AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Gaussian Processes for Data Scarcity Challenges

This thesis focuses on Gaussian process models specifically designed for scarce data problems. Data scarcity or lack of data can be a weak spot for many machine learning algorithms. Nevertheless, both are commonly found in a diverse set of applications such as medicine, quality assurance, and remote sensing. Supervised classification algorithms can require large amounts of labeled data, and fulfilling this requirement is not straightforward. In medicine, breast cancer datasets typically have few cancerous cells and many healthy cells due to the overall relative scarcity of cancerous cells versus non-cancerous ones. The lack of cancerous cells causes the dataset to be imbalanced, which makes it difficult for learning algorithms to learn the differences between cancerous and healthy cells. A similar imbalance exists in the quality assurance industry, in which the ratio of faulty to non-faulty cases is very low. In sensor networks, and in particular those which measure air pollution across cities, combining sensors of different qualities can help fill gaps in what is often a very data scarce landscape. In data scarce scenarios, we present a probabilistic latent variable model that can cope with imbalanced data. By incorporating label information, we develop a kernel that can capture shared and private characteristics of data separately. On the other hand, in cases where no labels are available, an active learning based technique is proposed, based on a Gaussian process classifier with an oracle in the loop to annotate only the data about which the algorithm is uncertain. Finally, when disparate data types with different granularity levels are available, a transfer learning based approach is proposed. We show that jointly modeling data with various granularity helps improve prediction of rare data. The developed methods are demonstrated in experiments with real and synthetic data. The results presented in this thesis show that the developed methods improve prediction for scarce data problems with various granularities

Automated Semiconductor Defect Inspection in Scanning Electron Microscope Images: a Systematic Review

A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical failures and wafer-yield limitations. As nodes and patterns get smaller, even high-resolution imaging techniques such as Scanning Electron Microscopy (SEM) produce noisy images due to operating close to sensitivity levels and due to varying physical properties of different underlayers or resist materials. This inherent noise is one of the main challenges for defect inspection. One promising approach is the use of machine learning algorithms, which can be trained to accurately classify and locate defects in semiconductor samples. Recently, convolutional neural networks have proved to be particularly useful in this regard. This systematic review provides a comprehensive overview of the state of automated semiconductor defect inspection on SEM images, including the most recent innovations and developments. 38 publications were selected on this topic, indexed in IEEE Xplore and SPIE databases. For each of these, the application, methodology, dataset, results, limitations and future work were summarized. A comprehensive overview and analysis of their methods is provided. Finally, promising avenues for future work in the field of SEM-based defect inspection are suggested.Comment: 16 pages, 12 figures, 3 table

Attacking Split Manufacturing from a Deep Learning Perspective

The notion of integrated circuit split manufacturing which delegates the front-end-of-line (FEOL) and back-end-of-line (BEOL) parts to different foundries, is to prevent overproduction, piracy of the intellectual property (IP), or targeted insertion of hardware Trojans by adversaries in the FEOL facility. In this work, we challenge the security promise of split manufacturing by formulating various layout-level placement and routing hints as vector- and image-based features. We construct a sophisticated deep neural network which can infer the missing BEOL connections with high accuracy. Compared with the publicly available network-flow attack [1], for the same set of ISCAS-85 benchmarks, we achieve 1.21X accuracy when splitting on M1 and 1.12X accuracy when splitting on M3 with less than 1% running time

MDFRCNN: Malware Detection using Faster Region Proposals Convolution Neural Network

Technological advancement of smart devices has opened up a new trend: Internet of Everything (IoE), where all devices are connected to the web. Large scale networking benefits the community by increasing connectivity and giving control of physical devices. On the other hand, there exists an increased ‘Threat’ of an ‘Attack’. Attackers are targeting these devices, as it may provide an easier ‘backdoor entry to the users’ network’.MALicious softWARE (MalWare) is a major threat to user security. Fast and accurate detection of malware attacks are the sine qua non of IoE, where large scale networking is involved. The paper proposes use of a visualization technique where the disassembled malware code is converted into gray images, as well as use of Image Similarity based Statistical Parameters (ISSP) such as Normalized Cross correlation (NCC), Average difference (AD), Maximum difference (MaxD), Singular Structural Similarity Index Module (SSIM), Laplacian Mean Square Error (LMSE), MSE and PSNR. A vector consisting of gray image with statistical parameters is trained using a Faster Region proposals Convolution Neural Network (F-RCNN) classifier. The experiment results are promising as the proposed method includes ISSP with F-RCNN training. Overall training time of learning the semantics of higher-level malicious behaviors is less. Identification of malware (testing phase) is also performed in less time. The fusion of image and statistical parameter enhances system performance with greater accuracy. The benchmark database from Microsoft Malware Classification challenge has been used to analyze system performance, which is available on the Kaggle website. An overall average classification accuracy of 98.12% is achieved by the proposed method

Obfuscated memory malware detection in resource-constrained iot devices for smart city applications

Obfuscated Memory Malware (OMM) presents significant threats to interconnected systems, including smart city applications, for its ability to evade detection through concealment tactics. Existing OMM detection methods primarily focus on binary detection. Their multiclass versions consider a few families only and, thereby, fail to detect much existing and emerging malware. Moreover, their large memory size makes them unsuitable to be executed in resource-constrained embedded/IoT devices. To address this problem, in this paper, we propose a multiclass but lightweight malware detection method capable of identifying recent malware and is suitable to execute in embedded devices. For this, the method considers a hybrid model by combining the feature-learning capabilities of convolutional neural networks with the temporal modeling advantage of bidirectional long short-term memory. The proposed architecture exhibits compact size and fast processing speed, making it suitable for deployment in IoT devices that constitute the major components of smart city systems. Extensive experiments with the recent CIC-Malmem-2022 OMM dataset demonstrate that our method outperforms other machine learning-based models proposed in the literature in both detecting OMM and identifying specific attack types. Our proposed method thus offers a robust yet compact model executable in IoT devices for defending against obfuscated malware