March AB, a State-of-the-Art March Test for Realistic Static Linked Faults and Dynamic Faults in SRAMs

Memory testing commonly faces two issues: the characterisation of detailed and realistic fault models, and the definition of time-efficient test algorithms able to detect them. Among the different types of algorithms proposed for testing static random access memories (SRAMs), march tests have proven to be faster, simpler and regularly structured. The continuous evolution of the memory technology requires the constant introduction of new classes of faults, such as dynamic and linked faults. Presented here is March AB, a march test targeting realistic memory static linked faults and dynamic unlinked faults. Comparison results show that the proposed march test provides the same fault coverage of already published algorithms reducing the test complexity and therefore the test tim

A Unique March Test Algorithm for the Wide Spread of Realistic Memory Faults in SRAMs

Among the different types of algorithms proposed to test static random access memories (SRAMs), march tests have proven to be faster, simpler and regularly structured. A large number of march tests with different fault coverage have been published. Usually different march tests detect only a specific set of memory faults. The always growing memory production technology introduces new classes of fault, making a key hurdle the generation of new march tests. The aim of this paper is to target the whole set of realistic fault model and to provide a unique march test able to reduce the test complexity of 15.4% than state-of-the-art march algorith

A 22n March Test for Realistic Static Linked Faults in SRAMs

Linked faults are considered an interesting class of memory faults. Their capability of influencing the behavior of other faults causes the hiding of the fault effect and makes test algorithm design a very complex task. Although several March tests have been developed for the wide memory faults spread, a few of them are able to detect linked faults. In the present paper March AB, a March test targeting the set of realistic memory linked fault is presented. Comparison results show that the proposed March test provides the same fault coverage of already published algorithms but, it reduces the test complexity and therefore the test time. Moreover, a complete taxonomy of linked faults will be presente

March Test Generation Revealed

Memory testing commonly faces two issues: the characterization of detailed and realistic fault models and the definition of time-efficient test algorithms. Among the different types of algorithms proposed for testing static random access memories, march tests have proven to be faster, simpler, and regularly structured. The majority of the published march tests have been manually generated. Unfortunately, the continuous evolution of the memory technology introduces new classes of faults such as dynamic and linked faults and makes the task of handwriting test algorithms harder and not always leading to optimal results. Although some researchers published handmade march tests able to deal with new fault models, the problem of a comprehensive methodology to automatically generate march tests addressing both classic and new fault models is still an open issue. This paper proposes a new polynomial algorithm to automatically generate march tests. The formal model adopted to represent memory faults allows the definition of a general methodology to deal with static, dynamic, and linked faults. Experimental results show that the new automatically generated march tests reduce the test complexity and, therefore, the test time, compared to the well-known state of the art in memory testin

Fault Detection with Optimum March Test Algorithm

This paper presents a research work aimed to detect previously-undetected faults, either Write Disturb Faults (WDFs) or Deceptive Read Destructive Faults (DRDFs) or both in March Algorithm such as MATS++(6N), March C-(10N), March SR(14N), and March CL(12N). The main focus of this research is to improve fault coverage on Single Cell Faults as well as Static Double Cell Faults detection, using specified test algorithm. Transition Coupling Faults (CFtrs), Write Destructive Coupling Faults (CFwds) and Deceptive Read Destructive Faults (CFdrds) are types of faults mainly used in this research. The experiment result published in [1] shows BIST (Built-In-Self-Test) implementation with the new algorithm. It provides the same test length but with bigger area overhead, we therefore proposed a new 14N March Test Algorithm with fault coverage of more than 95% using solid 0s and 1s Data Background (DB). This paper reveals the design methodology to generate DB covers all memories function by applying non-transition data, transition data, and single read and double read data. The automation hardware was designed to give the flexibility to the user to generate other new March Algorithm prior to the selected algorithm and analyzed the performance in terms of fault detection and power consumption

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Automatic generation of user-defined test algorithm description file for memory BIST implementation

Memory built-in self-test (BIST) is a widely used technique to allow the self-test and self-checking of the embedded memories on chips after the fabrication process. It can be used by implementing a standard testing algorithm available in the EDA tool library or a user-defined algorithm (UDA). This paper presents the development of software that automatically generates a description file of a UDA to be deployed for memory BIST circuit implementation using Tessent memory BIST software. It comprises the test setup and also the microprogram coding for each instruction to be executed when performing tests on embedded memories. The proposed automation software was tested by using March SR as the input algorithm and the results obtained from the simulations show that the output test patterns generated by the implemented memory BIST match the expected patterns and passed all the tests, which validated the correct functionality of the UDA description file generation. The proposed automation software also fast generation the UDA description file, which was completed in less than 500 ms

Reliable Software for Unreliable Hardware - A Cross-Layer Approach

A novel cross-layer reliability analysis, modeling, and optimization approach is proposed in this thesis that leverages multiple layers in the system design abstraction (i.e. hardware, compiler, system software, and application program) to exploit the available reliability enhancing potential at each system layer and to exchange this information across multiple system layers

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems