that previously were benign now produce delay faults, due to reduced timing margins. This research focuses on the development of new test methods for small delay defects, within the limits of affordable test generation cost and pattern count. First, a new dynamic compaction algorithm has been proposed to generate compacted test sets for K longest paths per gate (KLPG) in combinational circuits or scan-based sequential circuits. This algorithm uses a greedy approach to compact paths with non-conflicting necessary assignments together during test generation. Second, to make this dynamic compaction approach practical for industrial use, a recursive learning algorithm has been implemented to identify more necessary assignments for each path, so that the path-to-test-pattern matching using necessary assignments is more accurate. Third, a realistic low cost fault coverage metric targeting both global and local delay faults has been developed. The metric suggests the test strategy of generating a different number of longest paths for each line in the circuit while maintaining high fault coverage. The number of paths and type of test depends on the timing slack of the paths under this metric. Experimental results for ISCAS89 benchmark circuits and three industry circuits show that the pattern count of KLPG can be significantly reduced using the proposed methods. The pattern count is comparable to that of transition fault test, while achieving higher test quality. Finally, the proposed ATPG methodology has been applied to an industrial quad-core microprocessor. FMAX testing has been done on many devices and silicon data has shown the benefit of KLPG test

Power supply noise in delay testing

As technology scales into the Deep Sub-Micron (DSM) regime, circuit designs have become more and more sensitive to power supply noise. Excessive noise can significantly affect the timing performance of DSM designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This will eventually result in delay test overkill. To reduce this overkill, we propose a low-cost pattern-dependent approach to analyze noise-induced delay variation for each delay test pattern applied to the design. Two noise models have been proposed to address array bond and wire bond power supply networks, and they are experimentally validated and compared. Delay model is then applied to calculate path delay under noise. This analysis approach can be integrated into static test compaction or test fill tools to control supply noise level of delay tests. We also propose an algorithm to predict transition count of a circuit, which can be applied to control switching activity during dynamic compaction. Experiments have been performed on ISCAS89 benchmark circuits. Results show that compacted delay test patterns generated by our compaction tool can meet a moderate noise or delay constraint with only a small increase in compacted test set size. Take the benchmark circuit s38417 for example: a 10% delay increase constraint only results in 1.6% increase in compacted test set size in our experiments. In addition, different test fill techniques have a significant impact on path delay. In our work, a test fill tool with supply noise analysis has been developed to compare several test fill techniques, and results show that the test fill strategy significant affect switching activity, power supply noise and delay. For instance, patterns with minimum transition fill produce less noise-induced delay than random fill. Silicon results also show that test patterns filled in different ways can cause as much as 14% delay variation on target paths. In conclusion, we must take noise into consideration when delay test patterns are generated