15,552 research outputs found
A survey of carbon nanotube interconnects for energy efficient integrated circuits
This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design
Limits on Fundamental Limits to Computation
An indispensable part of our lives, computing has also become essential to
industries and governments. Steady improvements in computer hardware have been
supported by periodic doubling of transistor densities in integrated circuits
over the last fifty years. Such Moore scaling now requires increasingly heroic
efforts, stimulating research in alternative hardware and stirring controversy.
To help evaluate emerging technologies and enrich our understanding of
integrated-circuit scaling, we review fundamental limits to computation: in
manufacturing, energy, physical space, design and verification effort, and
algorithms. To outline what is achievable in principle and in practice, we
recall how some limits were circumvented, compare loose and tight limits. We
also point out that engineering difficulties encountered by emerging
technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl
Channel Characterization for Chip-scale Wireless Communications within Computing Packages
Wireless Network-on-Chip (WNoC) appears as a promising alternative to
conventional interconnect fabrics for chip-scale communications. WNoC takes
advantage of an overlaid network composed by a set of millimeter-wave antennas
to reduce latency and increase throughput in the communication between cores.
Similarly, wireless inter-chip communication has been also proposed to improve
the information transfer between processors, memory, and accelerators in
multi-chip settings. However, the wireless channel remains largely unknown in
both scenarios, especially in the presence of realistic chip packages. This
work addresses the issue by accurately modeling flip-chip packages and
investigating the propagation both its interior and its surroundings. Through
parametric studies, package configurations that minimize path loss are obtained
and the trade-offs observed when applying such optimizations are discussed.
Single-chip and multi-chip architectures are compared in terms of the path loss
exponent, confirming that the amount of bulk silicon found in the pathway
between transmitter and receiver is the main determinant of losses.Comment: To be presented 12th IEEE/ACM International Symposium on
Networks-on-Chip (NOCS 2018); Torino, Italy; October 201
Tensor Computation: A New Framework for High-Dimensional Problems in EDA
Many critical EDA problems suffer from the curse of dimensionality, i.e. the
very fast-scaling computational burden produced by large number of parameters
and/or unknown variables. This phenomenon may be caused by multiple spatial or
temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit
simulation), nonlinearity of devices and circuits, large number of design or
optimization parameters (e.g. full-chip routing/placement and circuit sizing),
or extensive process variations (e.g. variability/reliability analysis and
design for manufacturability). The computational challenges generated by such
high dimensional problems are generally hard to handle efficiently with
traditional EDA core algorithms that are based on matrix and vector
computation. This paper presents "tensor computation" as an alternative general
framework for the development of efficient EDA algorithms and tools. A tensor
is a high-dimensional generalization of a matrix and a vector, and is a natural
choice for both storing and solving efficiently high-dimensional EDA problems.
This paper gives a basic tutorial on tensors, demonstrates some recent examples
of EDA applications (e.g., nonlinear circuit modeling and high-dimensional
uncertainty quantification), and suggests further open EDA problems where the
use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and
System
SLIP: 10 years ago and 10 years from now
Founded in 1999, the ACM SLIP Workshop is now in its 12th year. The 2010 SLIP Panel session will highlight perspectives from three individuals who have had great influence on the course of SLIP, and provide an opportunity for lively discussion by workshop attendees of prospects for the next 10 years of SLIP. This panel summary records preliminary thoughts of the panelists on two starting questions
Interconnect fatigue design for terrestrial photovoltaic modules
The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field
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