Transition Faults and Transition Path Delay Faults: Test Generation, Path Selection, and Built-In Generation of Functional Broadside Tests

As the clock frequency and complexity of digital integrated circuits increase rapidly, delay testing is indispensable to guarantee the correct timing behavior of the circuits. In this dissertation, we describe methods developed for three aspects of delay testing in scan-based circuits: test generation, path selection and built-in test generation. We first describe a deterministic broadside test generation procedure for a path delay fault model named the transition path delay fault model, which captures both large and small delay defects. Under this fault model, a path delay fault is detected only if all the individual transition faults along the path are detected by the same test. To reduce the complexity of test generation, sub-procedures with low complexity are applied before a complete branch-and-bound procedure. Next, we describe a method based on static timing analysis to select critical paths for test generation. Logic conditions that are necessary for detecting a path delay fault are considered to refine the accuracy of static timing analysis, using input necessary assignments. Input necessary assignments are input values that must be assigned to detect a fault. The method calculates more accurate path delays, selects paths that are critical during test application, and identifies undetectable path delay faults. These two methods are applicable to off-line test generation. For large circuits with high complexity and frequency, built-in test generation is a cost-effective method for delay testing. For a circuit that is embedded in a larger design, we developed a method for built-in generation of functional broadside tests to avoid excessive power dissipation during test application and the overtesting of delay faults, taking the functional constraints on the primary input sequences of the circuit into consideration. Functional broadside tests are scan-based two-pattern tests for delay faults that create functional operation conditions during test application. To avoid the potential fault coverage loss due to the exclusive use of functional broadside tests, we also developed an optional DFT method based on state holding to improve fault coverage. High delay fault coverage can be achieved by the developed method for benchmark circuits using simple hardware

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Efficient Path Delay Test Generation with Boolean Satisfiability

This dissertation focuses on improving the accuracy and efficiency of path delay test generation using a Boolean satisfiability (SAT) solver. As part of this research, one of the most commonly used SAT solvers, MiniSat, was integrated into the path delay test generator CodGen. A mixed structural-functional approach was implemented in CodGen where longest paths were detected using the K Longest Path Per Gate (KLPG) algorithm and path justification and dynamic compaction were handled with the SAT solver. Advanced techniques were implemented in CodGen to further speed up the performance of SAT based path delay test generation using the knowledge of the circuit structure. SAT solvers are inherently circuit structure unaware, and significant speedup can be availed if structure information of the circuit is provided to the SAT solver. The advanced techniques explored include: Dynamic SAT Solving (DSS), Circuit Observability Don’t Care (Cir-ODC), SAT based static learning, dynamic learnt clause management and Approximate Observability Don’t Care (ACODC). Both ISCAS 89 and ITC 99 benchmarks as well as industrial circuits were used to demonstrate that the performance of CodGen was significantly improved with MiniSat and the use of circuit structure

Analysis of Hardware Descriptions

The design process for integrated circuits requires a lot of analysis of circuit descriptions. An important class of analyses determines how easy it will be to determine if a physical component suffers from any manufacturing errors. As circuit complexities grow rapidly, the problem of testing circuits also becomes increasingly difficult. This thesis explores the potential for analysing a recent high level hardware description language called Ruby. In particular, we are interested in performing testability analyses of Ruby circuit descriptions. Ruby is ammenable to algebraic manipulation, so we have sought transformations that improve testability while preserving behaviour. The analysis of Ruby descriptions is performed by adapting a technique called abstract interpretation. This has been used successfully to analyse functional programs. This technique is most applicable where the analysis to be captured operates over structures isomorphic to the structure of the circuit. Many digital systems analysis tools require the circuit description to be given in some special form. This can lead to inconsistency between representations, and involves additional work converting between representations. We propose using the original description medium, in this case Ruby, for performing analyses. A related technique, called non-standard interpretation, is shown to be very useful for capturing many circuit analyses. An implementation of a system that performs non-standard interpretation forms the central part of the work. This allows Ruby descriptions to be analysed using alternative interpretations such test pattern generation and circuit layout interpretations. This system follows a similar approach to Boute's system semantics work and O'Donnell's work on Hydra. However, we have allowed a larger class of interpretations to be captured and offer a richer description language. The implementation presented here is constructed to allow a large degree of code sharing between different analyses. Several analyses have been implemented including simulation, test pattern generation and circuit layout. Non-standard interpretation provides a good framework for implementing these analyses. A general model for making non-standard interpretations is presented. Combining forms that combine two interpretations to produce a new interpretation are also introduced. This allows complex circuit analyses to be decomposed in a modular manner into smaller circuit analyses which can be built independently

Built-In Self-Test (BIST) for Multi-Threshold NULL Convention Logic (MTNCL) Circuits

This dissertation proposes a Built-In Self-Test (BIST) hardware implementation for Multi-Threshold NULL Convention Logic (MTNCL) circuits. Two different methods are proposed: an area-optimized topology that requires minimal area overhead, and a test-performance-optimized topology that utilizes parallelism and internal hardware to reduce the overall test time through additional controllability points. Furthermore, an automated software flow is proposed to insert, simulate, and analyze an input MTNCL netlist to obtain a desired fault coverage, if possible, through iterative digital and fault simulations. The proposed automated flow is capable of producing both area-optimized and test-performance-optimized BIST circuits and scripts for digital and fault simulation using commercial software that may be utilized to manually verify or adjust further, if desired

High Quality Compact Delay Test Generation

Delay testing is used to detect timing defects and ensure that a circuit meets its timing specifications. The growing need for delay testing is a result of the advances in deep submicron (DSM) semiconductor technology and the increase in clock frequency. Small delay defects that previously were benign now produce delay faults, due to reduced timing margins. This research focuses on the development of new test methods for small delay defects, within the limits of affordable test generation cost and pattern count. First, a new dynamic compaction algorithm has been proposed to generate compacted test sets for K longest paths per gate (KLPG) in combinational circuits or scan-based sequential circuits. This algorithm uses a greedy approach to compact paths with non-conflicting necessary assignments together during test generation. Second, to make this dynamic compaction approach practical for industrial use, a recursive learning algorithm has been implemented to identify more necessary assignments for each path, so that the path-to-test-pattern matching using necessary assignments is more accurate. Third, a realistic low cost fault coverage metric targeting both global and local delay faults has been developed. The metric suggests the test strategy of generating a different number of longest paths for each line in the circuit while maintaining high fault coverage. The number of paths and type of test depends on the timing slack of the paths under this metric. Experimental results for ISCAS89 benchmark circuits and three industry circuits show that the pattern count of KLPG can be significantly reduced using the proposed methods. The pattern count is comparable to that of transition fault test, while achieving higher test quality. Finally, the proposed ATPG methodology has been applied to an industrial quad-core microprocessor. FMAX testing has been done on many devices and silicon data has shown the benefit of KLPG test

Optimization of Pseudo Functional Path Delay Test Through Embedded Memories

Traditional automatic test pattern generation achieves high coverage of logic faults in integrated circuits. Automatic test of embedded memory arrays uses built-in self-test. Testing the memories and logic separately does not fully test the critical timing paths that go into or out of memories. Prior research has developed algorithms and software to test the longest paths into and out of embedded memories. However, in this prior work, the test generation time increased superlinearly with memory size. This is contrary to the intuition that the time should rise approximately linearly with memory size. This behavior limits the algorithm to circuits with relatively small memories. The focus of this research is to analyze the time complexity of the algorithm and propose changes to reduce the time required to test circuits with large memories. We use our prior work on pseudo functional K longest path per gate test generation, and the benchmark circuits with embedded memories developed in the prior work. Since the cells within a memory array are not scan cells, a value that is captured in a memory cell must be moved to a scan cell using low-speed coda cycles. This approach will also support the test of any non-scan flip-flop or latch, in addition to embedded memory arrays. In addition to testing the critical timing paths, testing through memories eliminates the logic “shadows” around the memory where faults cannot be tested. In this research our complexity analysis has identified the reason for the superlinear increase in test generation time with larger memories and verified this analysis with experimental results. We have also developed and implemented several heuristics to increase performance, with experimental results. This research also identifies the major algorithm changes required to further increase performance

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important