An On-line BIST RAM Architecture with Self Repair Capabilities

The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur

Memory read faults: taxonomy and automatic test generation

This paper presents an innovative algorithm for the automatic generation of March tests. The proposed approach is able to generate an optimal March test for an unconstrained set of memory faults in very low computation time. Moreover, we propose a new complete taxonomy for memory read faults, a class of faults never carefully addressed in the past

A Low-Cost FPGA-Based Test and Diagnosis Architecture for SRAMs

The continues improvement of manufacturing technologies allows the realization of integrated circuits containing an ever increasing number of transistors. A major part of these devices is devoted to realize SRAM blocks. Test and diagnosis of SRAM circuits are therefore an important challenge for improving quality of next generation integrated circuits. This paper proposes a flexible platform for testing and diagnosis of SRAM circuits. The architecture is based on the use of a low cost FPGA based board allowing high diagnosability while keeping costs at a very low leve

Flash-memories in Space Applications: Trends and Challenges

Nowadays space applications are provided with a processing power absolutely overcoming the one available just a few years ago. Typical mission-critical space system applications include also the issue of solid-state recorder(s). Flash-memories are nonvolatile, shock-resistant and power-economic, but in turn have different drawbacks. A solid-state recorder for space applications should satisfy many different constraints especially because of the issues related to radiations: proper countermeasures are needed, together with EDAC and testing techniques in order to improve the dependability of the whole system. Different and quite often contrasting dimensions need to be explored during the design of a flash-memory based solid- state recorder. In particular, we shall explore the most important flash-memory design dimensions and trade-offs to tackle during the design of flash-based hard disks for space application

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Built-In Test Engine For Memory Test

In this paper we will present an on-chip method for testing high performance memory devices, that occupies minimal area and retains full flexibility. This is achieved through microcode test instructions and the associated on-chip state machine. In addition, the proposed methodology will enable at-speed testing of memory devices. The relevancy of this work is placed in context with an introduction to memory testing and the techniques and algorithms generally used today

An optimal algorithm for the automatic generation of March tests

Among the different types of algorithms proposed to test random access memories (RAM), March tests have proven to be faster, simpler, regularly structured and linear in complexity. A March test consists of a sequence of March elements, each composed of a sequence of basic read/write operations to be performed on each cell of the memory, in either ascending or descending order, before proceeding to the next memory cell. The complexity of a March test is given by the number of memory operations in all March elements performed on each memory cell. This paper presents an innovative algorithm for the automatic generation of March tests. The proposed approach is able to generate an optimal March test for an unconstrained set of memory faults in very low computation time

Development of an Abstract Model for a Non-volatile Static Random Access Memory

The capability to protect against power fluctuations, which eventually prevents the corruption of the memory contents makes non-volatile static random access memory a very good choice for use in highly reliability applications. These random access memories are protected against data writing in addition to preserving the desired contents. Energy source and control circuitries are embedded into it for achieving the same. The control circuitry constantly monitors supply voltage level, inhibits data corruption, and switches on the energy source once it falls beyond a threshold level. In this paper, development of an abstract model for such a non-volatile static random access memory chip has been presented. Test sequences based on this model have been generated for this memory chip. These test sequences have been implemented in VLSI tester and exercised on the chips