119 research outputs found

    تصميم نظام متسامح العطل في حساسات الصورة (حساسات البكسل الفعالة (APS))

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    In this research, we are dealing with Digital video systems and digital Cameras that have a very important improvement during last years, like using the new CMOS (complementary metal-oxide semiconductor) Image Sensor instead of traditional Image Sensor CCD (Charge Coupled Devices). Even though the progress in CMOS technology offers the means to fabricate them, smaller pixels in advanced technologies must overcome some electrical and optical problems, and this is what we presente by designed a fault tolerance Active Pixel Sensor using hardware redundancy called TMR (Triple Modular Redundancy). We designed a CMOS Image Sensor with our TMR that contains analog comparator, the next step was making a modification in the structure of the classic TMR to decrease the cost of fabricate on the chip, then we analyze the Reliability of entire system and compare the results with the reliability of single Image Sensor تصميم نظام متسامح العطل في حساسات الصورة (حساسات البكسل الفعالة (APS)) يهتم البحث بأنظمة الفيديو (Video Systems) والكاميرات الرقمية والاتجاه نحو حساسات الصورة (Image Sensor) من صنف CMOS (complementary metal-oxide semiconductor) كبديل عن الحساسات من صنف CCD Charge Coupled Devices)) نظراً للميزات التي تتمتع بها من حيث إمكانية التصنيع على نفس الشريحة مع الدارات المرافقة للحساس بالإضافة إلى صغر الحجم والاستهلاك المنخفض للطاقة. تساعد المميزات المذكورة تقنية CMOS على تقديم عنصر صورة (Pixel) صغير الحجم وذو تقنية متطورة, إلا أنها يجب أن تتغلب على بعض العيوب الإلكترونية والضوئية, وهذا ما نقدمه من خلال تصميم حساس عنصر صورة نشط (Active Pixel Sensor) بتطبيق تقنية الفائضية ثلاثية النماذج (Triple Modular Redundancy), وذلك من خلال تصميم حساس الصورة ومن ثم إدخال التقنية المذكورة, بعد ذلك تعديل التصميم لتقليل عدد الترانزستورات على شريحة الحساس تم أيضاً تحليل الوثوقية (Reliability) للنظام المقترح ومقارنته مع وثوقية الحساس منفرداً لتحديد مستوى التحسين الحاصل في الوثوقية والتي تعد مع تسامحية العطل مؤشراً هاماً على تحسين الاعتمادية (Dependability) للنظام عامة

    MOCAST 2021

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    The 10th International Conference on Modern Circuit and System Technologies on Electronics and Communications (MOCAST 2021) will take place in Thessaloniki, Greece, from July 5th to July 7th, 2021. The MOCAST technical program includes all aspects of circuit and system technologies, from modeling to design, verification, implementation, and application. This Special Issue presents extended versions of top-ranking papers in the conference. The topics of MOCAST include:Analog/RF and mixed signal circuits;Digital circuits and systems design;Nonlinear circuits and systems;Device and circuit modeling;High-performance embedded systems;Systems and applications;Sensors and systems;Machine learning and AI applications;Communication; Network systems;Power management;Imagers, MEMS, medical, and displays;Radiation front ends (nuclear and space application);Education in circuits, systems, and communications

    NASA Tech Briefs, July 2007

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    Topics covered include: Miniature Intelligent Sensor Module; "Smart" Sensor Module; Portable Apparatus for Electrochemical Sensing of Ethylene; Increasing Linear Dynamic Range of a CMOS Image Sensor; Flight Qualified Micro Sun Sensor; Norbornene-Based Polymer Electrolytes for Lithium Cells; Making Single-Source Precursors of Ternary Semiconductors; Water-Free Proton-Conducting Membranes for Fuel Cells; Mo/Ti Diffusion Bonding for Making Thermoelectric Devices; Photodetectors on Coronagraph Mask for Pointing Control; High-Energy-Density, Low-Temperature Li/CFx Primary Cells; G4-FETs as Universal and Programmable Logic Gates; Fabrication of Buried Nanochannels From Nanowire Patterns; Diamond Smoothing Tools; Infrared Imaging System for Studying Brain Function; Rarefying Spectra of Whispering-Gallery-Mode Resonators; Large-Area Permanent-Magnet ECR Plasma Source; Slot-Antenna/Permanent-Magnet Device for Generating Plasma; Fiber-Optic Strain Gauge With High Resolution And Update Rate; Broadband Achromatic Telecentric Lens; Temperature-Corrected Model of Turbulence in Hot Jet Flows; Enhanced Elliptic Grid Generation; Automated Knowledge Discovery From Simulators; Electro-Optical Modulator Bias Control Using Bipolar Pulses; Generative Representations for Automated Design of Robots; Mars-Approach Navigation Using In Situ Orbiters; Efficient Optimization of Low-Thrust Spacecraft Trajectories; Cylindrical Asymmetrical Capacitors for Use in Outer Space; Protecting Against Faults in JPL Spacecraft; Algorithm Optimally Allocates Actuation of a Spacecraft; and Radar Interferometer for Topographic Mapping of Glaciers and Ice Sheets

    Center for Space Microelectronics Technology 1988-1989 technical report

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    The 1988 to 1989 Technical Report of the JPL Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center. Listed are 321 publications, 282 presentations, and 140 new technology reports and patents

    NASA Capability Roadmaps Executive Summary

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    This document is the result of eight months of hard work and dedication from NASA, industry, other government agencies, and academic experts from across the nation. It provides a summary of the capabilities necessary to execute the Vision for Space Exploration and the key architecture decisions that drive the direction for those capabilities. This report is being provided to the Exploration Systems Architecture Study (ESAS) team for consideration in development of an architecture approach and investment strategy to support NASA future mission, programs and budget requests. In addition, it will be an excellent reference for NASA's strategic planning. A more detailed set of roadmaps at the technology and sub-capability levels are available on CD. These detailed products include key driving assumptions, capability maturation assessments, and technology and capability development roadmaps

    Technology 2004, Vol. 2

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    Proceedings from symposia of the Technology 2004 Conference, November 8-10, 1994, Washington, DC. Volume 2 features papers on computers and software, virtual reality simulation, environmental technology, video and imaging, medical technology and life sciences, robotics and artificial intelligence, and electronics

    Exploring information retrieval using image sparse representations:from circuit designs and acquisition processes to specific reconstruction algorithms

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    New advances in the field of image sensors (especially in CMOS technology) tend to question the conventional methods used to acquire the image. Compressive Sensing (CS) plays a major role in this, especially to unclog the Analog to Digital Converters which are generally representing the bottleneck of this type of sensors. In addition, CS eliminates traditional compression processing stages that are performed by embedded digital signal processors dedicated to this purpose. The interest is twofold because it allows both to consistently reduce the amount of data to be converted but also to suppress digital processing performed out of the sensor chip. For the moment, regarding the use of CS in image sensors, the main route of exploration as well as the intended applications aims at reducing power consumption related to these components (i.e. ADC & DSP represent 99% of the total power consumption). More broadly, the paradigm of CS allows to question or at least to extend the Nyquist-Shannon sampling theory. This thesis shows developments in the field of image sensors demonstrating that is possible to consider alternative applications linked to CS. Indeed, advances are presented in the fields of hyperspectral imaging, super-resolution, high dynamic range, high speed and non-uniform sampling. In particular, three research axes have been deepened, aiming to design proper architectures and acquisition processes with their associated reconstruction techniques taking advantage of image sparse representations. How the on-chip implementation of Compressed Sensing can relax sensor constraints, improving the acquisition characteristics (speed, dynamic range, power consumption) ? How CS can be combined with simple analysis to provide useful image features for high level applications (adding semantic information) and improve the reconstructed image quality at a certain compression ratio ? Finally, how CS can improve physical limitations (i.e. spectral sensitivity and pixel pitch) of imaging systems without a major impact neither on the sensing strategy nor on the optical elements involved ? A CMOS image sensor has been developed and manufactured during this Ph.D. to validate concepts such as the High Dynamic Range - CS. A new design approach was employed resulting in innovative solutions for pixels addressing and conversion to perform specific acquisition in a compressed mode. On the other hand, the principle of adaptive CS combined with the non-uniform sampling has been developed. Possible implementations of this type of acquisition are proposed. Finally, preliminary works are exhibited on the use of Liquid Crystal Devices to allow hyperspectral imaging combined with spatial super-resolution. The conclusion of this study can be summarized as follows: CS must now be considered as a toolbox for defining more easily compromises between the different characteristics of the sensors: integration time, converters speed, dynamic range, resolution and digital processing resources. However, if CS relaxes some material constraints at the sensor level, it is possible that the collected data are difficult to interpret and process at the decoder side, involving massive computational resources compared to so-called conventional techniques. The application field is wide, implying that for a targeted application, an accurate characterization of the constraints concerning both the sensor (encoder), but also the decoder need to be defined

    Design of robust ultra-low power platform for in-silicon machine learning

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    The rapid development of machine learning plays a key role in enabling next generation computing systems with enhanced intelligence. Present day machine learning systems adopt an "intelligence in the cloud" paradigm, resulting in heavy energy cost despite state-of-the-art performance. It is therefore of great interest to design embedded ultra-low power (ULP) platforms with in-silicon machine learning capability. A self-contained ULP platform consists of the energy delivery, sensing and information processing subsystems. This dissertation proposes techniques to design and optimize the ULP platform for in-silicon machine learning by exploring a trade-off that exists between energy-efficiency and robustness. This trade-off arises when the information processing functionality is integrated into the energy delivery, sensing, or emerging stochastic fabrics (e.g., CMOS operating in near-threshold voltage or voltage overscaling, and beyond CMOS devices). This dissertation presents the Compute VRM (C-VRM) to embed the information processing into the energy delivery subsystem. The C-VRM employs multiple voltage domain stacking and core swapping to achieve high total system energy efficiency in near/sub-threshold region. A prototype IC of the C-VRM is implemented in a 1.2 V, 130 nm CMOS process. Measured results indicate that the C-VRM has up to 44.8% savings in system-level energy per operation compared to the conventional system, and an efficiency ranging from 79% to 83% over an output voltage range of 0.52 V to 0.6 V. This dissertation further proposes the Compute Sensor approach to embed information processing into the sensing subsystem. The Compute Sensor eliminates both the traditional sensor-processor interface, and the high-SNR/high-energy digital processing by moving feature extraction and classification functions into the analog domain. Simulation results in 65 nm CMOS show that the proposed Compute Sensor can achieve a detection accuracy greater than 94.7% using the Caltech101 dataset, which is within 0.5% of that achieved by an ideal digital implementation. The performance is achieved with 7x to 17x lower energy than the conventional architecture for the same level of accuracy. To further explore the energy-efficiency vs. robustness trade-off, this dissertation explores the use of highly energy efficient but unreliable stochastic fabrics to implement in-silicon machine learning kernels. In order to perform reliable computation on the stochastic fabrics, this dissertation proposes to employ statistical error compensation (SEC) as an effective error compensation technique. This dissertation makes a contribution to the portfolio of SEC by proposing embedded algorithmic noise tolerance (E-ANT) for low overhead error compensation. E-ANT operates by reusing part of the main block as estimator and thus embedding the estimator into the main block. System level simulation results in a commercial 45 nm CMOS process show that E-ANT achieves up to 38% error tolerance and up to 51% energy savings compared with an uncompensated system. This dissertation makes a contribution to the theoretical understanding of stochastic fabrics by proposing a class of probabilistic error models that can accurately model the hardware errors on the stochastic fabrics. The models are validated in a commercial 45 nm CMOS process and employed to evaluate the performance of machine learning kernels in the presence of hardware errors. Performance prediction of a support vector machine (SVM) based classifier using these models indicates that the probability of detection P_{det} estimated using the proposed model is within 3% for timing errors due to voltage overscaling when the error rate p_η ≤ 80%, within 5% for timing errors due to process variation in near threshold-voltage (NTV) region (0.3 V-0.7 V) and within 2% for defect errors when the defect rate p_{saf} is between 10^{-3} and 20%, compared with HDL simulation results. Employing the proposed error model and evaluation methodology, this dissertation explores the use of distributed machine learning architectures, named classifier ensemble, to enhance the robustness of in-silicon machine learning kernels. Comparative study of distributed architectures (i.e., random forest (RF)) and centralized architectures (i.e., SVM) is performed in a commercial 45 nm CMOS process. Employing the UCI machine learning repository as input, it is determined that RF-based architectures are significantly more robust than SVM architectures in presence of timing errors in the NTV region (0.3 V- 0.7 V). Additionally, an error weighted voting technique that incorporates the timing error statistics of the NTV circuit fabric is proposed to further enhance the robustness of RF architectures. Simulation results confirm that the error weighted voting technique achieves a P_{det} that varies by only 1.4%, which is 12x lower compared to centralized architectures
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