14 research outputs found

    Resource management and application customization for hardware accelerated systems

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    Computational demands are continuously increasing, driven by the growing resource demands of applications. At the era of big-data, big-scale applications, and real-time applications, there is an enormous need for quick processing of big amounts of data. To meet these demands, computer systems have shifted towards multi-core solutions. Technology scaling has allowed the incorporation of even larger numbers of transistors and cores into chips. Nevertheless, area constrains, power consumption limitations, and thermal dissipation limit the ability to design and sustain ever increasing chips. To overpassthese limitations, system designers have turned towards the usage of hardware accelerators. These accelerators can take the form of modules attached to each core of a multi-core system, forming a network on chip of cores with attached accelerators. Another option of hardware accelerators are Graphics Processing Units (GPUs). GPUs can be connected through a host-device model with a general purpose system, and are used to off-load parts of a workload to them. Additionally, accelerators can be functionality dedicated units. They can be part of a chip and the main processor can offload specific workloads to the hardware accelerator unit.In this dissertation we present: (a) a microcoded synchronization mechanism for systems with hardware accelerators that provide distributed shared memory, (b) a Streaming Multiprocessor (SM) allocation policy for single application execution on GPUs, (c) an SM allocation policy for concurrent applications that execute on GPUs, and (d) a framework to map neural network (NN) weights to approximate multiplier accuracy levels. Theaforementioned mechanisms coexist in the resource management domain. Specifically, the methodologies introduce ways to boost system performance by using hardware accelerators. In tandem with improved performance, the methodologies explore and balance trade-offs that the use of hardware accelerators introduce

    Dependable Embedded Systems

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    This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

    Feature Papers in Electronic Materials Section

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    This book entitled "Feature Papers in Electronic Materials Section" is a collection of selected papers recently published on the journal Materials, focusing on the latest advances in electronic materials and devices in different fields (e.g., power- and high-frequency electronics, optoelectronic devices, detectors, etc.). In the first part of the book, many articles are dedicated to wide band gap semiconductors (e.g., SiC, GaN, Ga2O3, diamond), focusing on the current relevant materials and devices technology issues. The second part of the book is a miscellaneous of other electronics materials for various applications, including two-dimensional materials for optoelectronic and high-frequency devices. Finally, some recent advances in materials and flexible sensors for bioelectronics and medical applications are presented at the end of the book

    Reliable Design of Three-Dimensional Integrated Circuits

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