Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

High-performance long NoC link using delay-insensitive current-mode signaling

High-performance long-range NoC link enables efficient implementation of network-on-chip topologies which inherently require high-performance long-distance point-to-point communication such as torus and fat-tree structures. In addition, the performance of other topologies, such as mesh, can be improved by using high-performance link between few selected remote nodes.We presented novel implementation of high-performance long-range NoC link based onmultilevel current-mode signaling and delayinsensitive two-phase 1-of-4 encoding. Current-mode signaling reduces the communication latency of long wires significantlycompared to voltage-mode signaling, making it possible to achieve high throughput without pipelining and/or using repeaters. The performance of the proposed multilevel current-mode interconnect is analyzed and compared with two reference voltage mode interconnects. These two reference interconnects are designed using two-phase 1-of-4 encoded voltage-mode signaling, one with pipeline stages and the other using optimal repeater insertion. The proposed multilevel current-mode interconnect achieves higher throughput and lower latency than the two reference interconnects. Its throughput at 8mm wire length is 1.222GWord/swhich is 1.58 and 1.89 times higher than the pipelined and optimal repeater insertion interconnects, respectively. Furthermore, its power consumption is less than the optimal repeater insertion voltage-mode interconnect, at 10mm wire length its power consumption is 0.75mW while the reference repeater insertion interconnect is 1.066 mW. The effect of crosstalk is analyzed using four-bit parallel data transfer with the best-case and worst-case switching patterns and a transmission line model which has both capacitive coupling and inductive coupling.</p

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Energy-Efficient NoC for Best-Effort Communication

A Network-on-Chip (NoC) is an energy-efficient on-chip communication architecture forMulti-Processor System-on-Chip (MPSoC) architectures. In an earlier paper we proposed a energy-efficient reconfigurable circuit-switched NoC to reduce the energy consumption compared to a packetswitched NoC. In this paper we investigate a chordal slotted ring and a bus architecture that can be used to handle the best-effort traffic in the system and configure the circuitswitched network. Both architectures are compared on their latency behavior and power consumption. At the same clock frequency, the chordal ring has the major benefit of a lower latency and higher throughput. But the bus has a lower overall power consumption at the same frequency. However, if we tune the frequency of the network to meet the throughput requirements of control network, we see that the ring consumes less energy per transported bit

A Survey Addressing on High Performance On-Chip VLSI Interconnect

With the rapid increase in transmission speeds of communication systems, the demand for very high-speed lowpower VLSI circuits is on the rise. Although the performance of CMOS technologies improves notably with scaling, conventional CMOS circuits cannot simultaneously satisfy the speed and power requirements of these applications. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, power and delay optimization and also comparative analysis of various techniques for high speed design have been discussed

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era

Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15°C, average delay up to 73.1%, and energy-saving up to ~3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era

Synthesis of On-Chip Interconnection Structures:From Point-to-Point Links to Networks-on-Chip

Packet-switched networks-on-chip (NOC) have been advocated as the solution to the challenge of organizing efficient and reliable communication structures among the components of a system-on-chip (SOC). A critical issue in designing a NOC is to determine its topology given the set of point-to-point communication requirements among these components. We present a novel approach to on-chip communication synthesis that is based on the iterative combination of two efficient computational steps: (1) an application of the k-Median algorithm to coarsely determine the global communication structure (which may turned out not be a network after all), and a (2) a variation of the shortest-path algorithm in order to finely tune the data flows on the communication channels. The application of our method to case studies taken from the literature shows that we can automatically synthesize optimal NOC topologies for multi-core on-chip processors and it offers new insights on why NOC are not necessarily a value proposition for some classes of applcation-specific SOCs