IRON-MAN: An Approach To Perform Temporal Motionless Analysis of Video using CNN in MPSoC

This paper proposes a novel human-inspired methodology called IRON-MAN ( Integrated RatiONal prediction and Motionless ANalysis ) for mobile multi-processor systems-on-chips (MPSoCs). The methodology integrates analysis of the previous image frames of the video to represent the analysis of the current frame in order to perform Temporal Motionless Analysis of the Video ( TMAV ). This is the first work on TMAV using Convolutional Neural Network (CNN) for scene prediction in MPSoCs. Experimental results show that our methodology outperforms state-of-the-art. We also introduce a metric named, Energy Consumption per Training Image ( ECTI ) to assess the suitability of using a CNN model in mobile MPSoCs with a focus on energy consumption and lifespan reliability of the device

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

Methoden und Beschreibungssprachen zur Modellierung und Verifikation vonSchaltungen und Systemen: MBMV 2015 - Tagungsband, Chemnitz, 03. - 04. März 2015

Der Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2015) findet nun schon zum 18. mal statt. Ausrichter sind in diesem Jahr die Professur Schaltkreis- und Systementwurf der Technischen Universität Chemnitz und das Steinbeis-Forschungszentrum Systementwurf und Test. Der Workshop hat es sich zum Ziel gesetzt, neueste Trends, Ergebnisse und aktuelle Probleme auf dem Gebiet der Methoden zur Modellierung und Verifikation sowie der Beschreibungssprachen digitaler, analoger und Mixed-Signal-Schaltungen zu diskutieren. Er soll somit ein Forum zum Ideenaustausch sein. Weiterhin bietet der Workshop eine Plattform für den Austausch zwischen Forschung und Industrie sowie zur Pflege bestehender und zur Knüpfung neuer Kontakte. Jungen Wissenschaftlern erlaubt er, ihre Ideen und Ansätze einem breiten Publikum aus Wissenschaft und Wirtschaft zu präsentieren und im Rahmen der Veranstaltung auch fundiert zu diskutieren. Sein langjähriges Bestehen hat ihn zu einer festen Größe in vielen Veranstaltungskalendern gemacht. Traditionell sind auch die Treffen der ITGFachgruppen an den Workshop angegliedert. In diesem Jahr nutzen zwei im Rahmen der InnoProfile-Transfer-Initiative durch das Bundesministerium für Bildung und Forschung geförderte Projekte den Workshop, um in zwei eigenen Tracks ihre Forschungsergebnisse einem breiten Publikum zu präsentieren. Vertreter der Projekte Generische Plattform für Systemzuverlässigkeit und Verifikation (GPZV) und GINKO - Generische Infrastruktur zur nahtlosen energetischen Kopplung von Elektrofahrzeugen stellen Teile ihrer gegenwärtigen Arbeiten vor. Dies bereichert denWorkshop durch zusätzliche Themenschwerpunkte und bietet eine wertvolle Ergänzung zu den Beiträgen der Autoren. [... aus dem Vorwort

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Temperature Variation Aware Energy Optimization in Heterogeneous MPSoCs

Thermal effects are rapidly gaining importance in nanometer heterogeneous integrated systems. Increased power density, coupled with spatio-temporal variability of chip workload, cause lateral and vertical temperature non-uniformities (variations) in the chip structure. The assumption of an uniform temperature for a large circuit leads to inaccurate determination of key design parameters. To improve design quality, we need precise estimation of temperature at detailed spatial resolution which is very computationally intensive. Consequently, thermal analysis of the designs needs to be done at multiple levels of granularity. To further investigate the flow of chip/package thermal analysis we exploit the Intel Single Chip Cloud Computer (SCC) and propose a methodology for calibration of SCC on-die temperature sensors. We also develop an infrastructure for online monitoring of SCC temperature sensor readings and SCC power consumption. Having the thermal simulation tool in hand, we propose MiMAPT, an approach for analyzing delay, power and temperature in digital integrated circuits. MiMAPT integrates seamlessly into industrial Front-end and Back-end chip design flows. It accounts for temperature non-uniformities and self-heating while performing analysis. Furthermore, we extend the temperature variation aware analysis of designs to 3D MPSoCs with Wide-I/O DRAM. We improve the DRAM refresh power by considering the lateral and vertical temperature variations in the 3D structure and adapting the per-DRAM-bank refresh period accordingly. We develop an advanced virtual platform which models the performance, power, and thermal behavior of a 3D-integrated MPSoC with Wide-I/O DRAMs in detail. Moving towards real-world multi-core heterogeneous SoC designs, a reconfigurable heterogeneous platform (ZYNQ) is exploited to further study the performance and energy efficiency of various CPU-accelerator data sharing methods in heterogeneous hardware architectures. A complete hardware accelerator featuring clusters of OpenRISC CPUs, with dynamic address remapping capability is built and verified on a real hardware

Energy Efficiency and Performance in Multiprocessors Systems on Chip

As process technology shrinks, the transistor count on CPUs has increased. The breakdown of Dennard scaling has led to diminishing returns in terms of performance per power. A trend which promises to impact future CPU designs. This breakdown is due in part to the increase in transistor leakage driven static power. We, now, have constrained energy and power budgets. Thus, energy consumption has to be justified by an increased in performance. Simultaneously, architects have shifted to chip multiprocessors(CMPs) designs with large shared last level cache(LLC) to mitigate the cost of long latency off-chip memory access. A primary reason for that shift is the power efficiency of CMPs. Additionally, technology scaling has allowed the integration of platform components on the chip; a design referred to as multiprocessors system on chip (MpSoC). This integration improves the system performance as the communication latency between the components is reduced. Memory subsystems are essential to CPUs performance. Larger caches provide the CPU faster access to a larger data set. Consequently, the size of last level caches have increased to become a significant leakage power dissipation source. We propose a technique to facilitate power gating a partition of the LLC by migrating the high temporal blocks to a live partition; Thus reducing the performance impact. Given the high latency of memory subsystems, prefetching improves CPU performance by speculating future memory accesses and requesting the data ahead of the demand. In the context of CMPs running multiple concurrent processes, prefetching accuracy is critical to prevent cache pollution effects. Furthermore, given the current constraint energy environment, there is a need for lightweight prefetchers with high accuracy. To this end, we present BFetch a lightweight and accurate prefetcher driven by control flow predictions and effective address speculation. MpSoCs have mostly been used in mobile devices. The energy constraint is more pronounced in MpSoCs-based, battery powered mobile devices. The need to address the energy consumption in MpSoCs is further accentuated by the proliferation of mobile devices. This dissertation presents a framework to optimize the energy in MpSoCs. The proposed framework minimizes the energy consumption while meeting performance and power budgets constraints. We first apply this framework to the CPU then extend it to accommodate the GPU

Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies

One of the main challenges in building future high performance systems is the ability to maintain safe on-chip temperatures in presence of high power densities. Handling such high power densities necessitates novel cooling solutions that are significantly more efficient than their existing counterparts. A number of advanced cooling methods have been proposed to address the temperature problem in processors. However, tradeoffs exist between performance, cost, and efficiency of those cooling methods, and these tradeoffs depend on the target system properties. Hence, a single cooling solution satisfying optimum conditions for any arbitrary system does not exist. This thesis claims that in order to reach exascale computing, a dramatic improvement in energy efficiency is needed, and achieving this improvement requires a temperature-centric co-design of the cooling and computing subsystems. Such co-design requires detailed system-level thermal modeling, design-time optimization, and runtime management techniques that are aware of the underlying processor architecture and application requirements. To this end, this thesis first proposes compact thermal modeling methods to characterize the complex thermal behavior of cutting-edge cooling solutions, mainly Phase Change Material (PCM)-based cooling, liquid cooling, and thermoelectric cooling (TEC), as well as hybrid designs involving a combination of these. The proposed models are modular and they enable fast and accurate exploration of a large design space. Comparisons against multi-physics simulations and measurements on testbeds validate the accuracy of our models (resulting in less than 1C error on average) and demonstrate significant reductions in simulation time (up to four orders of magnitude shorter simulation times). This thesis then introduces temperature-aware optimization techniques to maximize energy efficiency of a given system as a whole (including computing and cooling energy). The proposed optimization techniques approach the temperature problem from various angles, tackling major sources of inefficiency. One important angle is to understand the application power and performance characteristics and to design management techniques to match them. For workloads that require short bursts of intense parallel computation, we propose using PCM-based cooling in cooperation with a novel Adaptive Sprinting technique. By tracking the PCM state and incorporating this information during runtime decisions, Adaptive Sprinting utilizes the PCM heat storage capability more efficiently, achieving 29\% performance improvement compared to existing sprinting policies. In addition to the application characteristics, high heterogeneity in on-chip heat distribution is an important factor affecting efficiency. Hot spots occur on different locations of the chip with varying intensities; thus, designing a uniform cooling solution to handle worst-case hot spots significantly reduces the cooling efficiency. The hybrid cooling techniques proposed as part of this thesis address this issue by combining the strengths of different cooling methods and localizing the cooling effort over hot spots. Specifically, the thesis introduces LoCool, a cooling system optimizer that minimizes cooling power under temperature constraints for hybrid-cooled systems using TECs and liquid cooling. Finally, the scope of this work is not limited to existing advanced cooling solutions, but it also extends to emerging technologies and their potential benefits and tradeoffs. One such technology is integrated flow cell array, where fuel cells are pumped through microchannels, providing both cooling and on-chip power generation. This thesis explores a broad range of design parameters including maximum chip temperature, leakage power, and generated power for flow cell arrays in order to maximize the benefits of integrating this technology with computing systems. Through thermal modeling and runtime management techniques, and by exploring the design space of emerging cooling solutions, this thesis provides significant improvements in processor energy efficiency.2018-07-09T00:00:00

Providing Information by Resource- Constrained Data Analysis

The Collaborative Research Center SFB 876 (Providing Information by Resource-Constrained Data Analysis) brings together the research fields of data analysis (Data Mining, Knowledge Discovery in Data Bases, Machine Learning, Statistics) and embedded systems and enhances their methods such that information from distributed, dynamic masses of data becomes available anytime and anywhere. The research center approaches these problems with new algorithms respecting the resource constraints in the different scenarios. This Technical Report presents the work of the members of the integrated graduate school

Hardware and Software Optimizations for Accelerating Deep Neural Networks: Survey of Current Trends, Challenges, and the Road Ahead

Currently, Machine Learning (ML) is becoming ubiquitous in everyday life. Deep Learning (DL) is already present in many applications ranging from computer vision for medicine to autonomous driving of modern cars as well as other sectors in security, healthcare, and finance. However, to achieve impressive performance, these algorithms employ very deep networks, requiring a significant computational power, both during the training and inference time. A single inference of a DL model may require billions of multiply-and-accumulated operations, making the DL extremely compute-and energy-hungry. In a scenario where several sophisticated algorithms need to be executed with limited energy and low latency, the need for cost-effective hardware platforms capable of implementing energy-efficient DL execution arises. This paper first introduces the key properties of two brain-inspired models like Deep Neural Network (DNN), and Spiking Neural Network (SNN), and then analyzes techniques to produce efficient and high-performance designs. This work summarizes and compares the works for four leading platforms for the execution of algorithms such as CPU, GPU, FPGA and ASIC describing the main solutions of the state-of-the-art, giving much prominence to the last two solutions since they offer greater design flexibility and bear the potential of high energy-efficiency, especially for the inference process. In addition to hardware solutions, this paper discusses some of the important security issues that these DNN and SNN models may have during their execution, and offers a comprehensive section on benchmarking, explaining how to assess the quality of different networks and hardware systems designed for them