Dynamic Energy Management for Chip Multi-processors under Performance Constraints

We introduce a novel algorithm for dynamic energy management (DEM) under performance constraints in chip multi-processors (CMPs). Using the novel concept of delayed instructions count, performance loss estimations are calculated at the end of each control period for each core. In addition, a Kalman filtering based approach is employed to predict workload in the next control period for which voltage-frequency pairs must be selected. This selection is done with a novel dynamic voltage and frequency scaling (DVFS) algorithm whose objective is to reduce energy consumption but without degrading performance beyond the user set threshold. Using our customized Sniper based CMP system simulation framework, we demonstrate the effectiveness of the proposed algorithm for a variety of benchmarks for 16 core and 64 core network-on-chip based CMP architectures. Simulation results show consistent energy savings across the board. We present our work as an investigation of the tradeoff between the achievable energy reduction via DVFS when predictions are done using the effective Kalman filter for different performance penalty thresholds

Power aware early design stage hardware software co-optimization

Co-optimizing hardware and software can lead to substantial performance and energy benefits, and is becoming an increasingly important design paradigm. In scientific computing, power constraints increasingly necessitate the return to specialized chips such as Intel’s MIC or IBM’s Blue-Gene architectures. To enable hardware/software co-design in early stages of the design cycle, we propose a simulation infrastructure methodology by combining high-abstraction performance simulation using Sniper with power modeling using McPAT and custom DRAM power models. Sniper/McPAT is fast — simulation speed is around 2 MIPS on an 8-core host machine — because it uses analytical modeling to abstract away core performance during multi-core simulation. We demonstrate Sniper/McPAT’s accuracy through validation against real hardware; we report average performance and power prediction errors of 22.1% and 8.3%, respectively, for a set of SPEComp benchmarks

A general guide to applying machine learning to computer architecture

The resurgence of machine learning since the late 1990s has been enabled by significant advances in computing performance and the growth of big data. The ability of these algorithms to detect complex patterns in data which are extremely difficult to achieve manually, helps to produce effective predictive models. Whilst computer architects have been accelerating the performance of machine learning algorithms with GPUs and custom hardware, there have been few implementations leveraging these algorithms to improve the computer system performance. The work that has been conducted, however, has produced considerably promising results. The purpose of this paper is to serve as a foundational base and guide to future computer architecture research seeking to make use of machine learning models for improving system efficiency. We describe a method that highlights when, why, and how to utilize machine learning models for improving system performance and provide a relevant example showcasing the effectiveness of applying machine learning in computer architecture. We describe a process of data generation every execution quantum and parameter engineering. This is followed by a survey of a set of popular machine learning models. We discuss their strengths and weaknesses and provide an evaluation of implementations for the purpose of creating a workload performance predictor for different core types in an x86 processor. The predictions can then be exploited by a scheduler for heterogeneous processors to improve the system throughput. The algorithms of focus are stochastic gradient descent based linear regression, decision trees, random forests, artificial neural networks, and k-nearest neighbors.This work has been supported by the European Research Council (ERC) Advanced Grant RoMoL (Grant Agreemnt 321253) and by the Spanish Ministry of Science and Innovation (contract TIN 2015-65316P).Peer ReviewedPostprint (published version

Dynamic Lifetime Reliability and Energy Management for Network-on-Chip based Chip Multiprocessors

In this dissertation, we study dynamic reliability management (DRM) and dynamic energy management (DEM) techniques for network-on-chip (NoC) based chip multiprocessors (CMPs). In the first part, the proposed DRM algorithm takes both the computational and the communication components of the CMP into consideration and combines thread migration and dynamic voltage and frequency scaling (DVFS) as the two primary techniques to change the CMP operation. The goal is to increase the lifetime reliability of the overall system to the desired target with minimal performance degradation. The simulation results on a variety of benchmarks on 16 and 64 core NoC based CMP architectures demonstrate that lifetime reliability can be improved by 100% for an average performance penalty of 7.7% and 8.7% for the two CMP architectures. In the second part of this dissertation, we first propose novel algorithms that employ Kalman filtering and long short term memory (LSTM) for workload prediction. These predictions are then used as the basis on which voltage/frequency (V/F) pairs are selected for each core by an effective dynamic voltage and frequency scaling algorithm whose objective is to reduce energy consumption but without degrading performance beyond the user set threshold. Secondly, we investigate the use of deep neural network (DNN) models for energy optimization under performance constraints in CMPs. The proposed algorithm is implemented in three phases. The first phase collects the training data by employing Kalman filtering for workload prediction and an efficient heuristic algorithm based on DVFS. The second phase represents the training process of the DNN model and in the last phase, the DNN model is used to directly identify V/F pairs that can achieve lower energy consumption without performance degradation beyond the acceptable threshold set by the user. Simulation results on 16 and 64 core NoC based architectures demonstrate that the proposed approach can achieve up to 55% energy reduction for 10% performance degradation constraints. Simulation experiments compare the proposed algorithm against existing approaches based on reinforcement learning and Kalman filtering and show that the proposed DNN technique provides average improvements in energy-delay-product (EDP) of 6.3% and 6% for the 16 core architecture and of 7.4% and 5.5% for the 64 core architecture

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems

Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in real processors. Since core and memory are fabricated on separate packages in most existing processors, with the memory having lower power densities, thermal management research in processors has primarily focused on the cores. Memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. Such packagings significantly increase the power density, making processors prone to heating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors. To address this issue, we present CoMeT, the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only a ~5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.Comment: https://github.com/marg-tools/CoMe