Fast 3D Integrated Circuit Placement Methodology using Merging Technique

In the recent years the advancement in the field of microelectronics integrated circuit (IC) design technologies proved to be a boon for design and development of various advanced systems in-terms of its reduction in form factor, low power, high speed and with increased capacity to incorporate more designs. These systems provide phenomenal advantage for armoured fighting vehicle (AFV) design to develop miniaturised low power, high performance sub-systems. One such emerging high-end technology to be used to develop systems with high capabilities for AFVs is discussed in this paper. Three dimensional IC design is one of the emerging field used to develop high density heterogeneous systems in a reduced form factor. A novel grouping based partitioning and merge based placement (GPMP) methodology for 3D ICs to reduce through silicon vias (TSVs) count and placement time is proposed. Unlike state-of-the-art techniques, the proposed methodology does not suffer from initial overlap of cells during intra-layer placement which reduces the placement time. Connectivity based grouping and partitioning ensures less number of TSVs and merge based placement further reduces intra layer wire-length. The proposed GPMP methodology has been extensively against the IBMPLACE database and performance has been compared with the latest techniques resulting in 12 per cent improvement in wire-length, 13 per cent reduction in TSV and 1.1x improvement in placement time

Enhancing a Layout-Aware Synthesis Methodology for Analog ICs by Embedding Statistical Knowledge into the Evolutionary Optimization Kernel

Part 18: Electronics: Devices DesignInternational audienceThis paper applies to the scientific area of electronic design automation (EDA) and addresses the automatic sizing of analog integrated circuits (ICs). Particularly, this work presents an innovative approach to enhance a state-of-the-art layout-aware circuit-level optimizer (GENOM-POF), by embedding statistical knowledge from an automatically generated gradient model into the multi-objective multi-constraint optimization kernel based on the NSGA-II algorithm. The approach was validated with typical analog circuit structures, using the UMC 0.13 μm integration technology, showing that, by enhancing the circuit sizing optimization kernel with the gradient model, the optimal solutions are achieved, considerably, faster and with identical or superior accuracy. Finally, the results are Pareto Optimal Fronts (POFs), which consist of a set of fully compliant sizing solutions, allowing the designer to explore the different trade-offs of the solution space, both through the achieved device sizes, or the respective layout solutions

Damage identification in structural health monitoring: a brief review from its implementation to the Use of data-driven applications

The damage identification process provides relevant information about the current state of a structure under inspection, and it can be approached from two different points of view. The first approach uses data-driven algorithms, which are usually associated with the collection of data using sensors. Data are subsequently processed and analyzed. The second approach uses models to analyze information about the structure. In the latter case, the overall performance of the approach is associated with the accuracy of the model and the information that is used to define it. Although both approaches are widely used, data-driven algorithms are preferred in most cases because they afford the ability to analyze data acquired from sensors and to provide a real-time solution for decision making; however, these approaches involve high-performance processors due to the high computational cost. As a contribution to the researchers working with data-driven algorithms and applications, this work presents a brief review of data-driven algorithms for damage identification in structural health-monitoring applications. This review covers damage detection, localization, classification, extension, and prognosis, as well as the development of smart structures. The literature is systematically reviewed according to the natural steps of a structural health-monitoring system. This review also includes information on the types of sensors used as well as on the development of data-driven algorithms for damage identification.Peer ReviewedPostprint (published version

RISC-Vlim, a RISC-V Framework for Logic-in-Memory Architectures

Most modern CPU architectures are based on the von Neumann principle, where memory and processing units are separate entities. Although processing unit performance has improved over the years, memory capacity has not followed the same trend, creating a performance gap between them. This problem is known as the "memory wall" and severely limits the performance of a microprocessor. One of the most promising solutions is the "logic-in-memory" approach. It consists of merging memory and logic units, enabling data to be processed directly inside the memory itself. Here we propose an RISC-V framework that supports logic-in-memory operations. We substitute data memory with a circuit capable of storing data and of performing in-memory computation. The framework is based on a standard memory interface, so different logic-in-memory architectures can be inserted inside the microprocessor, based both on CMOS and emerging technologies. The main advantage of this framework is the possibility of comparing the performance of different logic-in-memory solutions on code execution. We demonstrate the effectiveness of the framework using a CMOS volatile memory and a memory based on a new emerging technology, racetrack logic. The results demonstrate an improvement in algorithm execution speed and a reduction in energy consumption

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research

Digital in-memory stochastic computing architecture for vector-matrix multiplication

The applications of the Artificial Intelligence are currently dominating the technology landscape. Meanwhile, the conventional Von Neumann architectures are struggling with the data-movement bottleneck to meet the ever-increasing performance demands of these data-centric applications. Moreover, The vector-matrix multiplication cost, in the binary domain, is a major computational bottleneck for these applications. This paper introduces a novel digital in-memory stochastic computing architecture that leverages the simplicity of the stochastic computing for in-memory vector-matrix multiplication. The proposed architecture incorporates several new approaches including a new stochastic number generator with ideal binary-to-stochastic mapping, a best seeding approach for accurate-enough low stochastic bit-precisions, a hybrid stochastic-binary accumulation approach for vector-matrix multiplication, and the conversion of conventional memory read operations into on-the-fly stochastic multiplication operations with negligible overhead. Thanks to the combination of these approaches, the accuracy analysis of the vector-matrix multiplication benchmark shows that scaling down the stochastic bit-precision from 16-bit to 4-bit achieves nearly the same average error (less than 3%). The derived analytical model of the proposed in-memory stochastic computing architecture demonstrates that the 4-bit stochastic architecture achieves the highest throughput per sub-array (122 Ops/Cycle), which is better than the 16-bit stochastic precision by 4.36x, while still maintaining a small average error of 2.25%

Manifold Learning Side-Channel Attacks against Masked Cryptographic Implementations

Masking, as a common countermeasure, has been widely utilized to protect cryptographic implementations against power side-channel attacks. It significantly enhances the difficulty of attacks, as the sensitive intermediate values are randomly partitioned into multiple parts and executed on different times. The adversary must amalgamate information across diverse time samples before launching an attack, which is generally accomplished by feature extraction (e.g., Points-Of-Interest (POIs) combination and dimensionality reduction). However, traditional POIs combination methods, machine learning and deep learning techniques are often too time consuming, and necessitate a significant amount of computational resources. In this paper, we undertake the first study on manifold learning and their applications against masked cryptographic implementations. The leaked information, which manifests as the manifold of high-dimensional power traces, is mapped into a low-dimensional space and achieves feature extraction through manifold learning techniques like ISOMAP, Locally Linear Embedding (LLE), and Laplacian Eigenmaps (LE). Moreover, to reduce the complexity, we further construct explicit polynomial mappings for manifold learning to facilitate the dimensionality reduction. Compared to the classical machine learning and deep learning techniques, our schemes built from manifold learning techniques are faster, unsupervised, and only require very simple parameter tuning. Their effectiveness has been fully validated by our detailed experiments

Assessing the effectiveness of different test approaches for power devices in a PCB

Power electronic systems employing Printed Circuit Boards (PCBs) are broadly used in many applications, including some safety-critical ones. Several standards (e.g., ISO26262 for the automotive sector and DO-178 for avionics) mandate the adoption of effective test procedures for all electronic systems. However, the metrics to be used to compute the effectiveness of the adopted test procedures are not so clearly defined for power devices and systems. In the last years, some commercial fault simulation tools (e.g., DefectSim by Mentor Graphics and TestMAX by Synopsys) for analog circuits have been introduced, together with some new fault models. With these new tools, systematic analog fault simulation finally became practically feasible. The aim of this paper is twofold: first, we propose a method to extend the usage of the new analog fault models to power devices, thus allowing to compute a Fault Coverage figure for a given test. Secondly, we adopt the method on a case study, for which we quantitatively evaluate the effectiveness of some test procedures commonly used at the PCB level for the detection of faults inside power devices. A typical Power Supply Unit (PSU) used in industrial products, including power transistors and power diodes, is considered. The analysis of the gathered results shows that using the new method we can identify the main points of strength / weakness of the different test solutions in a quantitative and deterministic manner, and pinpoint the faults escaping to each one