Hybrid Satellite-Terrestrial Communication Networks for the Maritime Internet of Things: Key Technologies, Opportunities, and Challenges

With the rapid development of marine activities, there has been an increasing number of maritime mobile terminals, as well as a growing demand for high-speed and ultra-reliable maritime communications to keep them connected. Traditionally, the maritime Internet of Things (IoT) is enabled by maritime satellites. However, satellites are seriously restricted by their high latency and relatively low data rate. As an alternative, shore & island-based base stations (BSs) can be built to extend the coverage of terrestrial networks using fourth-generation (4G), fifth-generation (5G), and beyond 5G services. Unmanned aerial vehicles can also be exploited to serve as aerial maritime BSs. Despite of all these approaches, there are still open issues for an efficient maritime communication network (MCN). For example, due to the complicated electromagnetic propagation environment, the limited geometrically available BS sites, and rigorous service demands from mission-critical applications, conventional communication and networking theories and methods should be tailored for maritime scenarios. Towards this end, we provide a survey on the demand for maritime communications, the state-of-the-art MCNs, and key technologies for enhancing transmission efficiency, extending network coverage, and provisioning maritime-specific services. Future challenges in developing an environment-aware, service-driven, and integrated satellite-air-ground MCN to be smart enough to utilize external auxiliary information, e.g., sea state and atmosphere conditions, are also discussed

Wireless wire - ultra-low-power and high-data-rate wireless communication systems

With the rapid development of communication technologies, wireless personal-area communication systems gain momentum and become increasingly important. When the market gets gradually saturated and the technology becomes much more mature, new demands on higher throughput push the wireless communication further into the high-frequency and high-data-rate direction. For example, in the IEEE 802.15.3c standard, a 60-GHz physical layer is specified, which occupies the unlicensed 57 to 64 GHz band and supports gigabit links for applications such as wireless downloading and data streaming. Along with the progress, however, both wireless protocols and physical systems and devices start to become very complex. Due to the limited cut-off frequency of the technology and high parasitic and noise levels at high frequency bands, the power consumption of these systems, especially of the RF front-ends, increases significantly. The reason behind this is that RF performance does not scale with technology at the same rate as digital baseband circuits. Based on the challenges encountered, the wireless-wire system is proposed for the millimeter wave high-data-rate communication. In this system, beamsteering directional communication front-ends are used, which confine the RF power within a narrow beam and increase the level of the equivalent isotropic radiation power by a factor equal to the number of antenna elements. Since extra gain is obtained from the antenna beamsteering, less front-end gain is required, which will reduce the power consumption accordingly. Besides, the narrow beam also reduces the interference level to other nodes. In order to minimize the system average power consumption, an ultra-low power asynchronous duty-cycled wake-up receiver is added to listen to the channel and control the communication modes. The main receiver is switched on by the wake-up receiver only when the communication is identified while in other cases it will always be in sleep mode with virtually no power consumed. Before transmitting the payload, the event-triggered transmitter will send a wake-up beacon to the wake-up receiver. As long as the wake-up beacon is longer than one cycle of the wake-up receiver, it can be captured and identified. Furthermore, by adopting a frequency-sweeping injection locking oscillator, the wake-up receiver is able to achieve good sensitivity, low latency and wide bandwidth simultaneously. In this way, high-data-rate communication can be achieved with ultra-low average power consumption. System power optimization is achieved by optimizing the antenna number, data rate, modulation scheme, transceiver architecture, and transceiver circuitries with regards to particular application scenarios. Cross-layer power optimization is performed as well. In order to verify the most critical elements of this new approach, a W-band injection-locked oscillator and the wake-up receiver have been designed and implemented in standard TSMC 65-nm CMOS technology. It can be seen from the measurement results that the wake-up receiver is able to achieve about -60 dBm sensitivity, 10 mW peak power consumption and 8.5 µs worst-case latency simultaneously. When applying a duty-cycling scheme, the average power of the wake-up receiver becomes lower than 10 µW if the event frequency is 1000 times/day, which matches battery-based or energy harvesting-based wireless applications. A 4-path phased-array main receiver is simulated working with 1 Gbps data rate and on-off-keying modulation. The average power consumption is 10 µW with 10 Gb communication data per day

Microwave Photonic Applications - From Chip Level to System Level

Die Vermischung von Mikrowellen- und optischen Technologien – Mikrowellenphotonik – ist ein neu aufkommendes Feld mit hohem Potential. Durch die Nutzung der Vorzüge beider Welten hat die Mikrowellenphotonik viele Anwendungsfälle und ist gerade erst am Beginn ihrer Erfolgsgeschichte. Der Weg für neue Konzepte, neue Komponenten und neue Anwendungen wird dadurch geebnet, dass ein höherer Grad an Integration sowie neue Technologien wie Silicon Photonics verfügbar sind. In diesem Werk werden zuerst die notwendigen grundlegenden Basiskomponenten – optische Quelle, elektro-optische Wandlung, Übertragungsmedium und opto-elektrische Wandlung – eingeführt. Mithilfe spezifischer Anwendungsbeispiele, die von Chipebene bis hin zur Systemebene reichen, wird der elektrooptische Codesign-Prozess veranschaulicht. Schließlich werden zukünftige Ausrichtungen wie die Unterstützung von elektrischen Trägern im Millimeterwellen- und THz-Bereich sowie Realisierungsoptionen in integrierter Optik und Nanophotonik diskutiert.The hybridization between microwave and optical technologies – microwave photonics – is an emerging field with high potential. Benefitting from the best of both worlds, microwave photonics has many use cases and is just at the beginning of its success story. The availability of a higher degree of integration and new technologies such as silicon photonics paves the way for new concepts, new components and new applications. In this work, first, the necessary basic building blocks – optical source, electro-optical conversion, transmission medium and opto-electrical conversion – are introduced. With the help of specific application examples ranging from chip level to system level, the electro-optical co-design process for microwave photonic systems is illustrated. Finally, future directions such as the support of electrical carriers in the millimeter wave and THz range and realization options in integrated optics and nanophotonics are discussed

FDMA Enabled Phase-based Wireless Network-on-Chip using Graphene-based THz-band Antennas

The future growth in System-on-chip design is moving in the direction of multicore systems. Design of efficient interconnects between cores are crucial for improving the performance of a multicore processor. Such trends are seen due to the benefits the multicore systems provide in terms of power reduction and scalability. Network-on-chips (NoC) are viewed as an emerging solution in the design of interconnects in multicore systems. However, Traditional Network-on-chip architectures are no longer able to satisfy the performance requirements due to long distance communication over multi-hop wireline paths. Multi-hop communication leads to higher energy consumption, increase in latency and reduction in bandwidth. Research in recent years has explored emerging technologies such as 3D integration, photonic and radio frequency based Network-on-chips. The use of wireless interconnects using mm-wave antennas are able to alleviate the performance issues in a wireline interconnect system. However, to satisfy the increasing demand for higher bandwidth and lower energy consumption, Wireless Network-on-Chip enabled with high speed direct links operating in THz band between distant cores is desired. Recent research has brought to light highly efficient graphene-based antennas operating in THz band. These antennas can provide high data rate and are found to consume less power with low area overheads. In this thesis, an innovative approach using novel devices based on graphene structures is proposed to provide a high-performance on-chip interconnection. This novel approach combines the regular NoC structure with the proposed wireless infrastructure to exploit the performance benefits. An architecture with wireless interfaces on every core is explored in this work. Simultaneous multiple communications in a network can be achieved by adopting Frequency Division Multiple access (FDMA). However, in a system where all cores are equipped with a wireless interface, FDMA requires more number of frequency bands. This becomes difficult to achieve as the system scales and the number of cores increase. Therefore, a FDMA protocol along with a 4-phased repetitive multi-band architecture is envisioned in this work. The phase-based protocol allows multiple wireless links to be active at a time, the phase-based protocol along with the FDMA protocol provides a reliable data transfer between cores with lesser number of frequency bands. In this thesis, an architecture with a combination of FDMA and phase-based protocol using point-to-point graphene-based wireless links is proposed. The proposed architecture is also extended for a multichip system. With cycle accurate system-level simulations, it is shown that the proposed architecture provides huge gains in performance and energy-efficiency in data transfer both in NoC based multicore and multichip systems

Antennas and Propagation Aspects for Emerging Wireless Communication Technologies

The increasing demand for high data rate applications and the delivery of zero-latency multimedia content drives technological evolutions towards the design and implementation of next-generation broadband wireless networks. In this context, various novel technologies have been introduced, such as millimeter wave (mmWave) transmission, massive multiple input multiple output (MIMO) systems, and non-orthogonal multiple access (NOMA) schemes in order to support the vision of fifth generation (5G) wireless cellular networks. The introduction of these technologies, however, is inextricably connected with a holistic redesign of the current transceiver structures, as well as the network architecture reconfiguration. To this end, ultra-dense network deployment along with distributed massive MIMO technologies and intermediate relay nodes have been proposed, among others, in order to ensure an improved quality of services to all mobile users. In the same framework, the design and evaluation of novel antenna configurations able to support wideband applications is of utmost importance for 5G context support. Furthermore, in order to design reliable 5G systems, the channel characterization in these frequencies and in the complex propagation environments cannot be ignored because it plays a significant role. In this Special Issue, fourteen papers are published, covering various aspects of novel antenna designs for broadband applications, propagation models at mmWave bands, the deployment of NOMA techniques, radio network planning for 5G networks, and multi-beam antenna technologies for 5G wireless communications

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework