278,780 research outputs found

    Monolithic optical integrated control circuitry for GaAs MMIC-based phased arrays

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    Gallium arsenide (GaAs) monolithic microwave integrated circuits (MMIC's) show promise in phased-array antenna applications for future space communications systems. Their efficient usage will depend on the control of amplitude and phase signals for each MMIC element in the phased array and in the low-loss radiofrequency feed. For a phased array contining several MMIC elements a complex system is required to control and feed each element. The characteristics of GaAs MMIC's for 20/30-GHz phased-array systems are discussed. The optical/MMIC interface and the desired characteristics of optical integrated circuits (OIC's) for such an interface are described. Anticipated fabrication considerations for eventual full monolithic integration of optical integrated circuits with MMIC's on a GaAs substrate are presented

    Universal Three Dimensional Optical Logic

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    Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of electronic computing systems. Even as electronics approach fundamental limits however, stubborn challenges in 3D circuits, and innovations in planar technology have delayed the dimensional transition. Optical computing offers potential for new computing approaches, substantially greater performance and would complement technologies in optical interconnects and data storage. Nevertheless, despite some progress, few proposed optical transistors possess essential features required for integration into real computing systems. Here we demonstrate a logic gate based on universal features of nonlinear wave propagation: spatiotemporal instability and collapse. It meets the scaling criteria and enables a 3D, reconfigurable, globally-hyperconnected architecture that may achieve an exponential speed up over conventional platforms. It provides an attractive building block for future optical computers, where its universality should facilitate flexible implementations.Comment: manuscript (5 pages, 3 figures) with supplementary information (6 pages, 5 figures

    Hybrid integration methods for on-chip quantum photonics

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    The goal of integrated quantum photonics is to combine components for the generation, manipulation, and detection of nonclassical light in a phase-stable and efficient platform. Solid-state quantum emitters have recently reached outstanding performance as single-photon sources. In parallel, photonic integrated circuits have been advanced to the point that thousands of components can be controlled on a chip with high efficiency and phase stability. Consequently, researchers are now beginning to combine these leading quantum emitters and photonic integrated circuit platforms to realize the best properties of each technology. In this paper, we review recent advances in integrated quantum photonics based on such hybrid systems. Although hybrid integration solves many limitations of individual platforms, it also introduces new challenges that arise from interfacing different materials. We review various issues in solid-state quantum emitters and photonic integrated circuits, the hybrid integration techniques that bridge these two systems, and methods for chip-based manipulation of photons and emitters. Finally, we discuss the remaining challenges and future prospects of on-chip quantum photonics with integrated quantum emitters. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreemen

    Method of improving contact bonds in silicon integrated circuits

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    Fabrication method produces stable and reliable metallic systems for interconnections, contact pads, and bonded leads in silicon planar integrated circuits. The method is based on substrate isolation of the interconnection metal from the contact pad and bonded wire

    Non-invasive monitoring and control in silicon photonics by CMOS integrated electronics

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    As photonics breaks away from today's device level toward large scale of integration and complex systems-on-a-chip, concepts like monitoring, control and stabilization of photonic integrated circuits emerge as new paradigms. Here, we show non-invasive monitoring and feedback control of high quality factor silicon photonics resonators assisted by a transparent light detector directly integrated inside the cavity. Control operations are entirely managed by a CMOS microelectronic circuit, hosting many parallel electronic read-out channels, that is bridged to the silicon photonics chip. Advanced functionalities, such as wavelength tuning, locking, labeling and swapping are demonstrated. The non-invasive nature of the transparent monitor and the scalability of the CMOS read-out system offer a viable solution for the control of arbitrarily reconfigurable photonic integrated circuits aggregating many components on a single chip

    Overview of carbon-based circuits and systems

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    This paper presents an overview of the state of the art on carbon-based circuits and systems made up of carbon nanotubes and graphene transistors. A tutorial description of the most important devices and their potential benefits and limitations is given, trying to identify their suitability to implement analog and digital circuits and systems. Main electrical models reported so far for the design of carbon-based field-effect devices are surveyed, and the main sizing parameters required to implement such devices in practical integrated circuits are analyzed. The solutions proposed by cutting-edge integrated circuits and devices are discussed, identifying current trends, challenges and opportunities for the circuits and systems community1

    High-Speed and Energy-Efficient Ring-Oscillator for Analog-to-Digital Conversion

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    The aim of this conference is to offer the possibility to present and discuss new research results on the area of integrated circuits and systems and all its fields of application. A major emphasis has been given in the technical program to emerging topics such as electronic systems for artificial intelligence, reliability of circuits and devices, unconventional computing, smart sensors and other relevant topics. The conference on Design of Circuits and Integrated Systems (DCIS) is an international meeting for researchers in the highly active fields of micro- and nano-electronic circuits and integrated systems. It provides an excellent forum to present and discuss works on the emerging challenges offered by technology, in the areas of modeling, design, implementation and test of devices, circuits and systems. The 35th edition will be organized by Universidad Politécnica de Madrid
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