Improved insertion-loss tester

An improved test method accurately measures the insertion loss of RF components while avoiding amplifier drift. Currents are balanced across a bridge transformer with shorted probes and then with each component to be tested. Differences in adjustments indicate the loss

Insertion loss reduction between single-mode fibers and diffused channel waveguides

Methods of reducing the insertion loss between single-mode fibers and graded-index channel waveguides, and backdiffusion, are analyzed theoretically and compared. Mode mismatch and namely, annealing misalignment losses are calculated to determine the best method and the optimal conditions for their use. The main result of this paper is that, in the single-mode regime, there is no apparent advantage in using backdiffusion instead of the simpler annealing process, in contrast with the multimode case. In the coupling a numerical simulation of waveguide formation by potassium–sodium ion exchange in glass is loss calculation, used for illustration

A radiometric method for measuring the insertion loss of radome materials

Radiometer system measures effective noise temperature directed towards sky, with and without radome over antenna horn. Data is then translated into computer format. With additional transmission line insertion loss data from other measurements, computer calculates insertion loss of radome material

Direct measurement of the on-chip insertion loss of high finesse microring resonators in Si3N4-SiO2 technology.

Microring resonators show the possibility for designing Very Large Scale Integrated (VLSI) photonic circuits by cascading them. In order to realize the devices, the on-chip insertion loss becomes an important parameter. The direct measurement of the on-chip insertion loss of a high finesse microring resonator will be presented. Its value (0.1 ± 0.1) dB is low, in agreement with calculations

Insertion loss measuring apparatus having transformer means connected across a pair of bolometers Patent

High impedance alternating current sensing transformer device between two bolometers for measuring insertion loss of test componen

Segmented waveguides in thin silicon-on-insulator

We have developed new silicon-on-insulator waveguide designs for simultaneously achieving both low-loss optical confinement and electrical contacts, and we present a design methodology based on calculating the Bloch modes of such segmented waveguides. With this formalism, waveguides are designed in a single thin layer of silicon-on-insulator to achieve both optical confinement and minimal insertion loss. Waveguides were also fabricated and tested, and the measured data were found to closely agree with theoretical predictions, demonstrating input insertion loss and propagation loss better than 0.1 dB and -16 dB/cm, respectively

Germanium-on-silicon planar concave grating wavelength (de)multiplexers in the mid-infrared

Mid-infrared wavelength (de)multiplexers based on planar concave gratings (PCGs) fabricated on a germanium-on-silicon waveguide platform are presented. PCGs with two different types of gratings (flat facet and distributed bragg reflectors) are analyzed for both transverse electric (TE) and transverse magnetic (TM) polarizations. The insertion loss and cross talk for flat facet PCGs are found to be -7.6/-6.4¿dB and 27/21¿dB for TE/TM polarization. For distributed bragg reflector PCGs the insertion loss and cross talk are found to be -4.9/-4.2¿dB and 22/23¿dB for TE/TM polarization

Insertion loss and misalignment tolerance in multimode tapered waveguide bends

Experimental measurements of laterally tapered multimode waveguide bends fabricated photolithographically on FR4 printed circuit board establish that the product of the mean insertion loss (in linear units) and the mean source misalignment tolerance is a constant which depends only on the taper ratio TR (input width/output width) and not on the radius of curvature R. The minimum loss of 0.78 dB occurs in the special case of TR = 0.8, R = 14 mm. Together, these form waveguide layout design rules for board-to-board and chip-to-chip optical interconnects