Liquid cooling of non-uniform heat flux of chip circuit by submicrochannels

Sumbmicrochannels have been placed on the hotspots in a non-uniform heat generated chip circuit to increase the liquid/solid interaction area and then to enhance the heat dissipation. Main microchannels width is 185µm, which is twice the width of the submicrochannels and also includes the wall thickness of 35µm, and wall height is 500µm. The chip dimension is 10mm×10mm and the hotspot is 4mm×10m. Different positions of the hotspot have been investigated e.g. upstream, middle and downstream. Uniform heat flux is 100W/cm2 while for the hot spot is 150 W/cm2. Single channel simulation reveals that the downstream hotspot gives a lower temperature of the chip circuit surface; however the upstream hotspot has more uniform temperature distribution. A special design of manifold was adopted to ensure an equal mass distribution through the microchannels

Optimal microscale water cooled heat sinks for targeted alleviation of hotspot in microprocessors

This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at University College, London, UK. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute, ASME Press, LCN London Centre for Nanotechnology, UCL University College London, UCL Engineering, the International NanoScience Community, www.nanopaprika.eu.Hotspots in microprocessors arise due to non-uniform utilization of the underlying integrated circuits during chip operation. Conventional liquid cooling using microchannels leads to undercooling of the hotspot areas and overcooling of the background area of the chip resulting in excessive temperature gradients across the chip. These in turn adversely affect the chip performance and reliability. This problem becomes even more acute in multi-core processors where most of the processing power is concentrated in specific regions of the chip called as cores. We present a 1-dimensional model for quick design of a microchannel heat sink for targeted, single-phase liquid cooling of hotspots in microprocessors. The method utilizes simplifying assumptions and analytical equations to arrive at the first estimate of a microchannel heat sink design that distributes the cooling capacity of the heat sink by adapting the coolant flow and microchannel size distributions to the microprocessor power map. This distributed cooling in turn minimizes the chip temperature gradient. The method is formulated to generate a heat sink design for an arbitrary chip power map and hence can be readily utilized for different chip architectures. It involves optimization of microchannel widths for various zones of the chip power map under the operational constraints of maximum pressure drop limit for the heat sink. Additionally, it ensures that the coolant flows uninterrupted through its entire travel length consisting of microchannels of varying widths. The resulting first design estimate significantly reduces the computational effort involved in any subsequent CFD analysis required to fine tune the design for more complex flow situations arising, for example, in manifold microchannel heat sinks

Experimental investigation of non-uniform heating on flow boiling instabilities in a microchannels based heat sink

Two-phase flow boiling in microchannels is one of the most promising cooling technologies able to cope with high heat fluxes generated by the next generation of central processor units (CPU). If flow boiling is to be used as a thermal management method for high heat flux electronics it is necessary to understand the behaviour of a non-uniform heat distribution, which is typically the case observed in a real operating CPU. The work presented is an experimental study of two-phase boiling in a multi-channel silicon heat sink with non-uniform heating, using water as a cooling liquid. Thin nickel film sensors, integrated on the back side of the heat sinks were used in order to gain insight related to temperature fluctuations caused by two-phase flow instabilities under non-uniform heating. The effect of various hotspot locations on the temperature profile and pressure drop has been investigated, with hotspots located in different positions along the heat sink. It was observed that boiling inside microchannels with non-uniform heating led to high temperature non-uniformity in transverse direction

Experimental investigation of non-uniform heating effect on flow boiling instabilities in a microchannel-based heat sink

Copyright @ 2011 ElsevierTwo-phase flow boiling in microchannels is one of the most promising cooling technologies for coping with high heat fluxes produced by the next generation of central processor units (CPUs). If flow boiling is to be used as a thermal management method for high heat flux electronics it is necessary to understand the behaviour of a non-uniform heat distribution, which is typically the case observed in a real operating CPU. The work presented is an experimental study of two-phase boiling in a multi-channel silicon heat sink with non-uniform heating, using water as the cooling liquid. Thin nickel film sensors, integrated on the back side of the heat sinks were used in order to gain insight related to temperature fluctuations caused by two-phase flow instabilities under non-uniform heating. The effect of various hotspot locations on the temperature profile and pressure drop has been investigated. It was observed that boiling inside microchannels with axially non-uniform heating leads to high temperature non-uniformity in the transverse direction.This research was supported by the UK Engineering and Physical Sciences Research Council through grant EP/D500109/1

The design of mini/micro heat exchangers: A world of opportunities and constraints

Micro heat exchangers and heat sinks broadened their use in many technological fields during the last two decades. The reduction of the dimensions of the channels allows to obtain ultra-compact heat exchangers characterized by higher surface-to-volume ratio and overall heat transfer coefficients but, in general, with large pressure losses. Many imaginative configurations have been proposed and tested, by changing the geometry of the manifolds, the position of the inlet/outlet ports, the structure of the heat transfer core, the structural materials and others more. Unfortunately, these efforts were not coordinated and a complete overview of the results accumulated up to now is not available. However, some general conclusions can be made by using the published results and the main scope of this paper is to summarize these milestones. Some shared conclusion are the following: (i) the design of micro heat exchangers can be obtained by using the classical methods developed for conventional heat exchangers even if the presence of non- negligible scaling effects (i.e. compressibility effects, conjugate wall-fluid effects, viscous dissipation) must be always verified; (ii) the performances of micro heat exchangers and heat sinks is strongly influenced by the proper distribution of the flow rate within the heat transfer core and a series of different solutions is available in order to solve this problem, as summarized in this paper; (iii) the presence of strong conjugate wall-fluid heat transfer effects can become an opportunity for the use of miniaturized heat exchangers made with inexpensive materials having low thermal conductivity values, especially in presence of counter-current flow and cross-flow configurations

On emerging micro- and nanoscale thermofluidic technologies

This paper was presented at the 2nd Micro and Nano Flows Conference (MNF2009), which was held at Brunel University, West London, UK. The conference was organised by Brunel University and supported by the Institution of Mechanical Engineers, IPEM, the Italian Union of Thermofluid dynamics, the Process Intensification Network, HEXAG - the Heat Exchange Action Group and the Institute of Mathematics and its Applications.This paper highlights examples of my current research in heat transfer and fluidics at the interface of energy applications and micro- and nanoscale technologies. It is not the scope of this paper to present an exhaustive account of all current and past activities related to its title. It is rather an account of current research in my laboratory in this area, containing both the underlying scientific challenges as well as the hoped final outcome in terms of applications. To this end, examples from the areas of energy conversion, as well as energy transport will be discussed. In the area of energy conversion an original, deformable, direct methanol microfuel cell will be presented made of lightweight, flexible, polymer-based materials. A basic understanding and control of two-phase flows (in this case methanol and carbon dioxide) in microchannels as well as novel materials processing and microfabrication methods are directly related to the performance of such energy conversion devices. In the area of energy conservation and reuse, examples from the information technology are employed. Specifically, new concepts of liquid (water) cooling of chips reaching heat removal rates in excess of 700 W/cm2 in domains with restricted heights of the order of one mm will be presented. One additional advantage of using water to cool high density electronics is energy reuse, due to the potentially much higher exergy content of the coolant compared to air cooled technologies. The last part of the paper focuses on the employment of functional nanostructures such as carbon nanotubes and nanowires of conductive and semiconductive materials for the efficient transport of electricity and heat and the need for the development of novel technologies for the manufacturing, characterization as well as handling of such nanostructures

Characterization of Two-Phase Flow in Microchannels

Aluminum multi-port microchannel tubes are currently utilized in automotive air conditioners for refrigerant condensation. Recent research activities are directed toward developing other air conditioning and refrigeration systems with microchannel condensers and evaporators. Three parameters are necessary to analyze a heat exchanger performance: heat transfer, pressure drop, and void fraction. The purpose of this investigation is the experimental investigation of void fraction and frictional pressure drop in microchannels. A flow visualization analysis is another important goal for two-phase flow behavior understanding and experimental analysis. Experiments were performed with a 6-port and a 14-port microchannel with hydraulic diameters of 1.54 mm and 1.02 mm, respectively. Mass fluxes from 50 to 300 kg/s.m2 (range of most typical automotive applications) are operated, with quality ranging from 0% to 100% for two-phase flow experiments. R410A, R134a, and air-water mixtures are used as primary fluids. The results from the flow visualization studies indicate that several flow configurations may exist in multi-port microchannel tubes at the same time while constant mass flux and quality flow conditions are maintained. Flow mapping of the fluid regimes is accomplished by developing functions that describe the fraction of time or the probability that the fluid exists in an observed flow configuration. Experimental analysis and flow observations suggest that pressure drop and void fraction in microchannel is dependent on the most probable flow regime at which the two-phase mixture is flowing. In general, correlations for void fraction and pressure drop predictions are based in a separated flow model and do not predict the experimental results in the range of conditions investigated. A flow regime based model is developed for pressure drop and void fraction predictions in microchannels.Air Conditioning and Refrigeration Project 10

Design and optimization of a micro heat sink for concentrating photovoltaic/thermal (CPVT) systems

This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the Makedonia Palace Hotel, Thessaloniki in Greece. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, Aristotle University of Thessaloniki, University of Thessaly, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute.An optimization methodology for a microchannel heat sink suitable for the cooling of a parabolic trough CPVT system is presented in this study. Two different microchannel configurations are considered, Fixed (FWμ) and stepwise Variable-Width (VWμ) microchannels respectively. The performance evaluation criteria comprise the thermal resistance of the heat sink and the cooling medium pressure drop through the heat sink. Initially, the effect of the geometric parameters on the heat sink thermal and hydrodynamic performance is investigated using a thermal resistance model in order to save computational time. The results of the 1-D model enable the construction of surrogate functions for the thermal resistance and the pressure drop of the heat sink, which are considered as the objective functions for the multiobjective optimization process that leads to the optimal geometric parameters. In a second step, a 3-D numerical model of fluid flow and conjugate heat transfer in the optimized FWμ heat sink is developed in order to investigate in detail the flow and thermal phenomena. The overall analysis demonstrates that microchannel heat sinks achieve very low values of thermal resistance and that the use of variable-width channels can significantly reduce the pressure drop of the cooling fluid. Furthermore, it is proven that the 1-D model is capable of providing a good estimate of the behavior of the heat sink