High-Performance Placement and Routing for the Nanometer Scale.

Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years ago required ten to twenty chips. Naturally, design complexity has grown within this period. In contrast to this growth, it is becoming common in the industry to limit design team size which places a heavier burden on design automation tools. Our work identifies new objectives, constraints and concerns in the physical design of systems-on-chip, and develops new computational techniques to address them. In addition to faster and more relevant design optimizations, we demonstrate that traditional design flows based on ``separation of concerns'' produce unnecessarily suboptimal layouts. We develop new integrated optimizations that streamline traditional chains of loosely-linked design tools. In particular, we bridge the gap between mixed-size placement and routing by updating the objective of global and detail placement to a more accurate estimate of routed wirelength. To this we add sophisticated whitespace allocation, and the combination provides increased routability, faster routing, shorter routed wirelength, and the best via counts of published techniques. To further improve post-routing design metrics, we present new global routing techniques based on Discrete Lagrange Multipliers (DLM) which produce the best routed wirelength results on recent benchmarks. Our work culminates in the integration of our routing techniques within an incremental placement flow to improve detailed routing solutions, shrink die sizes and reduce total chip cost. Not only do our techniques improve the quality and cost of designs, but also simplify design automation software implementation in many cases. Ultimately, we reduce the time needed for design closure through improved tool fidelity and the use of our incremental techniques for placement and routing.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/64639/1/royj_1.pd

Tag-Cloud Drawing: Algorithms for Cloud Visualization

Tag clouds provide an aggregate of tag-usage statistics. They are typically sent as in-line HTML to browsers. However, display mechanisms suited for ordinary text are not ideal for tags, because font sizes may vary widely on a line. As well, the typical layout does not account for relationships that may be known between tags. This paper presents models and algorithms to improve the display of tag clouds that consist of in-line HTML, as well as algorithms that use nested tables to achieve a more general 2-dimensional layout in which tag relationships are considered. The first algorithms leverage prior work in typesetting and rectangle packing, whereas the second group of algorithms leverage prior work in Electronic Design Automation. Experiments show our algorithms can be efficiently implemented and perform well.Comment: To appear in proceedings of Tagging and Metadata for Social Information Organization (WWW 2007

RTL-aware dataflow-driven macro placement

© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.When RTL designers define the hierarchy of a system, they exploit their knowledge about the conceptual abstractions devised during the design and the functional interactions between the logical components. This valuable information is often lost during physical synthesis. This paper proposes a novel multi-level approach for the macro placement problem of complex designs dominated by macro blocks, typically memories. By taking advantage of the hierarchy tree, the netlist is divided into blocks containing macros and standard cells, and their dataflow affinity is inferred considering the latency and flow width of their interaction. The layout is represented using slicing structures and generated with a top-down algorithm capable of handling blocks with both hard and soft components, aimed at wirelength minimization. These techniques have been applied to a set of large industrial circuits and compared against both a commercial floorplanner and handcrafted floorplans by expert back-end engineers. The proposed approach outperforms the commercial tool and produces solutions with similar quality to the best handcrafted floorplans. Therefore, the generated floorplans provide an excellent starting point for the physical design iterations and contribute to reduce turn-around time significantly.Peer ReviewedPostprint (author's final draft

MaskPlace: Fast Chip Placement via Reinforced Visual Representation Learning

Placement is an essential task in modern chip design, aiming at placing millions of circuit modules on a 2D chip canvas. Unlike the human-centric solution, which requires months of intense effort by hardware engineers to produce a layout to minimize delay and energy consumption, deep reinforcement learning has become an emerging autonomous tool. However, the learning-centric method is still in its early stage, impeded by a massive design space of size ten to the order of a few thousand. This work presents MaskPlace to automatically generate a valid chip layout design within a few hours, whose performance can be superior or comparable to recent advanced approaches. It has several appealing benefits that prior arts do not have. Firstly, MaskPlace recasts placement as a problem of learning pixel-level visual representation to comprehensively describe millions of modules on a chip, enabling placement in a high-resolution canvas and a large action space. It outperforms recent methods that represent a chip as a hypergraph. Secondly, it enables training the policy network by an intuitive reward function with dense reward, rather than a complicated reward function with sparse reward from previous methods. Thirdly, extensive experiments on many public benchmarks show that MaskPlace outperforms existing RL approaches in all key performance metrics, including wirelength, congestion, and density. For example, it achieves 60%-90% wirelength reduction and guarantees zero overlaps. We believe MaskPlace can improve AI-assisted chip layout design. The deliverables are released at https://laiyao1.github.io/maskplace

Hier-RTLMP: A Hierarchical Automatic Macro Placer for Large-scale Complex IP Blocks

In a typical RTL to GDSII flow, floorplanning or macro placement is a critical step in achieving decent quality of results (QoR). Moreover, in today's physical synthesis flows (e.g., Synopsys Fusion Compiler or Cadence Genus iSpatial), a floorplan .def with macro and IO pin placements is typically needed as an input to the front-end physical synthesis. Recently, with the increasing complexity of IP blocks, and in particular with auto-generated RTL for machine learning (ML) accelerators, the number of hard macros in a single RTL block can easily run into the several hundreds. This makes the task of generating an automatic floorplan (.def) with IO pin and macro placements for front-end physical synthesis even more critical and challenging. The so-called peripheral approach of forcing macros to the periphery of the layout is no longer viable when the ratio of the sum of the macro perimeters to the floorplan perimeter is large, since this increases the required stacking depth of macros. In this paper, we develop a novel multilevel physical planning approach that exploits the hierarchy and dataflow inherent in the design RTL, and describe its realization in a new hierarchical macro placer, Hier-RTLMP. Hier-RTLMP borrows from traditional approaches used in manual system-on-chip (SoC) floorplanning to create an automatic macro placement for use with large IP blocks containing very large numbers of hard macros. Empirical studies demonstrate substantial improvements over the previous RTL-MP macro placement approach, and promising post-route improvements relative to a leading commercial place-and-route tool

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version